Chung-Chuan Tseng

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic package and method of manufacture thereof
- Patent number 9,368,478
- Issue date Jun 14, 2016
- Invensas Corporation
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package and method of manufacture thereof
- Patent number 8,946,901
- Issue date Feb 3, 2015
- Invensas Corporation
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking packages with alignment elements
- Patent number 7,964,947
- Issue date Jun 21, 2011
- Tessera, Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURE THEREOF
- Publication number 20150123293
- Publication date May 7, 2015
- Invensas Corporation
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURE THEREOF
- Publication number 20140203440
- Publication date Jul 24, 2014
- Invensas Corporation
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRANULAR ABRASIVE CLEANING OF AN EMITTER WIRE
- Publication number 20110308773
- Publication date Dec 22, 2011
- Tessera, Inc.
- Guilian Gao
- B03 - SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES O...
Information Patent Application
Alignment and cutting of microelectronic substrates
- Publication number 20080156518
- Publication date Jul 3, 2008
- Tessera, Inc.
- Kenneth Allen Honer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacking packages with alignment elements
- Publication number 20080150114
- Publication date Jun 26, 2008
- Tessera, Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged acoustic and electromagnetic transducer chips
- Publication number 20050189622
- Publication date Sep 1, 2005
- Tessera, Inc.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Packaged acoustic and electromagnetic transducer chips
- Publication number 20050189635
- Publication date Sep 1, 2005
- Tessera, Inc.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Chung-Chuan Tseng

Person

Patents Grantslast 30 patents

Microelectronic package and method of manufacture thereof

Microelectronic package and method of manufacture thereof

Stacking packages with alignment elements

Patents Applicationslast 30 patents

MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURE THEREOF

MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURE THEREOF

GRANULAR ABRASIVE CLEANING OF AN EMITTER WIRE

Alignment and cutting of microelectronic substrates

Stacking packages with alignment elements

Packaged acoustic and electromagnetic transducer chips

Packaged acoustic and electromagnetic transducer chips