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SINGAPORE, SG
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Patents Grants
last 30 patents
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Patent Grant
Methods and apparatus for cleaving of semiconductor substrates
Patent number
11,610,807
Issue date
Mar 21, 2023
Applied Materials, Inc.
Felix Deng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for cleaving of semiconductor substrates
Patent number
11,569,122
Issue date
Jan 31, 2023
Applied Materials, Inc.
Felix Deng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for high voltage electrostatic chuck protection
Patent number
11,289,357
Issue date
Mar 29, 2022
Applied Materials, Inc.
Yuichi Wada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for cleaving of semiconductor substrates
Patent number
10,991,617
Issue date
Apr 27, 2021
Applied Materials, Inc.
Felix Deng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
INTEGRATED LASER AND PLASMA ETCH DICING
Publication number
20240266220
Publication date
Aug 8, 2024
Jonathan Bryant MELLEN
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Methods and Apparatus for Cleaving of Semiconductor Substrates
Publication number
20210233802
Publication date
Jul 29, 2021
Applied Materials, Inc.
FELIX DENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR CLEAVING OF SEMICONDUCTOR SUBSTRATES
Publication number
20210217656
Publication date
Jul 15, 2021
Applied Materials, Inc.
FELIX DENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR MICROWAVE PROCESSING OF POLYMER MATERIALS
Publication number
20210001520
Publication date
Jan 7, 2021
Applied Materials, Inc.
Tuck Foong KOH
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
METHODS AND APPARATUS FOR HIGH VOLTAGE ELECTROSTATIC CHUCK PROTECTION
Publication number
20200411353
Publication date
Dec 31, 2020
Applied Materials, Inc.
YUICHI WADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR CLEAVING OF SEMICONDUCTOR SUBSTRATES
Publication number
20190355616
Publication date
Nov 21, 2019
Applied Materials, Inc.
FELIX DENG
H01 - BASIC ELECTRIC ELEMENTS