Claes H. Bjorkman

Person

Los Altos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and system for wafer level singulation
- Patent number 9,502,294
- Issue date Nov 22, 2016
- Applied Materials, Inc.
- Klaus Schuegraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for wafer level singulation
- Patent number 8,580,615
- Issue date Nov 12, 2013
- Applied Materials, Inc.
- Klaus Schuegraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning 3D features in a substrate
- Patent number 7,985,689
- Issue date Jul 26, 2011
- Applied Matrials, Inc.
- Eric Perozziello
- G02 - OPTICS
Information Patent Grant
Uniform magnetically enhanced reactive ion etching using nested ele...
- Patent number 7,458,335
- Issue date Dec 2, 2008
- Applied Materials, Inc.
- Claes H. Bjorkman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for transferring conductive pieces during sem...
- Patent number 7,407,081
- Issue date Aug 5, 2008
- Applied Materials, Inc.
- Michael R. Rice
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated low k dielectrics and etch stops
- Patent number 7,227,244
- Issue date Jun 5, 2007
- Applied Materials, Inc.
- Claes H. Bjorkman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Optical ready substrates
- Patent number 7,110,629
- Issue date Sep 19, 2006
- Applied Materials, Inc.
- Claes Bjorkman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ashable layers for reducing critical dimensions of integrated circu...
- Patent number 7,105,442
- Issue date Sep 12, 2006
- Applied Materials, Inc.
- Hongching Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical ready substrates
- Patent number 7,072,534
- Issue date Jul 4, 2006
- Applied Materials, Inc.
- Claes Björkman
- G02 - OPTICS
Information Patent Grant
Optical ready wafers
- Patent number 7,043,106
- Issue date May 9, 2006
- Applied Materials, Inc.
- Lawrence C. West
- G02 - OPTICS
Information Patent Grant
System level in-situ integrated dielectric etch process particularl...
- Patent number 6,949,203
- Issue date Sep 27, 2005
- Applied Materials, Inc.
- Chang-Lin Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated method for release and passivation of MEMS structures
- Patent number 6,902,947
- Issue date Jun 7, 2005
- Applied Materials, Inc.
- Jeffrey D. Chinn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated low K dielectrics and etch stops
- Patent number 6,858,153
- Issue date Feb 22, 2005
- Applied Materials Inc.
- Claes H. Bjorkman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Distributed inductively-coupled plasma source and circuit for coupl...
- Patent number 6,825,618
- Issue date Nov 30, 2004
- Bryan Y. Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric etch chamber with expanded process window
- Patent number 6,797,639
- Issue date Sep 28, 2004
- Applied Materials Inc.
- James D Carducci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System level in-situ integrated dielectric etch process particularl...
- Patent number 6,793,835
- Issue date Sep 21, 2004
- Lee Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flash step preparatory to dielectric etch
- Patent number 6,787,475
- Issue date Sep 7, 2004
- Zhuxu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric etch chamber with expanded process window
- Patent number 6,716,302
- Issue date Apr 6, 2004
- Applied Materials Inc.
- James D Carducci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of etching a trench in a silicon-containing dielectric material
- Patent number 6,686,293
- Issue date Feb 3, 2004
- Applied Materials, Inc.
- Yunsang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated low k dielectrics and etch stops
- Patent number 6,669,858
- Issue date Dec 30, 2003
- Applied Materials Inc.
- Claes H. Bjorkman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Distributed inductively-coupled plasma source and circuit for coupl...
- Patent number 6,568,346
- Issue date May 27, 2003
- Applied Materials Inc.
- Bryan Y. Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System level in-situ integrated dielectric etch process particularl...
- Patent number 6,500,357
- Issue date Dec 31, 2002
- Applied Materials Inc.
- Lee Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch method using a dielectric etch chamber with expanded process w...
- Patent number 6,403,491
- Issue date Jun 11, 2002
- Applied Materials, Inc.
- Jingbao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High selectivity etch using an external plasma discharge
- Patent number 6,387,288
- Issue date May 14, 2002
- Applied Materials, Inc.
- Claes Bjorkman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxide/nitride etching having high selectivity to photoresist
- Patent number 6,362,109
- Issue date Mar 26, 2002
- Applied Materials, Inc.
- Yungsang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated low K dielectrics and etch stops
- Patent number 6,340,435
- Issue date Jan 22, 2002
- Applied Materials, Inc.
- Claes H. Bjorkman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Distributed inductively-coupled plasma source
- Patent number 6,273,022
- Issue date Aug 14, 2001
- Applied Materials, Inc.
- Bryan Y. Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for controlling plasma uniformity in a semicon...
- Patent number 6,232,236
- Issue date May 15, 2001
- Applied Materials, Inc.
- Hongqing Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetically-enhanced plasma chamber with non-uniform magnetic field
- Patent number 6,113,731
- Issue date Sep 5, 2000
- Applied Materials, Inc.
