Cristina SOMMA

Person

Cinisello Balsamo, IT

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and corresponding method
- Patent number 11,990,442
- Issue date May 21, 2024
- STMicroelectron S.r.l.
- Cristina Somma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SMDs integration on QFN by 3D stacked solution
- Patent number 11,842,948
- Issue date Dec 12, 2023
- STMicroelectronics S.r.l.
- Cristina Somma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with die stacked on surface mounted devices
- Patent number 11,810,839
- Issue date Nov 7, 2023
- STMicroelectronics S.r.l.
- Cristina Somma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assortment of substrates for semiconductor circuits, corresponding...
- Patent number 11,705,388
- Issue date Jul 18, 2023
- STMicroelectronics S.r.l.
- Cristina Somma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with die stacked on surface mounted devices
- Patent number 11,276,628
- Issue date Mar 15, 2022
- STMicroelectronics S.r.l.
- Cristina Somma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SMDS integration on QFN by 3D stacked solution
- Patent number 11,004,775
- Issue date May 11, 2021
- STMicroelectronics S.r.l.
- Cristina Somma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SMDs integration on QFN by 3D stacked solution
- Patent number 10,593,612
- Issue date Mar 17, 2020
- STMicroelectronics S.r.l.
- Cristina Somma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD
- Publication number 20240145364
- Publication date May 2, 2024
- STMicroelectronics S.r.l
- Aurora SANNA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMDS INTEGRATION ON QFN BY 3D STACKED SOLUTION
- Publication number 20240096759
- Publication date Mar 21, 2024
- STMicroelectronics S.r.l.
- Cristina SOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD
- Publication number 20220173064
- Publication date Jun 2, 2022
- STMicroelectronics S.r.l
- Cristina SOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH DIE STACKED ON SURFACE MOUNTED DEVICES
- Publication number 20220173018
- Publication date Jun 2, 2022
- STMicroelectronics S.r.l.
- Cristina SOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMDS INTEGRATION ON QFN BY 3D STACKED SOLUTION
- Publication number 20210249337
- Publication date Aug 12, 2021
- STMicroelectronics S.r.l.
- Cristina SOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSORTMENT OF SUBSTRATES FOR SEMICONDUCTOR CIRCUITS, CORRESPONDING...
- Publication number 20210167029
- Publication date Jun 3, 2021
- STMicroelectronics S.r.l
- Cristina SOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH DIE STACKED ON SURFACE MOUNTED DEVICES
- Publication number 20200219799
- Publication date Jul 9, 2020
- STMicroelectronics S.r.l.
- Cristina SOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMDS INTEGRATION ON QFN BY 3D STACKED SOLUTION
- Publication number 20200176363
- Publication date Jun 4, 2020
- STMicroelectronics S.r.l.
- Cristina SOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMDS INTEGRATION ON QFN BY 3D STACKED SOLUTION
- Publication number 20190287880
- Publication date Sep 19, 2019
- STMicroelectronics S.r.l.
- Cristina SOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH DIE STACKED ON SURFACE MOUNTED DEVICES
- Publication number 20190287881
- Publication date Sep 19, 2019
- STMicroelectronics S.r.l.
- Cristina SOMMA
- H01 - BASIC ELECTRIC ELEMENTS

Cristina SOMMA

Person

Patents Grantslast 30 patents

Semiconductor device and corresponding method

SMDs integration on QFN by 3D stacked solution

Semiconductor package with die stacked on surface mounted devices

Assortment of substrates for semiconductor circuits, corresponding...

Semiconductor package with die stacked on surface mounted devices

SMDS integration on QFN by 3D stacked solution

SMDs integration on QFN by 3D stacked solution

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD

SMDS INTEGRATION ON QFN BY 3D STACKED SOLUTION

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD

SEMICONDUCTOR PACKAGE WITH DIE STACKED ON SURFACE MOUNTED DEVICES

SMDS INTEGRATION ON QFN BY 3D STACKED SOLUTION

ASSORTMENT OF SUBSTRATES FOR SEMICONDUCTOR CIRCUITS, CORRESPONDING...

SEMICONDUCTOR PACKAGE WITH DIE STACKED ON SURFACE MOUNTED DEVICES

SMDS INTEGRATION ON QFN BY 3D STACKED SOLUTION

SMDS INTEGRATION ON QFN BY 3D STACKED SOLUTION

SEMICONDUCTOR PACKAGE WITH DIE STACKED ON SURFACE MOUNTED DEVICES