Clinton C. Chao

Person

Redwood City, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Planar multilayer ceramic structures with near surface channels
- Patent number 6,242,075
- Issue date Jun 5, 2001
- Hewlett-Packard Company
- Clinton C. Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacing control in electronic device assemblies
- Patent number 5,633,535
- Issue date May 27, 1997
- Clinton C. Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer fabrication in integrated circuit systems
- Patent number 5,399,528
- Issue date Mar 21, 1995
- Jacques Leibovitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled etching process for forming fine-geometry circuit lines...
- Patent number 5,221,421
- Issue date Jun 22, 1993
- Hewlett-Packard Company
- Jacques Leibovitz
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Methods for forming high density multi-chip carriers
- Patent number 5,200,300
- Issue date Apr 6, 1993
- Hewlett-Packard Company
- Jacques Leibovitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked solid via formation in integrated circuit systems
- Patent number 5,162,260
- Issue date Nov 10, 1992
- Hewlett-Packard Company
- Jacques Leibovitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape automated bonding system which facilitate repair
- Patent number 5,086,335
- Issue date Feb 4, 1992
- Hewlett-Packard Company
- Jacques Leibovitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked solid via formation in integrated circuit systems
- Patent number 5,055,425
- Issue date Oct 8, 1991
- Hewlett-Packard Company
- Jacques Leibovitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hierarchical tape automated bonding method
- Patent number 5,029,386
- Issue date Jul 9, 1991
- Hewlett-Packard Company
- Clinton C. Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier
- Patent number 4,782,381
- Issue date Nov 1, 1988
- Hewlett-Packard Company
- Richard C. Ruby
- H01 - BASIC ELECTRIC ELEMENTS

Clinton C. Chao

Person

Patents Grantslast 30 patents

Planar multilayer ceramic structures with near surface channels

Spacing control in electronic device assemblies

Multi-layer fabrication in integrated circuit systems

Controlled etching process for forming fine-geometry circuit lines...

Methods for forming high density multi-chip carriers

Stacked solid via formation in integrated circuit systems

Tape automated bonding system which facilitate repair

Stacked solid via formation in integrated circuit systems

Hierarchical tape automated bonding method

Chip carrier