Chuan Cheah

Person

Redondo Beach, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Breakable substrate for semiconductor die
- Patent number 10,204,873
- Issue date Feb 12, 2019
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact high-voltage semiconductor package
- Patent number 10,083,884
- Issue date Sep 25, 2018
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact high-voltage semiconductor package
- Patent number 9,768,087
- Issue date Sep 19, 2017
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked half-bridge package
- Patent number 9,601,418
- Issue date Mar 21, 2017
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked half-bridge package
- Patent number 9,583,477
- Issue date Feb 28, 2017
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with conductive clips
- Patent number 9,520,341
- Issue date Dec 13, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package with a common conductive clip
- Patent number 9,461,022
- Issue date Oct 4, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heat spreader
- Patent number 9,449,899
- Issue date Sep 20, 2016
- Infineon Technologies Americas Corp.
- Michael A. Briere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked half-bridge package with a common leadframe
- Patent number 9,349,677
- Issue date May 24, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-Nitride device with solderable front metal
- Patent number 9,312,375
- Issue date Apr 12, 2016
- Infineon Technologies Americas Corp.
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-nitride rectifier package
- Patent number 9,142,503
- Issue date Sep 22, 2015
- International Rectifier Corporation
- Chuan Cheah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package with conductive heat spreader
- Patent number 9,105,619
- Issue date Aug 11, 2015
- International Rectifier Corporation
- Michael A. Briere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Half-bridge package with a conductive clip
- Patent number 9,048,230
- Issue date Jun 2, 2015
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with multiple conductive clips
- Patent number 8,987,883
- Issue date Mar 24, 2015
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power semiconductor package with conductive clip
- Patent number 8,896,107
- Issue date Nov 25, 2014
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage cascoded III-nitride rectifier package with stamped le...
- Patent number 8,853,706
- Issue date Oct 7, 2014
- International Rectifier Corporation
- Chuan Cheah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power device with solderable front metal
- Patent number 8,853,744
- Issue date Oct 7, 2014
- International Rectifier Corporation
- Chuan Cheah
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
High voltage cascoded III-nitride rectifier package with etched lea...
- Patent number 8,853,707
- Issue date Oct 7, 2014
- International Rectifier Corporation
- Chuan Cheah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Packaging of electronic circuitry
- Patent number 8,811,030
- Issue date Aug 19, 2014
- International Rectifier Corporation
- Timothy Phillips
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage cascoded III-nitride rectifier package
- Patent number 8,790,965
- Issue date Jul 29, 2014
- International Rectifier Corporation
- Chuan Cheah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Interdigitated conductive support for GaN semiconductor die
- Patent number 8,791,560
- Issue date Jul 29, 2014
- International Rectifier Corporation
- Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of electronic circuitry
- Patent number 8,786,068
- Issue date Jul 22, 2014
- International Rectifier Corporation
- Timothy A. Phillips
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power semiconductor package with conductive clip and flip chip...
- Patent number 8,749,034
- Issue date Jun 10, 2014
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked half-bridge package with a common conductive clip
- Patent number 8,680,627
- Issue date Mar 25, 2014
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked half-bridge package with a current carrying layer
- Patent number 8,674,497
- Issue date Mar 18, 2014
- International Business Machines Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power semiconductor package with multiple conductive clips
- Patent number 8,664,754
- Issue date Mar 4, 2014
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor multichip module package with improved thermal perfor...
- Patent number 8,629,566
- Issue date Jan 14, 2014
- International Rectifier Corporation
- Bharat Shivkumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,564,124
- Issue date Oct 22, 2013
- International Rectifier Corporation
- Michael A. Briere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage cascoded III-nitride rectifier package utilizing clips...
- Patent number 8,546,849
- Issue date Oct 1, 2013
- International Rectifier Corporation
- Chuan Cheah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High power semiconductor package with conductive clips and flip chi...
- Patent number 8,497,574
- Issue date Jul 30, 2013
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Bond Pad and Clip Configuration for Packaged Semiconductor Device
- Publication number 20190371711
- Publication date Dec 5, 2019
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BREAKABLE SUBSTRATE FOR SEMICONDUCTOR DIE
- Publication number 20180323156
- Publication date Nov 8, 2018
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT HIGH-VOLTAGE SEMICONDUCTOR PACKAGE
- Publication number 20170365533
- Publication date Dec 21, 2017
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Half-Bridge Package
- Publication number 20160260697
- Publication date Sep 8, 2016
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
III-Nitride Transistor with Solderable Front Metal
- Publication number 20160211337
- Publication date Jul 21, 2016
- Infineon Technologies Americas Corp.
- Chuan Cheah
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Compact High-Voltage Semiconductor Package
- Publication number 20160104697
- Publication date Apr 14, 2016
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insertable Power Unit with Mounting Contacts for Plugging into a Mo...
- Publication number 20160105983
- Publication date Apr 14, 2016
- International Rectifier Corporation
- Eung San Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Unit with Conductive Slats
- Publication number 20160105984
- Publication date Apr 14, 2016
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package with a Common Conductive Clip
- Publication number 20150279821
- Publication date Oct 1, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Conductive Clips
- Publication number 20150194369
- Publication date Jul 9, 2015
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
III-NITRIDE Device with Solderable Front Metal
- Publication number 20150014703
- Publication date Jan 15, 2015
- International Rectifier Corporation
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
III-Nitride Rectifier Package
- Publication number 20140327014
- Publication date Nov 6, 2014
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Half-Bridge Package with a Conductive Clip
- Publication number 20140203419
- Publication date Jul 24, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Half-Bridge Package
- Publication number 20140191337
- Publication date Jul 10, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Multiple Conductive Clips
- Publication number 20140175630
- Publication date Jun 26, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Heat Spreader
- Publication number 20140084431
- Publication date Mar 27, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Michael A. Briere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Voltage Cascoded III-Nitride Rectifier Package
- Publication number 20140030854
- Publication date Jan 30, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Half-Bridge Package with a Common Leadframe
- Publication number 20130228794
- Publication date Sep 5, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Device with Solderable Front Metal
- Publication number 20130207120
- Publication date Aug 15, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Chuan Cheah
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Semiconductor Package with Conductive Heat Spreader
- Publication number 20130161803
- Publication date Jun 27, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Michael A. Briere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Voltage Cascoded III-Nitride Rectifier Package with Stamped Le...
- Publication number 20120280245
- Publication date Nov 8, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Chuan Cheah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
High Voltage Cascoded III-Nitride Rectifier Package with Etched Lea...
- Publication number 20120280246
- Publication date Nov 8, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Chuan Cheah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
High Voltage Cascoded III-Nitride Rectifier Package Utilizing Clips...
- Publication number 20120280247
- Publication date Nov 8, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Chuan Cheah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Stacked Half-Bridge Package with a Current Carrying Layer
- Publication number 20120181681
- Publication date Jul 19, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Half-Bridge Package with a Common Conductive Leadframe
- Publication number 20120181674
- Publication date Jul 19, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Half-Bridge Package with a Common Conductive Clip
- Publication number 20120181624
- Publication date Jul 19, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Semiconductor Package with Conductive Clip
- Publication number 20120168922
- Publication date Jul 5, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Semiconductor Package with Conductive Clip on Multiple T...
- Publication number 20120168923
- Publication date Jul 5, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Semiconductor Package with Conductive Clips and Flip Chi...
- Publication number 20120168925
- Publication date Jul 5, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Semiconductor Package with Conductive Clip and Flip Chip...
- Publication number 20120168926
- Publication date Jul 5, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS

