CHUNG-WEI TSAI

Person

Miao-Li County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,923,315
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,854,928
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory packages and methods of forming same
- Patent number 11,855,046
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly and manufacturing method thereof
- Patent number 11,841,541
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method
- Patent number 11,830,864
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having doped work function metal layer
- Patent number 11,791,338
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hsiung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep partition power delivery with deep trench capacitor
- Patent number 11,784,172
- Issue date Oct 10, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING HSINCHU, CO., LTD.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around device
- Patent number 11,776,998
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-En Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture for computing system package
- Patent number 11,769,731
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,742,219
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,735,576
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,728,327
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for eliminating unstable noise
- Patent number 11,705,102
- Issue date Jul 18, 2023
- Realtek Semiconductor Corp.
- Chung-Hang Tsai
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Through-vias and methods of forming the same
- Patent number 11,682,583
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of manufacturing the same
- Patent number 11,652,014
- Issue date May 16, 2023
- Advanced Semiconductor Engineering, Inc.
- Chung-Yuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing package structure
- Patent number 11,637,097
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ya Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 11,631,768
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huang-Siang Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method
- Patent number 11,605,622
- Issue date Mar 14, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Chieh Chang
- G02 - OPTICS
Information Patent Grant
Germanium tin gate-all-around device
- Patent number 11,600,703
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,587,916
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming thereof
- Patent number 11,562,926
- Issue date Jan 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,495,573
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,488,909
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna device and method for manufacturing antenna device
- Patent number 11,482,788
- Issue date Oct 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,460,633
- Issue date Oct 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chieh Chang
- G02 - OPTICS
Information Patent Grant
Semiconductor structure, package structure, and manufacturing metho...
- Patent number 11,456,251
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including a solenoid inductor laterally aside a d...
- Patent number 11,450,628
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package, package structure with redistributing circuits and antenna...
- Patent number 11,424,197
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,417,698
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Lun Chang
- G02 - OPTICS
Information Patent Grant
Semiconductor device, integrated fan-out package and method of form...
- Patent number 11,410,923
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMMUNICATION RECEIVER USING MULTI-STAGE CHANNEL EQUALIZATION AND A...
- Publication number 20240129167
- Publication date Apr 18, 2024
- MEDIATEK INC.
- Chung-Hsien Tsai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MEMORY PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240105682
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME
- Publication number 20240088033
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Kai Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Memory Device and Method
- Publication number 20240088078
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20240061195
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240063160
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Architecture for Computing System Package
- Publication number 20240038669
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND DEVICE
- Publication number 20230378266
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-En TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deep Partition Power Delivery with Deep Trench Capacitor
- Publication number 20230369302
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DOPED WORK FUNCTION METAL LAYER
- Publication number 20230369331
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsiung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCEMENT MODE HIGH-ELECTRON-MOBILITY TRANSISTOR HAVING N-I-P SEM...
- Publication number 20230352574
- Publication date Nov 2, 2023
- Unikorn Semiconductor Corporation
- Shang-Ju Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20230352471
- Publication date Nov 2, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND ELECTRONIC DEVICE FOR MOTION PREDICTION
- Publication number 20230334838
- Publication date Oct 19, 2023
- MEDIATEK INC.
- Chih-Ming HUNG
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20230314702
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
ERROR DETECTION AND CORRECTION DEVICE CAPABLE OF DETECTING HEAD POS...
- Publication number 20230308322
- Publication date Sep 28, 2023
- MEDIATEK INC.
- Deng-Fu Weng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20230253500
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Huang-Siang LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20230215853
- Publication date Jul 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GERMANIUM TIN GATE-ALL-AROUND DEVICE
- Publication number 20230207634
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shahaji B. MORE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230178530
- Publication date Jun 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR 3DIC POWER DISTRIBUTION
- Publication number 20230154913
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH ALTERNATE COMPLEMENTARY CHANNELS AND FABRICATION METHOD...
- Publication number 20230154923
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ya LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230065844
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230061876
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230062136
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230057702
- Publication date Feb 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-GATE TRANSISTORS AND METHODS OF FORMING THE SAME
- Publication number 20230054243
- Publication date Feb 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20230043512
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, PACKAGE STRUCTURE, AND MANUFACTURING METHO...
- Publication number 20220384332
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20220384382
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DEVICE
- Publication number 20220384958
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chuei-Tang WANG
- H01 - BASIC ELECTRIC ELEMENTS

CHUNG-WEI TSAI

Person

Patents Grantslast 30 patents

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Memory packages and methods of forming same

Package assembly and manufacturing method thereof

Photonic semiconductor device and method

Semiconductor device having doped work function metal layer

Deep partition power delivery with deep trench capacitor

Gate-all-around device

Architecture for computing system package

Integrated fan-out package and manufacturing method thereof

Integrated circuit package and method

Integrated circuit package and method

Method and device for eliminating unstable noise

Through-vias and methods of forming the same

Electronic package and method of manufacturing the same

Method of manufacturing package structure

Semiconductor device and method of manufacturing thereof

Photonic semiconductor device and method

Germanium tin gate-all-around device

Package structure and manufacturing method thereof

Package structure and method of forming thereof

Package structure and manufacturing method thereof

Package structure

Antenna device and method for manufacturing antenna device

Semiconductor package and manufacturing method thereof

Semiconductor structure, package structure, and manufacturing metho...

Package structure including a solenoid inductor laterally aside a d...

Package, package structure with redistributing circuits and antenna...

Semiconductor package and method of forming the same

Semiconductor device, integrated fan-out package and method of form...

Patents Applicationslast 30 patents

COMMUNICATION RECEIVER USING MULTI-STAGE CHANNEL EQUALIZATION AND A...

MEMORY PACKAGES AND METHODS OF FORMING SAME

SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME

Packaged Memory Device and Method

PACKAGE ASSEMBLY AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Architecture for Computing System Package

GATE-ALL-AROUND DEVICE

Deep Partition Power Delivery with Deep Trench Capacitor

SEMICONDUCTOR DEVICE HAVING DOPED WORK FUNCTION METAL LAYER

ENHANCEMENT MODE HIGH-ELECTRON-MOBILITY TRANSISTOR HAVING N-I-P SEM...

INTEGRATED CIRCUIT PACKAGES

METHOD AND ELECTRONIC DEVICE FOR MOTION PREDICTION

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

ERROR DETECTION AND CORRECTION DEVICE CAPABLE OF DETECTING HEAD POS...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

PHOTONIC SEMICONDUCTOR DEVICE AND METHOD

GERMANIUM TIN GATE-ALL-AROUND DEVICE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD AND STRUCTURE FOR 3DIC POWER DISTRIBUTION

DEVICE WITH ALTERNATE COMPLEMENTARY CHANNELS AND FABRICATION METHOD...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MULTI-GATE TRANSISTORS AND METHODS OF FORMING THE SAME

PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURE, PACKAGE STRUCTURE, AND MANUFACTURING METHO...

Integrated Circuit Package and Method

ANTENNA DEVICE