Chua Swee Kwang

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Method for packaging circuits
- Patent number 10,811,278
- Issue date Oct 20, 2020
- Micron Technology, Inc.
- Chia Y. Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging circuits
- Patent number 10,453,704
- Issue date Oct 22, 2019
- Micron Technology, Inc.
- Chia Y. Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor dies with recesses, associated leadframes, and associ...
- Patent number 10,431,531
- Issue date Oct 1, 2019
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor dies with recesses, associated leadframes, and associ...
- Patent number 10,074,599
- Issue date Sep 11, 2018
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor dies with recesses, associated leadframes, and associ...
- Patent number 9,679,834
- Issue date Jun 13, 2017
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging circuits
- Patent number 9,484,225
- Issue date Nov 1, 2016
- Micron Technology, Inc.
- Chia Y. Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package having discrete components
- Patent number 8,174,105
- Issue date May 8, 2012
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for packaging circuits
- Patent number 8,138,617
- Issue date Mar 20, 2012
- Round Rock Research, LLC
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 8,008,126
- Issue date Aug 30, 2011
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having discrete components and system contain...
- Patent number 7,964,946
- Issue date Jun 21, 2011
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor packages with discrete components
- Patent number 7,807,502
- Issue date Oct 5, 2010
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having die with recess and discrete component...
- Patent number 7,723,831
- Issue date May 25, 2010
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,679,179
- Issue date Mar 16, 2010
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for packaging circuits
- Patent number 7,675,169
- Issue date Mar 9, 2010
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,528,477
- Issue date May 5, 2009
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating packaged die
- Patent number 7,358,154
- Issue date Apr 15, 2008
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support elements for semiconductor devices with peripherally locate...
- Patent number 7,285,850
- Issue date Oct 23, 2007
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,276,387
- Issue date Oct 2, 2007
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor device components with peri...
- Patent number 7,226,809
- Issue date Jun 5, 2007
- Micron Technology, Inc.
- Chia Yong Poo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices including peripherally located bond pads, int...
- Patent number 7,115,984
- Issue date Oct 3, 2006
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 6,949,407
- Issue date Sep 27, 2005
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for packaging circuits
- Patent number 6,894,386
- Issue date May 17, 2005
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 6,855,572
- Issue date Feb 15, 2005
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor device components with peri...
- Patent number 6,818,977
- Issue date Nov 16, 2004
- Micron Technology, Inc.
- Chia Yong Poo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices including peripherally located bond pads, ass...
- Patent number 6,727,116
- Issue date Apr 27, 2004
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level stackable semiconductor package
- Patent number 6,611,052
- Issue date Aug 26, 2003
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable semiconductor package and wafer level fabrication method
- Patent number 6,582,992
- Issue date Jun 24, 2003
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PACKAGING CIRCUITS
- Publication number 20190362988
- Publication date Nov 28, 2019
- Micron Technology, Inc.
- Chia Y. Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCI...
- Publication number 20180350730
- Publication date Dec 6, 2018
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCI...
- Publication number 20170278775
- Publication date Sep 28, 2017
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING CIRCUITS
- Publication number 20170047231
- Publication date Feb 16, 2017
- Micron Technology, Inc.
- Chia Y. Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCI...
- Publication number 20160247749
- Publication date Aug 25, 2016
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING CIRCUITS
- Publication number 20140045280
- Publication date Feb 13, 2014
- Micron Technology, Inc.
- Chia Y. Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Package Having Discrete Components
- Publication number 20110215438
- Publication date Sep 8, 2011
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUCH ASSEMBLIES
- Publication number 20110175206
- Publication date Jul 21, 2011
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having Discrete Components And System Contain...
- Publication number 20110012253
- Publication date Jan 20, 2011
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGES WITH DISCRETE COMPONENTS
- Publication number 20100203677
- Publication date Aug 12, 2010
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUCH ASSEMBLIES
- Publication number 20100133662
- Publication date Jun 3, 2010
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASTELLATION WAFER LEVEL PACKAGING OF INTEGRATED CIRCUIT CHIPS
- Publication number 20100068851
- Publication date Mar 18, 2010
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUCH ASSEMBLIES
- Publication number 20090057843
- Publication date Mar 5, 2009
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SEMICONDUCTOR DIE PACKAGES AND ASSOCIATED SYSTEMS AND METHODS
- Publication number 20090026593
- Publication date Jan 29, 2009
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCI...
- Publication number 20090026592
- Publication date Jan 29, 2009
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages And Method For Fabricating Semiconductor Pac...
- Publication number 20080284003
- Publication date Nov 20, 2008
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASTELLATION WAFER LEVEL PACKAGING OF INTEGRATED CIRCUIT CHIPS
- Publication number 20080067675
- Publication date Mar 20, 2008
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PACKAGING CIRCUITS
- Publication number 20080054423
- Publication date Mar 6, 2008
- Micron Technology, Inc.
- Chia Y. Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices including peripherally located bond pads, int...
- Publication number 20060208351
- Publication date Sep 21, 2006
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Support elements for semiconductor devices with peripherally locate...
- Publication number 20060208350
- Publication date Sep 21, 2006
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for packaging circuits
- Publication number 20060084240
- Publication date Apr 20, 2006
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Castellation wafer level packaging of integrated circuit chips
- Publication number 20060014319
- Publication date Jan 19, 2006
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Castellation wafer level packaging of integrated circuit chips
- Publication number 20060008946
- Publication date Jan 12, 2006
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Castellation wafer level packaging of integrated circuit chips
- Publication number 20060006519
- Publication date Jan 12, 2006
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Castellation wafer level packaging of integrated circuit chips
- Publication number 20060001142
- Publication date Jan 5, 2006
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASTELLATION WAFER LEVEL PACKAGING OF INTEGRATED CIRCUIT CHIPS
- Publication number 20050130345
- Publication date Jun 16, 2005
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for packaging circuits
- Publication number 20050029668
- Publication date Feb 10, 2005
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices including peripherally located bond pads, int...
- Publication number 20040124523
- Publication date Jul 1, 2004
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Castellation wafer level packaging of integrated circuit chips
- Publication number 20040043535
- Publication date Mar 4, 2004
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices and semiconductor device components with peri...
- Publication number 20030230802
- Publication date Dec 18, 2003
- Chia Yong Poo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Chua Swee Kwang

