Chun-Cheng Tsao

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Optical coupling apparatus for a dual column charged particle beam...
- Patent number 8,173,948
- Issue date May 8, 2012
- DCG Systems, Inc.
- Chun-Cheng Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for optical interference fringe based integrat...
- Patent number 7,884,024
- Issue date Feb 8, 2011
- DCG Systems, Inc.
- Erwan Le Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for optical interference fringe based integrat...
- Patent number 7,697,146
- Issue date Apr 13, 2010
- DCG Systems, Inc.
- Erwan Le Roy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical coupling apparatus for a dual column charged particle beam...
- Patent number 7,612,321
- Issue date Nov 3, 2009
- DCG Systems, Inc.
- Chun-Cheng Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method of forming silicide in a localized manner
- Patent number 7,439,168
- Issue date Oct 21, 2008
- DCG Systems, Inc.
- Christian Boit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of photon emission microscope and focused ion beam
- Patent number 7,245,133
- Issue date Jul 17, 2007
- Credence Systems Corporation
- Chun-Cheng Tsao
- G01 - MEASURING TESTING
Information Patent Grant
Imaging integrated circuits with focused ion beam
- Patent number 7,036,109
- Issue date Apr 25, 2006
- Credence Systems Corporation
- Chun-Cheng Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for determining thickness of a semiconductor substrate at th...
- Patent number 6,955,930
- Issue date Oct 18, 2005
- Credence Systems Corporation
- Erwan Le Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for global die thinning and polishing of flip-...
- Patent number 6,939,209
- Issue date Sep 6, 2005
- Credence Systems Corporation
- Chun-Cheng Tsao
- B24 - GRINDING POLISHING
Information Patent Grant
Measuring back-side voltage of an integrated circuit
- Patent number 6,872,581
- Issue date Mar 29, 2005
- NPTest, Inc.
- Christopher Shaw
- G01 - MEASURING TESTING
Information Patent Grant
Method for global die thinning and polishing of flip-chip packaged...
- Patent number 6,672,947
- Issue date Jan 6, 2004
- NPTest, LLC
- Chun-Cheng Tsao
- B24 - GRINDING POLISHING
Information Patent Grant
Differential pulsed laser beam probing of integrated circuits
- Patent number 6,252,222
- Issue date Jun 26, 2001
- Schlumberger Technologies, Inc.
- Steven A. Kasapi
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL COUPLING APPARATUS FOR A DUAL COLUMN CHARGED PARTICLE BEAM...
- Publication number 20100038555
- Publication date Feb 18, 2010
- DCG SYSTEMS, INC.
- Chun-Cheng TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR OPTICAL INTERFERENCE FRINGE BASED INTEGRAT...
- Publication number 20070293052
- Publication date Dec 20, 2007
- Credence Systems Corporation
- Erwan Le Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for optical interference fringe based integrat...
- Publication number 20060188797
- Publication date Aug 24, 2006
- Credence Systems Corporation
- Erwan Le Roy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optical coupling apparatus for a dual column charged particle beam...
- Publication number 20060076503
- Publication date Apr 13, 2006
- Credence Systems Corporation
- Chun-Cheng Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method of forming silicide in a localized manner
- Publication number 20060079086
- Publication date Apr 13, 2006
- Credence Systems Corporation
- Christian Boit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integration of photon emission microscope and focused ion beam
- Publication number 20060012385
- Publication date Jan 19, 2006
- CREDENCE SYSTEMS CORPORATION
- Chun-Cheng Tsao
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus for determining thickness of a semiconductor s...
- Publication number 20050236583
- Publication date Oct 27, 2005
- Erwan Le Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for global die thinning and polishing of flip-...
- Publication number 20040106358
- Publication date Jun 3, 2004
- Chun-Cheng Tsao
- B24 - GRINDING POLISHING
Information Patent Application
Method for backside die thinning and polishing of packaged integrat...
- Publication number 20040014401
- Publication date Jan 22, 2004
- Chun-Cheng Tsao
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for determining thickness of a semiconductor s...
- Publication number 20030224543
- Publication date Dec 4, 2003
- Schlumberger Technologies, Inc.
- Erwan Le Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for global die thinning and polishing of flip-chip packaged...
- Publication number 20030022603
- Publication date Jan 30, 2003
- Schlumberger Technologies, Inc.
- Chun-Cheng Tsao
- B24 - GRINDING POLISHING
Information Patent Application
Measuring back-side voltage of an integrated circuit
- Publication number 20020151091
- Publication date Oct 17, 2002
- Christopher Shaw
- G01 - MEASURING TESTING

Chun-Cheng Tsao

Person

Patents Grantslast 30 patents

Optical coupling apparatus for a dual column charged particle beam...

Apparatus and method for optical interference fringe based integrat...

Apparatus and method for optical interference fringe based integrat...

Optical coupling apparatus for a dual column charged particle beam...

Apparatus and method of forming silicide in a localized manner

Integration of photon emission microscope and focused ion beam

Imaging integrated circuits with focused ion beam

Method for determining thickness of a semiconductor substrate at th...

Method and apparatus for global die thinning and polishing of flip-...

Measuring back-side voltage of an integrated circuit

Method for global die thinning and polishing of flip-chip packaged...

Differential pulsed laser beam probing of integrated circuits

Patents Applicationslast 30 patents

OPTICAL COUPLING APPARATUS FOR A DUAL COLUMN CHARGED PARTICLE BEAM...

APPARATUS AND METHOD FOR OPTICAL INTERFERENCE FRINGE BASED INTEGRAT...

Apparatus and method for optical interference fringe based integrat...

Optical coupling apparatus for a dual column charged particle beam...

Apparatus and method of forming silicide in a localized manner

Integration of photon emission microscope and focused ion beam

Method and apparatus for determining thickness of a semiconductor s...

Method and apparatus for global die thinning and polishing of flip-...

Method for backside die thinning and polishing of packaged integrat...

Method and apparatus for determining thickness of a semiconductor s...

Method for global die thinning and polishing of flip-chip packaged...

Measuring back-side voltage of an integrated circuit