Curt A Erickson

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Carmel, IN, US

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Patents Grantslast 30 patents

Information Patent Grant
Solder bump input/output pad for a surface mount circuit device
- Patent number 6,184,581
- Issue date Feb 6, 2001
- Delco Electronics Corporation
- Ralph Edward Cornell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip solder bump pad
- Patent number 6,180,265
- Issue date Jan 30, 2001
- Delco Electronics Corporation
- Curt A Erickson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for converting a wire bond pad to a flip chip solder bump p...
- Patent number 5,891,756
- Issue date Apr 6, 1999
- Delco Electronics Corporation
- Curt A Erickson
- H01 - BASIC ELECTRIC ELEMENTS