Chuan Cheah

Person

Patents Grantslast 30 patents

Breakable substrate for semiconductor die

Compact high-voltage semiconductor package

Compact high-voltage semiconductor package

Stacked half-bridge package

Stacked half-bridge package

Semiconductor package with conductive clips

Power semiconductor package with a common conductive clip

Semiconductor package with heat spreader

Stacked half-bridge package with a common leadframe

III-Nitride device with solderable front metal

III-nitride rectifier package

Semiconductor package with conductive heat spreader

Half-bridge package with a conductive clip

Semiconductor package with multiple conductive clips

High power semiconductor package with conductive clip

High voltage cascoded III-nitride rectifier package with stamped le...

Power device with solderable front metal

High voltage cascoded III-nitride rectifier package with etched lea...

Packaging of electronic circuitry

High voltage cascoded III-nitride rectifier package

Interdigitated conductive support for GaN semiconductor die

Packaging of electronic circuitry

High power semiconductor package with conductive clip and flip chip...

Stacked half-bridge package with a common conductive clip

Stacked half-bridge package with a current carrying layer

High power semiconductor package with multiple conductive clips

Semiconductor multichip module package with improved thermal perfor...

Semiconductor package

High voltage cascoded III-nitride rectifier package utilizing clips...

High power semiconductor package with conductive clips and flip chi...

Patents Applicationslast 30 patents

Bond Pad and Clip Configuration for Packaged Semiconductor Device

BREAKABLE SUBSTRATE FOR SEMICONDUCTOR DIE

COMPACT HIGH-VOLTAGE SEMICONDUCTOR PACKAGE

Stacked Half-Bridge Package

III-Nitride Transistor with Solderable Front Metal

Compact High-Voltage Semiconductor Package

Insertable Power Unit with Mounting Contacts for Plugging into a Mo...

Power Unit with Conductive Slats

Power Semiconductor Package with a Common Conductive Clip

Semiconductor Package with Conductive Clips

III-NITRIDE Device with Solderable Front Metal

III-Nitride Rectifier Package

Half-Bridge Package with a Conductive Clip

Stacked Half-Bridge Package

Semiconductor Package with Multiple Conductive Clips

Semiconductor Package with Heat Spreader

High Voltage Cascoded III-Nitride Rectifier Package

Stacked Half-Bridge Package with a Common Leadframe

Power Device with Solderable Front Metal

Semiconductor Package with Conductive Heat Spreader

High Voltage Cascoded III-Nitride Rectifier Package with Stamped Le...

High Voltage Cascoded III-Nitride Rectifier Package with Etched Lea...

High Voltage Cascoded III-Nitride Rectifier Package Utilizing Clips...

Stacked Half-Bridge Package with a Current Carrying Layer

Stacked Half-Bridge Package with a Common Conductive Leadframe

Stacked Half-Bridge Package with a Common Conductive Clip

High Power Semiconductor Package with Conductive Clip

High Power Semiconductor Package with Conductive Clip on Multiple T...

High Power Semiconductor Package with Conductive Clips and Flip Chi...

High Power Semiconductor Package with Conductive Clip and Flip Chip...