Chwen-Ming Liu

Person

Shinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with enhanced thermal dissipation and method f...
- Patent number 12,183,655
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for making the same
- Patent number 12,027,433
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual micro-electro mechanical system and manufacturing method thereof
- Patent number 11,993,512
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Che Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inductive device
- Patent number 11,908,884
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for detecting defects in semiconductor device
- Patent number 11,854,913
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,837,526
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 11,804,433
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,776,919
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of testing semiconductor package
- Patent number 11,769,698
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Hui Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 11,721,597
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with enhanced thermal dissipation and method f...
- Patent number 11,626,343
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for making the same
- Patent number 11,482,461
- Issue date Oct 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,450,626
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductive device
- Patent number 11,322,576
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual micro-electro mechanical system and manufacturing method thereof
- Patent number 11,274,037
- Issue date Mar 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having probe pads and seal ring
- Patent number 11,088,037
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor and structure thereof
- Patent number 10,937,858
- Issue date Mar 2, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 10,937,772
- Issue date Mar 2, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of detecting delamination in an integrated circuit package s...
- Patent number 10,699,977
- Issue date Jun 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor and structure thereof
- Patent number 10,629,673
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package structure and testing method using the same
- Patent number 10,347,548
- Issue date Jul 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated defect yield management and query system
- Patent number 6,314,379
- Issue date Nov 6, 2001
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ding-Dar Hu
- G01 - MEASURING TESTING
Information Patent Grant
Method for forming a dram stacked capacitor of zig-zag configuration
- Patent number 6,248,624
- Issue date Jun 19, 2001
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chwen-Ming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ARC layer enhancement for reducing metal loss during via etch
- Patent number 6,005,277
- Issue date Dec 21, 1999
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chwen-Ming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Abatement of electron beam charging distortion during dimensional m...
- Patent number 5,962,867
- Issue date Oct 5, 1999
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chwen-Ming Liu
- G01 - MEASURING TESTING
Information Patent Grant
Procedure for eliminating bubbles formed during reflow of a dielect...
- Patent number 5,834,346
- Issue date Nov 10, 1998
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Lin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Effective load length increase by topography
- Patent number 5,757,053
- Issue date May 26, 1998
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chwen-Ming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Abatement of electron beam charging distortion during dimensional m...
- Patent number 5,736,863
- Issue date Apr 7, 1998
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chwen-Ming Liu
- G01 - MEASURING TESTING
Information Patent Grant
Method for a MOS device manufacturing
- Patent number 5,646,057
- Issue date Jul 8, 1997
- Taiwan Semiconductor Manufacturing Company
- Chwen-Ming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a variable resistance polysilicon conductor for an...
- Patent number 5,514,617
- Issue date May 7, 1996
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Chwen-Ming Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20240312851
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20240262681
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240047310
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YANG-CHE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTIVE DEVICE
- Publication number 20230387182
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TESTING SEMICONDUCTOR PACKAGE
- Publication number 20230369139
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI-HUI LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230064152
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- YANG-CHE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TESTING SEMICONDUCTOR PACKAGE
- Publication number 20230019013
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI-HUI LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220406705
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YANG-CHE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20220384281
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220375881
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220376034
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YANG-CHE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...
- Publication number 20220367318
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTIVE DEVICE
- Publication number 20220231116
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20220194783
- Publication date Jun 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220068845
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTIVE DEVICE
- Publication number 20220037458
- Publication date Feb 3, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETECTING DEFECTS IN SEMICONDUCTOR DEVICE
- Publication number 20210366794
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- YANG-CHE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20210202329
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20210130167
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Che CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200402892
- Publication date Dec 24, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- YANG-CHE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200381409
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- YANG-CHE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR AND STRUCTURE THEREOF
- Publication number 20200251552
- Publication date Aug 6, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- YANG-CHE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...
- Publication number 20200135613
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR AND STRUCTURE THEREOF
- Publication number 20200098851
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- YANG-CHE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20200075435
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- YANG-CHE CHEN
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF DETECTING DELAMINATION IN AN INTEGRATED CIRCUIT PACKAGE S...
- Publication number 20190333829
- Publication date Oct 31, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Che CHEN
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT PACKAGE STRUCTURE AND TESTING METHOD USING THE SAME
- Publication number 20180156865
- Publication date Jun 7, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS

Chwen-Ming Liu

Person

Patents Grantslast 30 patents

Semiconductor device with enhanced thermal dissipation and method f...

Semiconductor package and method for making the same

Dual micro-electro mechanical system and manufacturing method thereof

Inductive device

Method for detecting defects in semiconductor device

Semiconductor package structure and method for manufacturing the same

Semiconductor package structure and method for forming the same

Semiconductor package

Method of testing semiconductor package

Semiconductor device and manufacturing method of the same

Semiconductor device with enhanced thermal dissipation and method f...

Semiconductor package and method for making the same

Semiconductor package

Inductive device

Dual micro-electro mechanical system and manufacturing method thereof

Semiconductor device having probe pads and seal ring

Method for manufacturing semiconductor and structure thereof

Semiconductor package and method for manufacturing the same

Method of detecting delamination in an integrated circuit package s...

Method for manufacturing semiconductor and structure thereof

Integrated circuit package structure and testing method using the same

Integrated defect yield management and query system

Method for forming a dram stacked capacitor of zig-zag configuration

ARC layer enhancement for reducing metal loss during via etch

Abatement of electron beam charging distortion during dimensional m...

Procedure for eliminating bubbles formed during reflow of a dielect...

Effective load length increase by topography

Abatement of electron beam charging distortion during dimensional m...

Method for a MOS device manufacturing

Method of making a variable resistance polysilicon conductor for an...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

INDUCTIVE DEVICE

METHOD OF TESTING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

METHOD OF TESTING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...

INDUCTIVE DEVICE

DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

INDUCTIVE DEVICE

METHOD FOR DETECTING DEFECTS IN SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR AND STRUCTURE THEREOF

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...

METHOD FOR MANUFACTURING SEMICONDUCTOR AND STRUCTURE THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

METHOD OF DETECTING DELAMINATION IN AN INTEGRATED CIRCUIT PACKAGE S...

INTEGRATED CIRCUIT PACKAGE STRUCTURE AND TESTING METHOD USING THE SAME