Cristian A. Tivarus

Person

Rochester, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Isolated wire bond in integrated electrical components
- Patent number 8,748,946
- Issue date Jun 10, 2014
- OmniVision Technologies, Inc.
- John P. McCarten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-illuminated CMOS image sensors
- Patent number 8,618,458
- Issue date Dec 31, 2013
- OmniVision Technologies, Inc.
- John P. McCarten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having multiple sensing layers
- Patent number 8,471,939
- Issue date Jun 25, 2013
- OmniVision Technologies, Inc.
- Cristian A. Tivarus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolating wire bonding in integrated electrical components
- Patent number 8,318,580
- Issue date Nov 27, 2012
- OmniVision Technologies, Inc.
- John P. McCarten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure to reduce dark current
- Patent number 8,173,535
- Issue date May 8, 2012
- OmniVision Technologies, Inc.
- Cristian A. Tivarus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for gettering in semiconductor substrate
- Patent number 8,133,769
- Issue date Mar 13, 2012
- Truesense Imaging, Inc.
- Cristian A. Tivarus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-illuminated image sensors having both frontside and backside p...
- Patent number 8,076,746
- Issue date Dec 13, 2011
- OmniVision Technologies, Inc.
- John P. McCarten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having multiple sensing layers
- Patent number 8,054,355
- Issue date Nov 8, 2011
- OmniVision Technologies, Inc.
- John P. McCarten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-illuminated image sensors having both frontside and backside p...
- Patent number 8,018,016
- Issue date Sep 13, 2011
- OmniVision Technologies, Inc.
- John P. McCarten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High gain read circuit for 3D integrated pixel
- Patent number 7,965,329
- Issue date Jun 21, 2011
- OmniVision Technologies, Inc.
- John P. McCarten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back illuminated sensor with low crosstalk
- Patent number 7,838,956
- Issue date Nov 23, 2010
- Eastman Kodak Company
- John P. McCarten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked image sensor with shared diffusion regions in respective dr...
- Patent number 7,781,716
- Issue date Aug 24, 2010
- Eastman Kodak Company
- Todd J. Anderson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
ISOLATED WIRE BOND IN INTEGRATED ELECTRICAL COMPONENTS
- Publication number 20110266658
- Publication date Nov 3, 2011
- John P. McCarten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATING WIRE BONDING IN INTEGRATED ELECTRICAL COMPONENTS
- Publication number 20110269292
- Publication date Nov 3, 2011
- John P. McCarten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interwafer interconnects for stacked CMOS image sensors
- Publication number 20110156195
- Publication date Jun 30, 2011
- Cristian A. Tivarus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interwafer interconnects for stacked CMOS image sensors
- Publication number 20110156197
- Publication date Jun 30, 2011
- Cristian A. Tivarus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRUCTURE TO REDUCE DARK CURRENT
- Publication number 20110147879
- Publication date Jun 23, 2011
- Cristian A. Tivarus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of aligning elements in a back-illuminated image sensor
- Publication number 20100330728
- Publication date Dec 30, 2010
- John P. McCarten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Back-illuminated image sensors having both frontside and backside p...
- Publication number 20100327389
- Publication date Dec 30, 2010
- John P. McCarten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-ILLUMINATED IMAGE SENSOR WITH ELECTRICALLY BIASED CONDUCTIVE M...
- Publication number 20100327390
- Publication date Dec 30, 2010
- John P. McCarten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-ILLUMINATED IMAGE SENSOR WITH ELECTRICALLY BIASED FRONTSIDE AN...
- Publication number 20100327391
- Publication date Dec 30, 2010
- John P. McCarten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-ILLUMINATED IMAGE SENSORS HAVING BOTH FRONTSIDE AND BACKSIDE P...
- Publication number 20100327392
- Publication date Dec 30, 2010
- John P. McCarten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Back-illuminated image sensors having both frontside and a backside...
- Publication number 20100327388
- Publication date Dec 30, 2010
- John P. McCarten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRAVIOLET LIGHT FILTER LAYER IN IMAGE SENSORS
- Publication number 20100148291
- Publication date Jun 17, 2010
- Cristian A. Tivarus
- G02 - OPTICS
Information Patent Application
BACK ILLUMINATED SENSOR WITH LOW CROSSTALK
- Publication number 20100148289
- Publication date Jun 17, 2010
- John P. McCarten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-ILLUMINATED CMOS IMAGE SENSORS
- Publication number 20100116971
- Publication date May 13, 2010
- John P. McCarten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING MULTIPLE SENSING LAYERS
- Publication number 20100097514
- Publication date Apr 22, 2010
- John P. McCarten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH GAIN READ CIRCUIT FOR 3D INTEGRATED PIXEL
- Publication number 20100060764
- Publication date Mar 11, 2010
- John P. McCarten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING MULTIPLE SENSING LAYERS
- Publication number 20100026865
- Publication date Feb 4, 2010
- Cristian A. Tivarus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED IMAGE SENSOR WITH SHARED DIFFUSION REGIONS IN RESPECTIVE DR...
- Publication number 20090230287
- Publication date Sep 17, 2009
- Todd J. Anderson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Cristian A. Tivarus

Person

Patents Grantslast 30 patents

Isolated wire bond in integrated electrical components

Back-illuminated CMOS image sensors

Image sensor having multiple sensing layers

Isolating wire bonding in integrated electrical components

Wafer structure to reduce dark current

Methods for gettering in semiconductor substrate

Back-illuminated image sensors having both frontside and backside p...

Image sensor having multiple sensing layers

Back-illuminated image sensors having both frontside and backside p...

High gain read circuit for 3D integrated pixel

Back illuminated sensor with low crosstalk

Stacked image sensor with shared diffusion regions in respective dr...

Patents Applicationslast 30 patents

ISOLATED WIRE BOND IN INTEGRATED ELECTRICAL COMPONENTS

ISOLATING WIRE BONDING IN INTEGRATED ELECTRICAL COMPONENTS

Interwafer interconnects for stacked CMOS image sensors

Interwafer interconnects for stacked CMOS image sensors

WAFER STRUCTURE TO REDUCE DARK CURRENT

Method of aligning elements in a back-illuminated image sensor

Back-illuminated image sensors having both frontside and backside p...

BACK-ILLUMINATED IMAGE SENSOR WITH ELECTRICALLY BIASED CONDUCTIVE M...

BACK-ILLUMINATED IMAGE SENSOR WITH ELECTRICALLY BIASED FRONTSIDE AN...

BACK-ILLUMINATED IMAGE SENSORS HAVING BOTH FRONTSIDE AND BACKSIDE P...

Back-illuminated image sensors having both frontside and a backside...

ULTRAVIOLET LIGHT FILTER LAYER IN IMAGE SENSORS

BACK ILLUMINATED SENSOR WITH LOW CROSSTALK

BACK-ILLUMINATED CMOS IMAGE SENSORS

IMAGE SENSOR HAVING MULTIPLE SENSING LAYERS

HIGH GAIN READ CIRCUIT FOR 3D INTEGRATED PIXEL

IMAGE SENSOR HAVING MULTIPLE SENSING LAYERS

STACKED IMAGE SENSOR WITH SHARED DIFFUSION REGIONS IN RESPECTIVE DR...