Cornelia Kang-I Tsang

Person

Mohegan Lake, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Through silicon via and method of fabricating same
- Patent number 8,138,036
- Issue date Mar 20, 2012
- International Business Machines Corporation
- Paul Stephen Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming silicon chicklet pedestal
- Patent number 7,987,591
- Issue date Aug 2, 2011
- International Business Machines Corporation
- S. Jay Chey
- G01 - MEASURING TESTING
Information Patent Grant
Versatile Si-based packaging with integrated passive components for...
- Patent number 7,808,798
- Issue date Oct 5, 2010
- International Business Machines Corporation
- John Michael Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated module for data processing system
- Patent number 7,750,459
- Issue date Jul 6, 2010
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-wafer vias
- Patent number 7,741,722
- Issue date Jun 22, 2010
- International Business Machines Corporation
- Paul Stephen Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making through wafer vias
- Patent number 7,678,696
- Issue date Mar 16, 2010
- International Business Machines Corporation
- Paul Stephen Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Versatile Si-based packaging with integrated passive components for...
- Patent number 7,518,229
- Issue date Apr 14, 2009
- International Business Machines Corporation
- John Michael Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep filled vias
- Patent number 7,060,624
- Issue date Jun 13, 2006
- International Business Machines Corporation
- Panayotis Andricacos
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THROUGH SILICON VIA AND METHOD OF FABRICATING SAME
- Publication number 20120132967
- Publication date May 31, 2012
- International Business Machines Corporation
- Paul Stephen Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING THROUGH WAFER VIAS
- Publication number 20100035430
- Publication date Feb 11, 2010
- Paul Stephen Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA AND METHOD OF FABRICATING SAME
- Publication number 20100032764
- Publication date Feb 11, 2010
- Paul Stephen Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MODULE FOR DATA PROCESSING SYSTEM
- Publication number 20090194864
- Publication date Aug 6, 2009
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-WAFER VIAS
- Publication number 20080274583
- Publication date Nov 6, 2008
- Paul Stephen Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Versatile Si-based packaging with integrated passive components for...
- Publication number 20080029886
- Publication date Feb 7, 2008
- International Business Machines Corporation
- John Michael Cotte
- H01 - BASIC ELECTRIC ELEMENTS

Cornelia Kang-I Tsang

Person

Patents Grantslast 30 patents

Through silicon via and method of fabricating same

Method of forming silicon chicklet pedestal

Versatile Si-based packaging with integrated passive components for...

Integrated module for data processing system

Through-wafer vias

Method of making through wafer vias

Versatile Si-based packaging with integrated passive components for...

Deep filled vias

Patents Applicationslast 30 patents

THROUGH SILICON VIA AND METHOD OF FABRICATING SAME

METHOD OF MAKING THROUGH WAFER VIAS

THROUGH SILICON VIA AND METHOD OF FABRICATING SAME

INTEGRATED MODULE FOR DATA PROCESSING SYSTEM

THROUGH-WAFER VIAS

Versatile Si-based packaging with integrated passive components for...