Chune Lee

Person

San Francisco, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sequential multilayer process for using fluorinated hydrocarbons as...
- Patent number 5,387,495
- Issue date Feb 7, 1995
- Digital Equipment Corporation
- James C. K. Lee
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
System for detachably mounting semiconductors on conductor substrate
- Patent number 5,014,161
- Issue date May 7, 1991
- Digital Equipment Corporation
- James C. K. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector for surface mounting
- Patent number 4,954,873
- Issue date Sep 4, 1990
- Digital Equipment Corporation
- James Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic elastomeric interconnecting system
- Patent number 4,778,950
- Issue date Oct 18, 1988
- Digital Equipment Corporation
- James C. K. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector for surface mounting and method of making thereof
- Patent number 4,754,546
- Issue date Jul 5, 1988
- Digital Equipment Corporation
- James C. K. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating electrical connector for surface mounting
- Patent number 4,729,166
- Issue date Mar 8, 1988
- Digital Equipment Corporation
- James Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting a semiconductor chip
- Patent number 4,577,398
- Issue date Mar 25, 1986
- Trilogy Computer Development Partners, Ltd.
- John W. Sliwa
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Sequential multilayer process for using fluorinated hydrocarbons as...

System for detachably mounting semiconductors on conductor substrate

Electrical connector for surface mounting

Anisotropic elastomeric interconnecting system

Electrical connector for surface mounting and method of making thereof

Method of fabricating electrical connector for surface mounting

Method for mounting a semiconductor chip