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Chungsun Lee
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Anyang-City, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor packages having first and second redistribution patterns
Patent number
11,996,358
Issue date
May 28, 2024
Samsung Electronics Co., Ltd.
Ju-Il Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including fine redistribution patterns
Patent number
11,923,309
Issue date
Mar 5, 2024
Samsung Electronics Co., Ltd.
Hyunsu Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor package
Patent number
11,854,893
Issue date
Dec 26, 2023
Samsung Electronics Co., Ltd.
Junyun Kweon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including an image sensor chip and a method o...
Patent number
11,824,076
Issue date
Nov 21, 2023
Samsung Electronics Co., Ltd.
Yonghoe Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer trimming device
Patent number
11,705,323
Issue date
Jul 18, 2023
Samsung Electronics Co., Ltd.
Jungseok Ahn
B24 - GRINDING POLISHING
Information
Patent Grant
Interconnection structure, method of fabricating the same, and semi...
Patent number
11,688,679
Issue date
Jun 27, 2023
Samsung Electronics Co., Ltd.
Ji-Seok Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and semiconductor package including the same
Patent number
11,664,312
Issue date
May 30, 2023
Samsung Electronics Co., Ltd.
Ju-Il Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnection structure and semiconductor package including the same
Patent number
11,637,058
Issue date
Apr 25, 2023
Samsung Electronics Co., Ltd.
Ju-Il Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including an image sensor chip and a method o...
Patent number
11,335,719
Issue date
May 17, 2022
Samsung Electronics Co., Ltd.
Yonghoe Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating a semiconductor device
Patent number
10,157,766
Issue date
Dec 18, 2018
Samsung Electronics Co., Ltd.
Un-Byoung Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of processing substrates
Patent number
9,595,446
Issue date
Mar 14, 2017
Samsung Electronics Co., Ltd.
Chungsun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for processing substrates
Patent number
9,412,636
Issue date
Aug 9, 2016
Samsung Electronics Co., Ltd.
Chungsun Lee
B32 - LAYERED PRODUCTS
Information
Patent Grant
Semiconductor packages and methods of fabricating the same
Patent number
9,059,072
Issue date
Jun 16, 2015
Samsung Electronics Co., Ltd.
Eun-Kyoung Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for processing substrates
Patent number
9,023,716
Issue date
May 5, 2015
Samsung Electronics Co., Ltd.
Chungsun Lee
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Methods of processing substrates
Patent number
9,006,081
Issue date
Apr 14, 2015
Samsung Electronics Co., Ltd.
Jung-Seok Ahn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device for semiconductor package having through silic...
Patent number
8,933,561
Issue date
Jan 13, 2015
Samsung Electronics Co., Ltd.
SeYoung Jeong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having through silicon via (TSV) interposer a...
Patent number
8,928,132
Issue date
Jan 6, 2015
Samsung Electronics Co., Ltd.
YunSeok Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and methods of fabricating the same
Patent number
8,759,147
Issue date
Jun 24, 2014
Samsung Electronics Co., Ltd.
Eun-Kyoung Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bump structure for a semiconductor device and method of manufacture
Patent number
8,105,934
Issue date
Jan 31, 2012
Samsung Electronics Co., Ltd.
Yonghwan Kwon
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICES INCLUDING BONDED SEMICONDUCTOR LAYERS AND MAN...
Publication number
20240178202
Publication date
May 30, 2024
Samsung Electronics Co., Ltd.
Byeongchan KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240170449
Publication date
May 23, 2024
Samsung Electronics Co., Ltd.
HYOUNGJOO LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP SPLITTING METHOD USING A LASER AND SEMICONDUCTOR...
Publication number
20240157481
Publication date
May 16, 2024
Samsung Electronics Co., Ltd.
YEONGKWON KO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240120251
Publication date
Apr 11, 2024
Samsung Electronics Co., Ltd.
JIN-WOO PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240088092
Publication date
Mar 14, 2024
Samsung Electronics Co., Ltd.
Jaekyung Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND M...
Publication number
20240071942
Publication date
Feb 29, 2024
Samsung Electronics Co., Ltd.
Young kun JEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20240055414
Publication date
Feb 15, 2024
Samsung Electronics Co., Ltd.
Jinwoo Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE...
Publication number
20230420336
Publication date
Dec 28, 2023
Samsung Electronics Co., Ltd.
Joonho JUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLDING APPARATUS OF SEMICONDUCTOR PACKAGE
Publication number
20230395403
Publication date
Dec 7, 2023
Samsung Electronics Co., Ltd.
Jinwoo Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTION STRUCTURE, METHOD OF FABRICATING THE SAME, AND SEMI...
Publication number
20230290718
Publication date
Sep 14, 2023
Samsung Electronics Co., Ltd.
JI-SEOK HONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20230282582
Publication date
Sep 7, 2023
Samsung Electronics Co., Ltd.
Ju-IL CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20230238316
Publication date
Jul 27, 2023
Samsung Electronics Co., Ltd.
Ju-Il CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20230132272
Publication date
Apr 27, 2023
Samsung Electronics Co., Ltd.
JUN YOUNG OH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230112006
Publication date
Apr 13, 2023
Samsung Electronics Co., Ltd.
Dongjoon OH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DRY ETCHING APPARATUS AND WAFER ETCHING SYSTEM USING THE SAME
Publication number
20230104421
Publication date
Apr 6, 2023
Samsung Electronics Co., Ltd.
Hyunsu Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
Publication number
20230096678
Publication date
Mar 30, 2023
Samsung Electronics Co., Ltd.
Junyun KWEON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20230089399
Publication date
Mar 23, 2023
Samsung Electronics Co., Ltd.
Solji SONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20230074933
Publication date
Mar 9, 2023
Samsung Electronics Co., Ltd.
Youngkun JEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
Publication number
20230070532
Publication date
Mar 9, 2023
Samsung Electronics Co., Ltd.
Jumyong PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER STRUCTURE AND SEMICONDUCTOR DEVICE
Publication number
20230073690
Publication date
Mar 9, 2023
Samsung Electronics Co., Ltd.
Hyunsu HWANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN IMAGE SENSOR CHIP AND A METHOD O...
Publication number
20220254827
Publication date
Aug 11, 2022
Samsung Electronics Co., Ltd.
YONGHOE CHO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20220157757
Publication date
May 19, 2022
Samsung Electronics Co., Ltd.
Seyeong Seok
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTION STRUCTURE, METHOD OF FABRICATING THE SAME, AND SEMI...
Publication number
20220068785
Publication date
Mar 3, 2022
JI-SEOK HONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20220059442
Publication date
Feb 24, 2022
Samsung Electronics Co., Ltd.
Dongjoon OH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20220059466
Publication date
Feb 24, 2022
Samsung Electronics Co., Ltd.
Solji SONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES
Publication number
20220037248
Publication date
Feb 3, 2022
Samsung Electronics Co., Ltd.
Ju-Il CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20220037255
Publication date
Feb 3, 2022
Samsung Electronics Co., Ltd.
Hyunsu Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20210384137
Publication date
Dec 9, 2021
Samsung Electronics Co., Ltd.
Ju-IL CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20210343634
Publication date
Nov 4, 2021
Samsung Electronics Co., Ltd.
Ju-Il CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER TRIMMING DEVICE
Publication number
20210320000
Publication date
Oct 14, 2021
Samsung Electronics Co., Ltd.
Jungseok AHN
H01 - BASIC ELECTRIC ELEMENTS