- Hongching Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High selectivity etch using an external plasma discharge
- Patent number 6,074,514
- Issue date Jun 13, 2000
- Applied Materials, Inc.
- Claes Bjorkman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND SYSTEM FOR WAFER LEVEL SINGULATION
- Publication number 20140196850
- Publication date Jul 17, 2014
- Applied Materials, Inc.
- Klaus Schuegraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR WAFER LEVEL SINGULATION
- Publication number 20130045570
- Publication date Feb 21, 2013
- Applied Materials, Inc.
- Klaus Schuegraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR TRANSFERRING CONDUCTIVE PIECES DURING SEM...
- Publication number 20080283387
- Publication date Nov 20, 2008
- APPLIED MATERIALS, INC.
- Michael R. Rice
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNING 3D FEATURES IN A SUBSTRATE
- Publication number 20070293044
- Publication date Dec 20, 2007
- Applied Materials, Inc.
- Eric Perozziello
- G02 - OPTICS
Information Patent Application
Optical ready substrates
- Publication number 20070080414
- Publication date Apr 12, 2007
- Applied Materials, Inc.
- Claes Bjorkman
- G02 - OPTICS
Information Patent Application
PLASMA CHAMBER INSERT RING
- Publication number 20060283553
- Publication date Dec 21, 2006
- Applied Materials, Inc.
- Shawming Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods and apparatus for transferring conductive pieces during sem...
- Publication number 20050232728
- Publication date Oct 20, 2005
- Michael R. Rice
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optical-ready wafers
- Publication number 20050072979
- Publication date Apr 7, 2005
- APPLIED MATERIALS, INC.
- Lawrence C. West
- G02 - OPTICS
Information Patent Application
Integrated low k dielectrics and etch stops
- Publication number 20050023694
- Publication date Feb 3, 2005
- Claes H. Bjorkman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Dielectric etch chamber with expanded process window
- Publication number 20050003675
- Publication date Jan 6, 2005
- James D. Carducci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical ready substrates
- Publication number 20040114853
- Publication date Jun 17, 2004
- APPLIED MATERIALS, INC.
- Claes Bjorkman
- G02 - OPTICS
Information Patent Application
Integrated method for release and passivation of MEMS structures
- Publication number 20040033639
- Publication date Feb 19, 2004
- APPLIED MATERIALS, INC.
- Jeffrey D. Chinn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Optical ready substrates
- Publication number 20040013338
- Publication date Jan 22, 2004
- APPLIED MATERIALS, INC.
- Claes Bjorkman
- G02 - OPTICS
Information Patent Application
Optical ready wafers
- Publication number 20040012041
- Publication date Jan 22, 2004
- APPLIED MATERIALS, INC.
- Lawrence C. West
- G02 - OPTICS
Information Patent Application
Ashable layers for reducing critical dimensions of integrated circu...
- Publication number 20030219988
- Publication date Nov 27, 2003
- APPLIED MATERIALS, INC.
- Hongqing Shan
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF ETCHING A TRENCH IN A SILICON-CONTAINING DIELECTRIC MATERIAL
- Publication number 20030211750
- Publication date Nov 13, 2003
- Yunsang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Distributed inductively-coupled plasma source and circuit for coupl...
- Publication number 20030192644
- Publication date Oct 16, 2003
- APPLIED MATERIALS, INC.
- Bryan Y. Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System level in-situ integrated dielectric etch process particularl...
- Publication number 20030164354
- Publication date Sep 4, 2003
- Applied Materials, Inc.
- Chang-Lin Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma chamber insert ring
- Publication number 20030106646
- Publication date Jun 12, 2003
- APPLIED MATERIALS, INC.
- Shawming Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
System level in-situ integrated dielectric etch process particularl...
- Publication number 20030057179
- Publication date Mar 27, 2003
- Applied Materials, Inc.
- Lee Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flash step preparatory to dielectric etch
- Publication number 20030045116
- Publication date Mar 6, 2003
- APPLIED MATERIALS, INC.
- Zhuxu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric etch chamber with expanded process window
- Publication number 20030037880
- Publication date Feb 27, 2003
- APPLIED MATERIALS, INC.
- James D. Carducci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric etch chamber with expanded process window
- Publication number 20030038111
- Publication date Feb 27, 2003
- APPLIED MATERIALS, INC.
- James D. Carducci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Intergrated low k dielectrics and etch stops
- Publication number 20020084257
- Publication date Jul 4, 2002
- APPLIED MATERIALS, INC.
- Claes H. Bjorkman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integrated low k dielectrics and etch stops
- Publication number 20020074309
- Publication date Jun 20, 2002
- APPLIED MATERIALS, INC.
- Claes H. Bjorkman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Distributed inductively-coupled plasma source and circuit for coupl...
- Publication number 20010054383
- Publication date Dec 27, 2001
- APPLIED MATERIALS, INC.
- Bryan Y. Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for controlling plasma uniformity in a semicon...
- Publication number 20010009139
- Publication date Jul 26, 2001
- Hongqing Shan
- H01 - BASIC ELECTRIC ELEMENTS