Person

Patents Grantslast 30 patents

Method for packaging circuits

Method for packaging circuits

Semiconductor dies with recesses, associated leadframes, and associ...

Semiconductor dies with recesses, associated leadframes, and associ...

Semiconductor dies with recesses, associated leadframes, and associ...

Method for packaging circuits

Stacked semiconductor package having discrete components

Apparatus and method for packaging circuits

Castellation wafer level packaging of integrated circuit chips

Semiconductor package having discrete components and system contain...

Method for fabricating semiconductor packages with discrete components

Semiconductor package having die with recess and discrete component...

Castellation wafer level packaging of integrated circuit chips

Apparatus and method for packaging circuits

Castellation wafer level packaging of integrated circuit chips

Method for fabricating packaged die

Support elements for semiconductor devices with peripherally locate...

Castellation wafer level packaging of integrated circuit chips

Semiconductor devices and semiconductor device components with peri...

Semiconductor devices including peripherally located bond pads, int...

Castellation wafer level packaging of integrated circuit chips

Apparatus and method for packaging circuits

Castellation wafer level packaging of integrated circuit chips

Semiconductor devices and semiconductor device components with peri...

Semiconductor devices including peripherally located bond pads, ass...

Wafer level stackable semiconductor package

Stackable semiconductor package and wafer level fabrication method

Patents Applicationslast 30 patents

METHOD FOR PACKAGING CIRCUITS

SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCI...

SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCI...

METHOD FOR PACKAGING CIRCUITS

SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCI...

METHOD FOR PACKAGING CIRCUITS

Stacked Semiconductor Package Having Discrete Components

SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUCH ASSEMBLIES

Semiconductor Package Having Discrete Components And System Contain...

METHOD FOR FABRICATING SEMICONDUCTOR PACKAGES WITH DISCRETE COMPONENTS

SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUCH ASSEMBLIES

CASTELLATION WAFER LEVEL PACKAGING OF INTEGRATED CIRCUIT CHIPS

SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUCH ASSEMBLIES

THIN SEMICONDUCTOR DIE PACKAGES AND ASSOCIATED SYSTEMS AND METHODS

SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCI...

Semiconductor Packages And Method For Fabricating Semiconductor Pac...

CASTELLATION WAFER LEVEL PACKAGING OF INTEGRATED CIRCUIT CHIPS

APPARATUS AND METHOD FOR PACKAGING CIRCUITS

Semiconductor devices including peripherally located bond pads, int...

Support elements for semiconductor devices with peripherally locate...

Apparatus and method for packaging circuits

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

CASTELLATION WAFER LEVEL PACKAGING OF INTEGRATED CIRCUIT CHIPS

Apparatus and method for packaging circuits

Semiconductor devices including peripherally located bond pads, int...

Castellation wafer level packaging of integrated circuit chips

Semiconductor devices and semiconductor device components with peri...