Chu-Chung Lee

Person

Round Rock, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Surface finish for wirebonding
- Patent number 10,325,876
- Issue date Jun 18, 2019
- NXP USA, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper ball bond features and structure
- Patent number 9,461,012
- Issue date Oct 4, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum clad copper structure of an electronic component package a...
- Patent number 9,437,459
- Issue date Sep 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and method for forming same
- Patent number 9,437,574
- Issue date Sep 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Tu-Anh N. Tran
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Coated bonding wire and methods for bonding using same
- Patent number 9,368,470
- Issue date Jun 14, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with voltage distributor
- Patent number 9,331,046
- Issue date May 3, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized alloying for improved bond reliability
- Patent number 9,331,050
- Issue date May 3, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for reducing corrosion in wire bonds
- Patent number 9,324,675
- Issue date Apr 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper ball bond interface structure and formation
- Patent number 9,257,403
- Issue date Feb 9, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulant for a semiconductor device
- Patent number 9,093,383
- Issue date Jul 28, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Sheila F. Chopin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Packaged integrated circuit using wire bonds
- Patent number 8,912,667
- Issue date Dec 16, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Robert J. Wenzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper ball bond features and structure
- Patent number 8,907,485
- Issue date Dec 9, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulant for a semiconductor device
- Patent number 8,853,867
- Issue date Oct 7, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with voltage distributor
- Patent number 8,791,582
- Issue date Jul 29, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulant for a semiconductor device
- Patent number 8,643,197
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Sheila F. Chopin
Information Patent Grant
Molded semiconductor package having a filler material
- Patent number 8,318,549
- Issue date Nov 27, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power lead-on-chip ball grid array package
- Patent number 8,129,226
- Issue date Mar 6, 2012
- FREESCALE SEMICONDUCTOR, INC.
- James P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized alloying for improved bond reliability
- Patent number 8,105,933
- Issue date Jan 31, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect for chip level power distribution
- Patent number 7,829,997
- Issue date Nov 9, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package device having crack arrest feature and method of forming
- Patent number 7,821,104
- Issue date Oct 26, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit
- Patent number 7,750,465
- Issue date Jul 6, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cap layer for an aluminum copper bond pad
- Patent number 7,656,045
- Issue date Feb 2, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging semiconductor devices
- Patent number 7,632,715
- Issue date Dec 15, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit with enhanced thermal dissipation
- Patent number 7,572,680
- Issue date Aug 11, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect for improved die to substrate electrical coupling
- Patent number 7,550,318
- Issue date Jun 23, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die edge reconditioning
- Patent number 7,374,971
- Issue date May 20, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced molded package for semiconductors
- Patent number 7,361,985
- Issue date Apr 22, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit with enhanced thermal dissipation
- Patent number 7,355,289
- Issue date Apr 8, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with crossing conductor assembly and method o...
- Patent number 7,256,488
- Issue date Aug 14, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with crossing conductor assembly and method o...
- Patent number 7,049,694
- Issue date May 23, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH RESIN BLEED CONTROL STRUCTURE AND METHOD...
- Publication number 20240112989
- Publication date Apr 4, 2024
- NXP USA, Inc.
- Trent Uehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED BONDING WIRE AND METHODS FOR BONDING USING SAME
- Publication number 20160126208
- Publication date May 5, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISH FOR WIREBONDING
- Publication number 20150380376
- Publication date Dec 31, 2015
- VARUGHESE MATHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM CLAD COPPER STRUCTURE OF AN ELECTRONIC COMPONENT PACKAGE
- Publication number 20150318240
- Publication date Nov 5, 2015
- FREESCALE SEMICONDUCTOR, INC.
- BURTON J. CARPENTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR REDUCING CORROSION IN WIRE BONDS
- Publication number 20150311173
- Publication date Oct 29, 2015
- BURTON J. CARPENTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR MULTIPLE BALL BOND STRUCTURES
- Publication number 20150303169
- Publication date Oct 22, 2015
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Ball Bond Interface Structure and Formation
- Publication number 20150145148
- Publication date May 28, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND METHOD FOR FORMING SAME
- Publication number 20150090480
- Publication date Apr 2, 2015
- TU-ANH N. TRAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Copper Ball Bond Features and Structure
- Publication number 20150084199
- Publication date Mar 26, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH VOLTAGE DISTRIBUTOR
- Publication number 20140308779
- Publication date Oct 16, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Chu-Chung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULANT FOR A SEMICONDUCTOR DEVICE
- Publication number 20140145339
- Publication date May 29, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Sheila F. CHOPIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURES AND METHODS FOR COPPER BOND PADS
- Publication number 20140061910
- Publication date Mar 6, 2014
- CHU-CHUNG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Ball Bond Features and Structure
- Publication number 20140054781
- Publication date Feb 27, 2014
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT USING WIRE BONDS
- Publication number 20130193589
- Publication date Aug 1, 2013
- ROBERT J. WENZEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED ALLOYING FOR IMPROVED BOND RELIABILITY
- Publication number 20120153464
- Publication date Jun 21, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH VOLTAGE DISTRIBUTOR
- Publication number 20120025401
- Publication date Feb 2, 2012
- CHU-CHUNG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE HAVING A FILLER MATERIAL
- Publication number 20110101517
- Publication date May 5, 2011
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Lead-on-Chip Ball Grid Array Package
- Publication number 20100270663
- Publication date Oct 28, 2010
- FREESCALE SEMICONDUCTOR, INC.
- James P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE HAVING CRACK ARREST FEATURE AND METHOD OF FORMING
- Publication number 20100052106
- Publication date Mar 4, 2010
- Chu-Chung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel interconnect for chip level power distribution
- Publication number 20080246165
- Publication date Oct 9, 2008
- Freescale Semiconductor, Inc.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT
- Publication number 20080203588
- Publication date Aug 28, 2008
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED ALLOYING FOR IMPROVED BOND RELIABILITY
- Publication number 20080179745
- Publication date Jul 31, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20080164593
- Publication date Jul 10, 2008
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT WITH ENHANCED THERMAL DISSIPATION
- Publication number 20080136016
- Publication date Jun 12, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect for improved die to substrate electrical coupling
- Publication number 20080038912
- Publication date Feb 14, 2008
- Freescale Semiconductor, Inc.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cap layer for an aluminum copper bond pad
- Publication number 20070194460
- Publication date Aug 23, 2007
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die having a protective periphery region and method f...
- Publication number 20070087067
- Publication date Apr 19, 2007
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged integrated circuit with enhanced thermal dissipation
- Publication number 20070023880
- Publication date Feb 1, 2007
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die edge reconditioning
- Publication number 20060237850
- Publication date Oct 26, 2006
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with crossing conductor assembly and method o...
- Publication number 20060163716
- Publication date Jul 27, 2006
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS

Chu-Chung Lee

Person

Patents Grantslast 30 patents

Surface finish for wirebonding

Copper ball bond features and structure

Aluminum clad copper structure of an electronic component package a...

Electronic component package and method for forming same

Coated bonding wire and methods for bonding using same

Integrated circuit package with voltage distributor

Localized alloying for improved bond reliability

Structures for reducing corrosion in wire bonds

Copper ball bond interface structure and formation

Encapsulant for a semiconductor device

Packaged integrated circuit using wire bonds

Copper ball bond features and structure

Encapsulant for a semiconductor device

Integrated circuit package with voltage distributor

Encapsulant for a semiconductor device

Molded semiconductor package having a filler material

Power lead-on-chip ball grid array package

Localized alloying for improved bond reliability

Interconnect for chip level power distribution

Package device having crack arrest feature and method of forming

Packaged integrated circuit

Cap layer for an aluminum copper bond pad

Method of packaging semiconductor devices

Packaged integrated circuit with enhanced thermal dissipation

Interconnect for improved die to substrate electrical coupling

Semiconductor die edge reconditioning

Thermally enhanced molded package for semiconductors

Packaged integrated circuit with enhanced thermal dissipation

Semiconductor package with crossing conductor assembly and method o...

Semiconductor package with crossing conductor assembly and method o...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH RESIN BLEED CONTROL STRUCTURE AND METHOD...

COATED BONDING WIRE AND METHODS FOR BONDING USING SAME

SURFACE FINISH FOR WIREBONDING

ALUMINUM CLAD COPPER STRUCTURE OF AN ELECTRONIC COMPONENT PACKAGE

STRUCTURES AND METHODS FOR REDUCING CORROSION IN WIRE BONDS

SYSTEMS AND METHODS FOR MULTIPLE BALL BOND STRUCTURES

Copper Ball Bond Interface Structure and Formation

ELECTRONIC COMPONENT PACKAGE AND METHOD FOR FORMING SAME

Copper Ball Bond Features and Structure

INTEGRATED CIRCUIT PACKAGE WITH VOLTAGE DISTRIBUTOR

ENCAPSULANT FOR A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE STRUCTURES AND METHODS FOR COPPER BOND PADS

Copper Ball Bond Features and Structure

PACKAGED INTEGRATED CIRCUIT USING WIRE BONDS

LOCALIZED ALLOYING FOR IMPROVED BOND RELIABILITY

INTEGRATED CIRCUIT PACKAGE WITH VOLTAGE DISTRIBUTOR

MOLDED SEMICONDUCTOR PACKAGE HAVING A FILLER MATERIAL

Power Lead-on-Chip Ball Grid Array Package

PACKAGE DEVICE HAVING CRACK ARREST FEATURE AND METHOD OF FORMING

Novel interconnect for chip level power distribution

PACKAGED INTEGRATED CIRCUIT

LOCALIZED ALLOYING FOR IMPROVED BOND RELIABILITY

METHOD OF PACKAGING SEMICONDUCTOR DEVICES

PACKAGED INTEGRATED CIRCUIT WITH ENHANCED THERMAL DISSIPATION

Interconnect for improved die to substrate electrical coupling

Cap layer for an aluminum copper bond pad

Semiconductor die having a protective periphery region and method f...

Packaged integrated circuit with enhanced thermal dissipation

Semiconductor die edge reconditioning

Semiconductor package with crossing conductor assembly and method o...