Clifford R. Fishley

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wire bond integrated circuit package for high speed I/O
- Patent number 7,804,167
- Issue date Sep 28, 2010
- LSI Logic Corporation
- Clifford Fishley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package layout supporting many voltage splits and f...
- Patent number 7,750,460
- Issue date Jul 6, 2010
- LSI Corporation
- Clifford R. Fishley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit carrier apparatus method and system
- Patent number 7,166,492
- Issue date Jan 23, 2007
- LSI Logic Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top gated heat dissipation
- Patent number 6,654,248
- Issue date Nov 25, 2003
- LSI Logic Corporation
- Clifford R. Fishley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method of semiconductor wafer protection
- Patent number 6,540,467
- Issue date Apr 1, 2003
- LSI Logic Corporation
- Nael O. Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configurable ball grid array package
- Patent number 5,786,631
- Issue date Jul 28, 1998
- LSI Logic Corporation
- Clifford R. Fishley
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT (IC) LEADFRAME DESIGN
- Publication number 20130161804
- Publication date Jun 27, 2013
- Clifford R. Fishley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) LEADFRAME DESIGN
- Publication number 20130161805
- Publication date Jun 27, 2013
- LSI Corporation
- Clifford R. Fishley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED HEAT SPREADER FOR USE IN AN ELECTRONIC DEVICE AND METHOD O...
- Publication number 20120126387
- Publication date May 24, 2012
- LSI Corporation
- Clifford R. Fishley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY PACKAGE LAYOUT SUPPORTING MANY VOLTAGE SPLITS AND F...
- Publication number 20090212413
- Publication date Aug 27, 2009
- Clifford R. Fishley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND INTEGRATED CIRCUIT PACKAGE FOR HIGH SPEED I/O
- Publication number 20080128919
- Publication date Jun 5, 2008
- Clifford Fishley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI shielded integrated circuit packaging apparatus method and system
- Publication number 20050104164
- Publication date May 19, 2005
- LSI Logic Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit carrier apparatus method and system
- Publication number 20050104172
- Publication date May 19, 2005
- LSI Logic Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS

Clifford R. Fishley

Person

Patents Grantslast 30 patents

Wire bond integrated circuit package for high speed I/O

Ball grid array package layout supporting many voltage splits and f...

Integrated circuit carrier apparatus method and system

Top gated heat dissipation

Apparatus and method of semiconductor wafer protection

Configurable ball grid array package

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT (IC) LEADFRAME DESIGN

INTEGRATED CIRCUIT (IC) LEADFRAME DESIGN

ENHANCED HEAT SPREADER FOR USE IN AN ELECTRONIC DEVICE AND METHOD O...

BALL GRID ARRAY PACKAGE LAYOUT SUPPORTING MANY VOLTAGE SPLITS AND F...

WIRE BOND INTEGRATED CIRCUIT PACKAGE FOR HIGH SPEED I/O

EMI shielded integrated circuit packaging apparatus method and system

Integrated circuit carrier apparatus method and system