Clinton Chao

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer level IC assembly method
- Patent number 8,551,813
- Issue date Oct 8, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Hsiun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable semiconductor interposer for electronic package and me...
- Patent number 8,476,735
- Issue date Jul 2, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Shun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for stacking devices
- Patent number 8,334,170
- Issue date Dec 18, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dean Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level IC assembly method
- Patent number 8,247,267
- Issue date Aug 21, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Hsiun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and apparatus for wafer-level flip-chip assembly
- Patent number 8,232,183
- Issue date Jul 31, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsiun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-based thin substrate and packaging schemes
- Patent number 8,174,129
- Issue date May 8, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level flip-chip assembly methods
- Patent number 7,977,155
- Issue date Jul 12, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsiun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having stress tuning layer
- Patent number 7,880,278
- Issue date Feb 1, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV-enabled twisted pair
- Patent number 7,812,426
- Issue date Oct 12, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mark Shane Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-based thin substrate and packaging schemes
- Patent number 7,804,177
- Issue date Sep 28, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming single dies with multi-layer interconnect struc...
- Patent number 7,795,735
- Issue date Sep 14, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Shun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-fine pitch probe card structure
- Patent number 7,696,766
- Issue date Apr 13, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsu Ming Cheng
- G01 - MEASURING TESTING
Information Patent Grant
Ultra-fine pitch probe card structure
- Patent number 7,642,793
- Issue date Jan 5, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsu Ming Cheng
- G01 - MEASURING TESTING
Information Patent Grant
Low-cost and ultra-fine integrated circuit packaging technique
- Patent number 7,576,435
- Issue date Aug 18, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Clinton Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiP (system in package) design systems and methods
- Patent number 7,565,635
- Issue date Jul 21, 2009
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Clinton Chao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked structures and methods of fabricating stacked structures
- Patent number 7,514,775
- Issue date Apr 7, 2009
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Clinton Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Design techniques for stacking identical memory dies
- Patent number 7,494,846
- Issue date Feb 24, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Shun Hsu
- G11 - INFORMATION STORAGE
Information Patent Grant
Electromagnetic shielding using through-silicon vias
- Patent number 7,427,803
- Issue date Sep 23, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Clinton Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to increase bump height and achieve robust bump structure
- Patent number 7,112,522
- Issue date Sep 26, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Stacking Devices and Structure Thereof
- Publication number 20130127049
- Publication date May 23, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dean Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL IC ASSEMBLY METHOD
- Publication number 20120288998
- Publication date Nov 15, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Hsiun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon-Based Thin Substrate and Packaging Schemes
- Publication number 20100301477
- Publication date Dec 2, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STACKING DEVICES
- Publication number 20090321948
- Publication date Dec 31, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dean Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV-Enabled Twisted Pair
- Publication number 20090294915
- Publication date Dec 3, 2009
- Mark Shane Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL IC ASSEMBLY METHOD
- Publication number 20090233402
- Publication date Sep 17, 2009
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien Hsiun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device including electrically conductive bump and met...
- Publication number 20090174071
- Publication date Jul 9, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.,
- Clinton Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Programmable semiconductor interposer for electronic package and me...
- Publication number 20080296697
- Publication date Dec 4, 2008
- Chao-Shun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process and apparatus for wafer-level flip-chip assembly
- Publication number 20080274592
- Publication date Nov 6, 2008
- Chien-Hsiun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-level flip-chip assembly methods
- Publication number 20080274589
- Publication date Nov 6, 2008
- Chien-Hsiun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-cost and ultra-fine integrated circuit packaging technique
- Publication number 20080265399
- Publication date Oct 30, 2008
- Clinton Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIP (SYSTEM IN PACKAGE) DESIGN SYSTEMS AND METHODS
- Publication number 20080250182
- Publication date Oct 9, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Clinton Chao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS FOR FORMING SINGLE DIES WITH MULTI-LAYER INTERCONNECT STRUC...
- Publication number 20080233710
- Publication date Sep 25, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Chao-Shun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Design techniques for stacking identical memory dies
- Publication number 20080220565
- Publication date Sep 11, 2008
- Chao-Shun Hsu
- G11 - INFORMATION STORAGE
Information Patent Application
Ultra-fine pitch probe card structure
- Publication number 20080180123
- Publication date Jul 31, 2008
- Hsu Ming Cheng
- G01 - MEASURING TESTING
Information Patent Application
Ultra-Fine Pitch Probe Card Structure
- Publication number 20080116923
- Publication date May 22, 2008
- Hsu Ming Cheng
- G01 - MEASURING TESTING
Information Patent Application
STACKED STRUCTURES AND METHODS OF FABRICATING STACKED STRUCTURES
- Publication number 20080083975
- Publication date Apr 10, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Clinton Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electromagnetic shielding using through-silicon vias
- Publication number 20080073747
- Publication date Mar 27, 2008
- Clinton Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon-based thin substrate and packaging schemes
- Publication number 20080023850
- Publication date Jan 31, 2008
- Szu Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test probe for integrated circuits with ultra-fine pitch terminals
- Publication number 20080018350
- Publication date Jan 24, 2008
- Clinton Chao
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device including electrically conductive bump and met...
- Publication number 20070267745
- Publication date Nov 22, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Clinton Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit having stress tuning layer and methods of manufa...
- Publication number 20070267724
- Publication date Nov 22, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Utra-thin substrate package technology
- Publication number 20070246821
- Publication date Oct 25, 2007
- Szu Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS

Clinton Chao

Person

Patents Grantslast 30 patents

Wafer level IC assembly method

Programmable semiconductor interposer for electronic package and me...

Method for stacking devices

Wafer level IC assembly method

Process and apparatus for wafer-level flip-chip assembly

Silicon-based thin substrate and packaging schemes

Wafer-level flip-chip assembly methods

Integrated circuit having stress tuning layer

TSV-enabled twisted pair

Silicon-based thin substrate and packaging schemes

Methods for forming single dies with multi-layer interconnect struc...

Ultra-fine pitch probe card structure

Ultra-fine pitch probe card structure

Low-cost and ultra-fine integrated circuit packaging technique

SiP (system in package) design systems and methods

Stacked structures and methods of fabricating stacked structures

Design techniques for stacking identical memory dies

Electromagnetic shielding using through-silicon vias

Method to increase bump height and achieve robust bump structure

Patents Applicationslast 30 patents

Method for Stacking Devices and Structure Thereof

WAFER LEVEL IC ASSEMBLY METHOD

Silicon-Based Thin Substrate and Packaging Schemes

METHOD FOR STACKING DEVICES

TSV-Enabled Twisted Pair

WAFER LEVEL IC ASSEMBLY METHOD

Semiconductor device including electrically conductive bump and met...

Programmable semiconductor interposer for electronic package and me...

Process and apparatus for wafer-level flip-chip assembly

Wafer-level flip-chip assembly methods

Low-cost and ultra-fine integrated circuit packaging technique

SIP (SYSTEM IN PACKAGE) DESIGN SYSTEMS AND METHODS

METHODS FOR FORMING SINGLE DIES WITH MULTI-LAYER INTERCONNECT STRUC...

Design techniques for stacking identical memory dies

Ultra-fine pitch probe card structure

Ultra-Fine Pitch Probe Card Structure

STACKED STRUCTURES AND METHODS OF FABRICATING STACKED STRUCTURES

Electromagnetic shielding using through-silicon vias

Silicon-based thin substrate and packaging schemes

Test probe for integrated circuits with ultra-fine pitch terminals

Semiconductor device including electrically conductive bump and met...

Integrated circuit having stress tuning layer and methods of manufa...

Utra-thin substrate package technology