Claims
- 1. An electronic assembly comprising alternating component layers and connecting layers, said component layers being rigid structures having at least one planar face with electrical contacts formed thereon and said connecting layers being anisotropic elastomeric conductors positioned between opposed electrical contacts on adjacent component layers, wherein said anisotropic elastomeric conductors are formed by a method comprising:
- forming a stack of first and second sheets so that at least one second sheet lies between adjacent first sheets, wherein said first sheets are metal sheets, each metal sheet forming a plurality of electrical conductive elements, said electrically conductive elements running in one direction only, and said second sheets are composed of electrically insulating material;
- introducing a curable elastomeric resin to the stack;
- curing the elastomeric resin to form a solid matrix having the electrically conductive elements electrically isolated from one another and extending from one side of the block to the opposide side; and
- slicing the matrix in a direction transverse to the direction of the electrically conductive elements to yield said anisotropic elastomeric conductors having the elements extending thereacross.
- 2. An assembly as in claim 1, wherein at least some of the component layers are semiconductor devices.
- 3. An assembly as in claim 1, wherein at least some of the component layers are ceramic substrates.
- 4. An assembly as in claim 1, wherein at least some of the component layers are printed circuit boards.
- 5. A assembly as in claim 1, wherein at least some of the component layers are terminal strips.
- 6. An assembly as in claim 1, wherein said component layers include a plurality of printed circuit boards each carrying a multiplicity of semiconductor devices and having contact regions formed on both faces, said board being stacked with the conductors interposed between adjacent contact regions.
- 7. An assembly as in claim 1, wherein the resin is introduced to the stack by coating the first sheets with said resin.
- 8. An assembly as in claim 1 wherein the maximum width of said electrically conductive elements is 0.005 inches.
- 9. An assembly as in claim 1, wherein the second sheets are continuous elastomeric sheets.
- 10. An assembly as in claim 9, wherein the elastomeric resin and the elastomeric sheets are silicone rubber.
- 11. An assembly as in claim 1 wherein said electrical conductive elements on said first sheets are defined by forming channels therebetween on said first sheets prior to stacking said first and second sheets, and said curable elastomeric resin is introduced into said stack so that it fills said channels between said electrically conductive elements.
- 12. An assembly as in claim 1 wherein the maximum thickness of said first sheets is 0.003 inches.
- 13. An assembly as in claim 12 wherein the maximum width of said electrically conductive elements is 0.005 inches.
Parent Case Info
This application is a continuation-in-part of application Ser. No. 757,600 filed on July 22, 1985 now U.S. Pat. No. 4,729,166.
US Referenced Citations (13)
Non-Patent Literature Citations (2)
| Entry |
| Buchoff, (1980), "Elastomeric Connections . . . ", Microele. Mfg., Oct. |
| Buchoff, (1983), "Surface Mounting . . . ", Electronics, Jun. |
Continuation in Parts (1)
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Number |
Date |
Country |
| Parent |
757600 |
Jul 1985 |
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