Chung-Sung Chiang

Person

Kaohsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Bonded semiconductor structure utilizing concave/convex profile des...
- Patent number 12,243,839
- Issue date Mar 4, 2025
- United Microelectronics Corp.
- Chung-Sung Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming bonded semiconductor structure utilizing concave...
- Patent number 11,935,854
- Issue date Mar 19, 2024
- United Microelectronics Corp.
- Chung-Sung Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor structure utilizing concave/convex profile des...
- Patent number 11,640,949
- Issue date May 2, 2023
- United Microelectronics Corp.
- Chung-Sung Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,332,848
- Issue date Jun 25, 2019
- Advanced Semiconductor Engineering, Inc.
- Chung-Hsin Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device with antenna array
- Patent number 9,984,985
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Chung-Hsin Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 9,859,232
- Issue date Jan 2, 2018
- Advanced Semiconductor Engineering, Inc.
- Chung-Hsin Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure having through silicon v...
- Patent number 8,916,471
- Issue date Dec 23, 2014
- United Microelectronics Corp.
- Ching-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDED SEMICONDUCTOR STRUCTURE UTILIZING CONCAVE/CONVEX PROFILE
- Publication number 20250079363
- Publication date Mar 6, 2025
- UNITED MICROELECTRONICS CORP.
- Chung-Sung Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387418
- Publication date Nov 21, 2024
- UNITED MICROELECTRONICS CORP.
- Yu-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240371758
- Publication date Nov 7, 2024
- UNITED MICROELECTRONICS CORP.
- Yu-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR STRUCTURE UTILIZING CONCAVE/CONVEX PROFILE DES...
- Publication number 20240170423
- Publication date May 23, 2024
- UNITED MICROELECTRONICS CORP.
- Chung-Sung Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING BONDED SEMICONDUCTOR STRUCTURE
- Publication number 20230223366
- Publication date Jul 13, 2023
- UNITED MICROELECTRONICS CORP.
- Chung-Sung Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230008792
- Publication date Jan 12, 2023
- UNITED MICROELECTRONICS CORP.
- Chung-Sung Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180130758
- Publication date May 10, 2018
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Chung-Hsin CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND METHOD OF FABRICATING THE SAME
- Publication number 20150332996
- Publication date Nov 19, 2015
- UNITED MICROELECTRONICS CORP.
- Chien-Li Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Chung-Sung Chiang

Person

Patents Grantslast 30 patents

Bonded semiconductor structure utilizing concave/convex profile des...

Method for forming bonded semiconductor structure utilizing concave...

Bonded semiconductor structure utilizing concave/convex profile des...

Semiconductor package device and method of manufacturing the same

Semiconductor package device with antenna array

Semiconductor package device and method of manufacturing the same

Method for forming semiconductor structure having through silicon v...

Patents Applicationslast 30 patents

BONDED SEMICONDUCTOR STRUCTURE UTILIZING CONCAVE/CONVEX PROFILE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

BONDED SEMICONDUCTOR STRUCTURE UTILIZING CONCAVE/CONVEX PROFILE DES...

METHOD FOR FORMING BONDED SEMICONDUCTOR STRUCTURE

BONDED SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

INTERPOSER AND METHOD OF FABRICATING THE SAME