TREA

Chung-Yu Yeh

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  • Taichung City, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Substrate Carrier Unit for a Film Deposition Apparatus
    • Publication number 20160326637
    • Publication date Nov 10, 2016
    • Linco Technology Co., Ltd.
    • Chung-Yu Yeh
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Film Deposition System Having a Substrate Carrier and a Cooling Device
    • Publication number 20160318061
    • Publication date Nov 3, 2016
    • Linco Technology Co., Ltd.
    • Cheng-Peng Yeh
    • B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
  • Information Patent Application

    FLIP-CHIP PROCESS BY PHOTO-CURING ADHESIVE
    • Publication number 20090286355
    • Publication date Nov 19, 2009
    • Lingsen Precision Industries, Ltd.
    • Chung-Mao YEH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IC PACKAGE HAVING REDUCED THICKNESS
    • Publication number 20090236712
    • Publication date Sep 24, 2009
    • Lingsen Precision Industries, Ltd.
    • Chung-Mao YEH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF STACKING DIES FOR DIE STACK PACKAGE
    • Publication number 20090239339
    • Publication date Sep 24, 2009
    • Lingsen Precision Industries, Ltd.
    • Chung-Mao YEH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IC PACKAGING PROCESS
    • Publication number 20090239341
    • Publication date Sep 24, 2009
    • Lingsen Precision Industries, Ltd.
    • Chung-Mao YEH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IC PACKAGING PROCESS BY PHOTO-CURING ADHESIVE
    • Publication number 20090186450
    • Publication date Jul 23, 2009
    • Lingsen Precision Industries, Ltd.
    • Chung-Mao YEH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF ARRANGING STACKED CHIP BY PHOTO-CURING ADHESIVE
    • Publication number 20090178758
    • Publication date Jul 16, 2009
    • Lingsen Precision Industries, Ltd.
    • Chung-Mao Yeh
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    IC PACKAGING PROCESS
    • Publication number 20090181499
    • Publication date Jul 16, 2009
    • Lingsen Precision Industries, Ltd.
    • Chung-Mao YEH
    • H01 - BASIC ELECTRIC ELEMENTS