Curtis R. Olson

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Boise, ID, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of reducing damage to an electron beam inspected semiconduct...
- Patent number 8,563,435
- Issue date Oct 22, 2013
- Micron Technology, Inc.
- David A. Daycock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing electron beam damage on post W-CMP wafers
- Patent number 8,334,209
- Issue date Dec 18, 2012
- Micron Technology, Inc.
- David A. Daycock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and system for rinsing of semiconductor substrates
- Patent number 6,878,213
- Issue date Apr 12, 2005
- SCP Global Technologies, Inc
- John J. Rosato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF REDUCING DAMAGE TO AN ELECTRON BEAM INSPECTED SEMICONDUCT...
- Publication number 20130011940
- Publication date Jan 10, 2013
- Micron Technology, Inc.
- David A. Daycock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of reducing electron beam damage on post W-CMP wafers
- Publication number 20080076263
- Publication date Mar 27, 2008
- Micron Technology, Inc.
- David A. Daycock
- H01 - BASIC ELECTRIC ELEMENTS