Claes H. Bjorkman

Person

Patents Grantslast 30 patents

Method and system for wafer level singulation

Method and system for wafer level singulation

Patterning 3D features in a substrate

Uniform magnetically enhanced reactive ion etching using nested ele...

Methods and apparatus for transferring conductive pieces during sem...

Integrated low k dielectrics and etch stops

Optical ready substrates

Ashable layers for reducing critical dimensions of integrated circu...

Optical ready substrates

Optical ready wafers

System level in-situ integrated dielectric etch process particularl...

Integrated method for release and passivation of MEMS structures

Integrated low K dielectrics and etch stops

Distributed inductively-coupled plasma source and circuit for coupl...

Dielectric etch chamber with expanded process window

System level in-situ integrated dielectric etch process particularl...

Flash step preparatory to dielectric etch

Dielectric etch chamber with expanded process window

Method of etching a trench in a silicon-containing dielectric material

Integrated low k dielectrics and etch stops

Distributed inductively-coupled plasma source and circuit for coupl...

System level in-situ integrated dielectric etch process particularl...

Etch method using a dielectric etch chamber with expanded process w...

High selectivity etch using an external plasma discharge

Oxide/nitride etching having high selectivity to photoresist

Integrated low K dielectrics and etch stops

Distributed inductively-coupled plasma source

Apparatus and method for controlling plasma uniformity in a semicon...

Magnetically-enhanced plasma chamber with non-uniform magnetic field

High selectivity etch using an external plasma discharge

Patents Applicationslast 30 patents

METHOD AND SYSTEM FOR WAFER LEVEL SINGULATION

METHOD AND SYSTEM FOR WAFER LEVEL SINGULATION

METHODS AND APPARATUS FOR TRANSFERRING CONDUCTIVE PIECES DURING SEM...

PATTERNING 3D FEATURES IN A SUBSTRATE

Optical ready substrates

PLASMA CHAMBER INSERT RING

Methods and apparatus for transferring conductive pieces during sem...

Optical-ready wafers

Integrated low k dielectrics and etch stops

Dielectric etch chamber with expanded process window

Optical ready substrates

Integrated method for release and passivation of MEMS structures

Optical ready substrates

Optical ready wafers

Ashable layers for reducing critical dimensions of integrated circu...

METHOD OF ETCHING A TRENCH IN A SILICON-CONTAINING DIELECTRIC MATERIAL

Distributed inductively-coupled plasma source and circuit for coupl...

System level in-situ integrated dielectric etch process particularl...

Plasma chamber insert ring

System level in-situ integrated dielectric etch process particularl...

Flash step preparatory to dielectric etch

Dielectric etch chamber with expanded process window

Dielectric etch chamber with expanded process window

Intergrated low k dielectrics and etch stops

Integrated low k dielectrics and etch stops

Distributed inductively-coupled plasma source and circuit for coupl...

Apparatus and method for controlling plasma uniformity in a semicon...