COLBY G. RAMPLEY

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged dies with metal outer layers extending from die back sides...
- Patent number 11,437,276
- Issue date Sep 6, 2022
- NXP USA, INC.
- Jaynal A Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for increasing semiconductor device wafer strength
- Patent number 10,998,231
- Issue date May 4, 2021
- NXP USA, INC.
- Colby Greg Rampley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wafer dicing for wafers with backside metallization and p...
- Patent number 10,741,446
- Issue date Aug 11, 2020
- NXP USA, INC.
- Jaynal A Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making an electronic component package
- Patent number 10,340,251
- Issue date Jul 2, 2019
- NXP USA, INC.
- Alan J. Magnus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wafer dicing for backside metallization
- Patent number 10,014,262
- Issue date Jul 3, 2018
- NXP USA, INC.
- L. Scott Klingbeil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with protruding conductive vias and methods o...
- Patent number 9,941,210
- Issue date Apr 10, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for removing adhesive layers from semiconductor wafers
- Patent number 9,111,983
- Issue date Aug 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Kevin P. Ginter
- B32 - LAYERED PRODUCTS
Information Patent Grant
Three-dimensional solar cell having increased efficiency
- Patent number 8,790,947
- Issue date Jul 29, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Colby G. Rampley
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Identification mechanism for semiconductor device die
- Patent number 8,742,599
- Issue date Jun 3, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Colby G. Rampley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced RF enhancement-mode FETs with improved gate properties
- Patent number 6,893,947
- Issue date May 17, 2005
- Freescale Semiconductor, Inc.
- Marino J. Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method of manufacture
- Patent number 6,798,064
- Issue date Sep 28, 2004
- Motorola, Inc.
- Haldane S. Henry
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR INCREASING SEMICONDUCTOR DEVICE WAFER STRENGTH
- Publication number 20200395247
- Publication date Dec 17, 2020
- NXP USA, Inc.
- Colby Greg Rampley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DIES WITH METAL OUTER LAYERS EXTENDING FROM DIE BACK SIDES...
- Publication number 20200335398
- Publication date Oct 22, 2020
- NXP USA, Inc.
- Jaynal A. Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF WAFER DICING FOR WAFERS WITH BACKSIDE METALLIZATION AND P...
- Publication number 20190013242
- Publication date Jan 10, 2019
- NXP USA, Inc.
- Jaynal A. Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING AN ELECTRONIC COMPONENT PACKAGE
- Publication number 20180315734
- Publication date Nov 1, 2018
- NXP USA, Inc.
- Alan J. MAGNUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM NITRIDE PROTECTION OF SILVER APPARATUS, SYSTEM AND METHOD
- Publication number 20180059290
- Publication date Mar 1, 2018
- FREESCALE SEMICONDUCTOR, INC.
- Jeffrey Lynn WEIBRECHT
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF WAFER DICING FOR BACKSIDE METALLIZATION
- Publication number 20170358537
- Publication date Dec 14, 2017
- FREESCALE SEMICONDUCTOR, INC.
- L. Scott KLINGBEIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SOLAR CELL HAVING INCREASED EFFICIENCY
- Publication number 20140238483
- Publication date Aug 28, 2014
- FREESCALE SEMICONDUCTOR, INC.
- COLBY G. RAMPLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IDENTIFICATION MECHANISM FOR SEMICONDUCTOR DEVICE DIE
- Publication number 20140232017
- Publication date Aug 21, 2014
- FREESCALE SEMICONDUCTOR, INC.
- COLBY G. RAMPLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IDENTIFICATION MECHANISM FOR SEMICONDUCTOR DEVICE DIE
- Publication number 20140061952
- Publication date Mar 6, 2014
- Colby G. Rampley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SOLAR CELL HAVING INCREASED EFFICIENCY
- Publication number 20130092223
- Publication date Apr 18, 2013
- Colby G. Rampley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced RF enhancement-mode FETs with improved gate properties
- Publication number 20030235974
- Publication date Dec 25, 2003
- MOTOROLA INC.
- Marino J. Martinez
- H01 - BASIC ELECTRIC ELEMENTS

COLBY G. RAMPLEY

Person

Patents Grantslast 30 patents

Packaged dies with metal outer layers extending from die back sides...

Method for increasing semiconductor device wafer strength

Method of wafer dicing for wafers with backside metallization and p...

Method for making an electronic component package

Method of wafer dicing for backside metallization

Semiconductor devices with protruding conductive vias and methods o...

Methods for removing adhesive layers from semiconductor wafers

Three-dimensional solar cell having increased efficiency

Identification mechanism for semiconductor device die

Advanced RF enhancement-mode FETs with improved gate properties

Electronic component and method of manufacture

Patents Applicationslast 30 patents

METHOD FOR INCREASING SEMICONDUCTOR DEVICE WAFER STRENGTH

PACKAGED DIES WITH METAL OUTER LAYERS EXTENDING FROM DIE BACK SIDES...

METHOD OF WAFER DICING FOR WAFERS WITH BACKSIDE METALLIZATION AND P...

METHOD FOR MAKING AN ELECTRONIC COMPONENT PACKAGE

ALUMINUM NITRIDE PROTECTION OF SILVER APPARATUS, SYSTEM AND METHOD

METHOD OF WAFER DICING FOR BACKSIDE METALLIZATION

THREE-DIMENSIONAL SOLAR CELL HAVING INCREASED EFFICIENCY

IDENTIFICATION MECHANISM FOR SEMICONDUCTOR DEVICE DIE

IDENTIFICATION MECHANISM FOR SEMICONDUCTOR DEVICE DIE

THREE-DIMENSIONAL SOLAR CELL HAVING INCREASED EFFICIENCY

Advanced RF enhancement-mode FETs with improved gate properties