Chungsun Lee

Person

Anyang-City, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,094,847
- Issue date Sep 17, 2024
- Samsung Electronics Co., Ltd.
- Seyeong Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 12,021,034
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Solji Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure, method of fabricating the same, and semi...
- Patent number 12,014,977
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Ji-Seok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and semiconductor package including the same
- Patent number 12,009,288
- Issue date Jun 11, 2024
- Samsung Electronics Co., Ltd.
- Dongjoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having first and second redistribution patterns
- Patent number 11,996,358
- Issue date May 28, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including fine redistribution patterns
- Patent number 11,923,309
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Hyunsu Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package
- Patent number 11,854,893
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Junyun Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an image sensor chip and a method o...
- Patent number 11,824,076
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Yonghoe Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer trimming device
- Patent number 11,705,323
- Issue date Jul 18, 2023
- Samsung Electronics Co., Ltd.
- Jungseok Ahn
- B24 - GRINDING POLISHING
Information Patent Grant
Interconnection structure, method of fabricating the same, and semi...
- Patent number 11,688,679
- Issue date Jun 27, 2023
- Samsung Electronics Co., Ltd.
- Ji-Seok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package including the same
- Patent number 11,664,312
- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and semiconductor package including the same
- Patent number 11,637,058
- Issue date Apr 25, 2023
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an image sensor chip and a method o...
- Patent number 11,335,719
- Issue date May 17, 2022
- Samsung Electronics Co., Ltd.
- Yonghoe Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 10,157,766
- Issue date Dec 18, 2018
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of processing substrates
- Patent number 9,595,446
- Issue date Mar 14, 2017
- Samsung Electronics Co., Ltd.
- Chungsun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing substrates
- Patent number 9,412,636
- Issue date Aug 9, 2016
- Samsung Electronics Co., Ltd.
- Chungsun Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor packages and methods of fabricating the same
- Patent number 9,059,072
- Issue date Jun 16, 2015
- Samsung Electronics Co., Ltd.
- Eun-Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing substrates
- Patent number 9,023,716
- Issue date May 5, 2015
- Samsung Electronics Co., Ltd.
- Chungsun Lee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods of processing substrates
- Patent number 9,006,081
- Issue date Apr 14, 2015
- Samsung Electronics Co., Ltd.
- Jung-Seok Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for semiconductor package having through silic...
- Patent number 8,933,561
- Issue date Jan 13, 2015
- Samsung Electronics Co., Ltd.
- SeYoung Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having through silicon via (TSV) interposer a...
- Patent number 8,928,132
- Issue date Jan 6, 2015
- Samsung Electronics Co., Ltd.
- YunSeok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of fabricating the same
- Patent number 8,759,147
- Issue date Jun 24, 2014
- Samsung Electronics Co., Ltd.
- Eun-Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure for a semiconductor device and method of manufacture
- Patent number 8,105,934
- Issue date Jan 31, 2012
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421012
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Sangsick PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404972
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Seyeong Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240312923
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- Solji SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240312894
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240290702
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Dongjoon OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240222331
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- JIN-WOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240203888
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Hyunsu Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240194639
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Sang Cheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240186277
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING BONDED SEMICONDUCTOR LAYERS AND MAN...
- Publication number 20240178202
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- Byeongchan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240170449
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- HYOUNGJOO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP SPLITTING METHOD USING A LASER AND SEMICONDUCTOR...
- Publication number 20240157481
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- YEONGKWON KO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240120251
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- JIN-WOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240088092
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Jaekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND M...
- Publication number 20240071942
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Young kun JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240055414
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE...
- Publication number 20230420336
- Publication date Dec 28, 2023
- Samsung Electronics Co., Ltd.
- Joonho JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING APPARATUS OF SEMICONDUCTOR PACKAGE
- Publication number 20230395403
- Publication date Dec 7, 2023
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE, METHOD OF FABRICATING THE SAME, AND SEMI...
- Publication number 20230290718
- Publication date Sep 14, 2023
- Samsung Electronics Co., Ltd.
- JI-SEOK HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230282582
- Publication date Sep 7, 2023
- Samsung Electronics Co., Ltd.
- Ju-IL CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230238316
- Publication date Jul 27, 2023
- Samsung Electronics Co., Ltd.
- Ju-Il CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230132272
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- JUN YOUNG OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230112006
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Dongjoon OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY ETCHING APPARATUS AND WAFER ETCHING SYSTEM USING THE SAME
- Publication number 20230104421
- Publication date Apr 6, 2023
- Samsung Electronics Co., Ltd.
- Hyunsu Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20230096678
- Publication date Mar 30, 2023
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230089399
- Publication date Mar 23, 2023
- Samsung Electronics Co., Ltd.
- Solji SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230074933
- Publication date Mar 9, 2023
- Samsung Electronics Co., Ltd.
- Youngkun JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
- Publication number 20230070532
- Publication date Mar 9, 2023
- Samsung Electronics Co., Ltd.
- Jumyong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRUCTURE AND SEMICONDUCTOR DEVICE
- Publication number 20230073690
- Publication date Mar 9, 2023
- Samsung Electronics Co., Ltd.
- Hyunsu HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN IMAGE SENSOR CHIP AND A METHOD O...
- Publication number 20220254827
- Publication date Aug 11, 2022
- Samsung Electronics Co., Ltd.
- YONGHOE CHO
- H01 - BASIC ELECTRIC ELEMENTS

Chungsun Lee

Person

Patents Grantslast 30 patents

Semiconductor package and method of manufacturing the same

Semiconductor package and method of manufacturing the semiconductor...

Interconnection structure, method of fabricating the same, and semi...

Interconnection structure and semiconductor package including the same

Semiconductor packages having first and second redistribution patterns

Semiconductor package including fine redistribution patterns

Method of manufacturing semiconductor package

Semiconductor package including an image sensor chip and a method o...

Wafer trimming device

Interconnection structure, method of fabricating the same, and semi...

Semiconductor device and semiconductor package including the same

Interconnection structure and semiconductor package including the same

Semiconductor package including an image sensor chip and a method o...

Method of fabricating a semiconductor device

Methods of processing substrates

Methods for processing substrates

Semiconductor packages and methods of fabricating the same

Methods for processing substrates

Methods of processing substrates

Semiconductor device for semiconductor package having through silic...

Semiconductor package having through silicon via (TSV) interposer a...

Semiconductor packages and methods of fabricating the same

Bump structure for a semiconductor device and method of manufacture

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGES

INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICES INCLUDING BONDED SEMICONDUCTOR LAYERS AND MAN...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR CHIP SPLITTING METHOD USING A LASER AND SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND M...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

FAN-OUT TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE...

MOLDING APPARATUS OF SEMICONDUCTOR PACKAGE

INTERCONNECTION STRUCTURE, METHOD OF FABRICATING THE SAME, AND SEMI...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

DRY ETCHING APPARATUS AND WAFER ETCHING SYSTEM USING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...

WAFER STRUCTURE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING AN IMAGE SENSOR CHIP AND A METHOD O...