Chrystelle Lagahe Blanchard

Person

Crolles, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Method of bonding by molecular bonding
- Patent number 8,927,320
- Issue date Jan 6, 2015
- Soitec
- Chrystelle Lagahe Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for trimming a structure obtained by the assembly of two plates
- Patent number 8,628,674
- Issue date Jan 14, 2014
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Marc Zussy
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods of making substrate structures having a weakened intermedia...
- Patent number 8,475,693
- Issue date Jul 2, 2013
- Soitec
- Michel Bruel
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for trimming a structure obtained by the assembly of two plates
- Patent number 8,329,048
- Issue date Dec 11, 2012
- Commissariat a l'Energie Atomique
- Marc Zussy
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Annealing process for annealing a structure
- Patent number 8,158,487
- Issue date Apr 17, 2012
- Soitec
- Nicolas Sousbie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing partial SOI structures comprising zones connec...
- Patent number 8,044,465
- Issue date Oct 25, 2011
- S.O.I.TEC Solicon On Insulator Technologies
- Bernard Aspar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming a detachable substrate including implantation an...
- Patent number 7,927,980
- Issue date Apr 19, 2011
- Commissariat a l'Energie Atomique
- Aurélie Tauzin
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for transferring wafers
- Patent number 7,807,482
- Issue date Oct 5, 2010
- S.O.I. Tec Silicon on Insulator Technologies
- Bernard Aspar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing partial SOI structures comprising zones connec...
- Patent number 7,709,305
- Issue date May 4, 2010
- Tracit Technologies
- Bernard Aspar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate layer cutting device and method
- Patent number 7,406,994
- Issue date Aug 5, 2008
- S.O.I. Tec Silicon on Insulator Technologies
- Muriel Martinez
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Substrate layer cutting device and method
- Patent number 7,189,304
- Issue date Mar 13, 2007
- S.O.I.Tec Silicon on Insulator Technologies S.A.
- Muriel Martinez
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR TRIMMING A STRUCTURE OBTAINED BY THE ASSEMBLY OF TWO PLATES
- Publication number 20130078785
- Publication date Mar 28, 2013
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Marc Zussy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MAKING SUBSTRATE STRUCTURES HAVING A WEAKENED INTERMEDIA...
- Publication number 20110250416
- Publication date Oct 13, 2011
- Michel Bruel
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR PRODUCING PARTIAL SOI STRUCTURES COMPRISING ZONES CONNEC...
- Publication number 20100176397
- Publication date Jul 15, 2010
- TRACIT TECHNOLOGIES
- Bernard ASPAR
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Making a Plate-Like Detachable Structure, in Particular...
- Publication number 20090301995
- Publication date Dec 10, 2009
- TRACIT TECHNOLOGIES
- Bernard Aspar
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR MAKING A DISMOUNTABLE SUBSTRATE
- Publication number 20090149005
- Publication date Jun 11, 2009
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Aurelie Tauzin
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR TRIMMING A STRUCTURE OBTAINED BY THE ASSEMBLY OF TWO PLATES
- Publication number 20090095399
- Publication date Apr 16, 2009
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Marc Zussy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Transferring Wafers
- Publication number 20080254596
- Publication date Oct 16, 2008
- TRACIT TECHNOLOGIES
- Bernard Aspar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING PARTIAL SOI STRUCTURES COMPRISING ZONES CONNEC...
- Publication number 20070200144
- Publication date Aug 30, 2007
- TRACIT TECHNOLOGIES
- Bernard ASPAR
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUBSTRATE LAYER CUTTING DEVICE AND METHOD
- Publication number 20070122926
- Publication date May 31, 2007
- S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES S.A.
- Muriel Martinez
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method for preparing and assembling substrates
- Publication number 20070072393
- Publication date Mar 29, 2007
- TRACIT TECHNOLOGIES
- Bernard Aspar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate layer cutting device and method
- Publication number 20040144487
- Publication date Jul 29, 2004
- Muriel Martinez
- B28 - WORKING CEMENT, CLAY, OR STONE

Chrystelle Lagahe Blanchard

Person

Patents Grantslast 30 patents

Method of bonding by molecular bonding

Method for trimming a structure obtained by the assembly of two plates

Methods of making substrate structures having a weakened intermedia...

Method for trimming a structure obtained by the assembly of two plates

Annealing process for annealing a structure

Method for producing partial SOI structures comprising zones connec...

Method for forming a detachable substrate including implantation an...

Method for transferring wafers

Method for producing partial SOI structures comprising zones connec...

Substrate layer cutting device and method

Substrate layer cutting device and method

Patents Applicationslast 30 patents

METHOD FOR TRIMMING A STRUCTURE OBTAINED BY THE ASSEMBLY OF TWO PLATES

METHODS OF MAKING SUBSTRATE STRUCTURES HAVING A WEAKENED INTERMEDIA...

METHOD FOR PRODUCING PARTIAL SOI STRUCTURES COMPRISING ZONES CONNEC...

Method for Making a Plate-Like Detachable Structure, in Particular...

METHOD FOR MAKING A DISMOUNTABLE SUBSTRATE

METHOD FOR TRIMMING A STRUCTURE OBTAINED BY THE ASSEMBLY OF TWO PLATES

Method for Transferring Wafers

METHOD FOR PRODUCING PARTIAL SOI STRUCTURES COMPRISING ZONES CONNEC...

SUBSTRATE LAYER CUTTING DEVICE AND METHOD

Method for preparing and assembling substrates

Substrate layer cutting device and method