Cynthia Susan Milkovich

Person

Vestal, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making an electronic package
- Patent number 7,278,207
- Issue date Oct 9, 2007
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making an electronic package
- Patent number 6,961,995
- Issue date Nov 8, 2005
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip C4 extension structure and process
- Patent number 6,955,982
- Issue date Oct 18, 2005
- International Business Machines Corporation
- Miguel A. Jimarez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip C4 extension structure and process
- Patent number 6,756,680
- Issue date Jun 29, 2004
- International Business Machines Corporation
- Miguel A. Jimarez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip C4 extension structure and process
- Patent number 6,664,637
- Issue date Dec 16, 2003
- International Business Machines Corporation
- Miguel Angel Jimarez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a CTE compensated chip interposer
- Patent number 6,516,513
- Issue date Feb 11, 2003
- International Business Machines Corporation
- Cynthia Susan Milkovich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant layer for encapsulated columns
- Patent number 6,486,415
- Issue date Nov 26, 2002
- International Business Machines Corporation
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
CTE compensated chip interposer
- Patent number 6,399,892
- Issue date Jun 4, 2002
- International Business Machines Corporation
- Cynthia Susan Milkovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip C4 extension structure and process
- Patent number 6,225,206
- Issue date May 1, 2001
- International Business Machines Corporation
- Miguel Angel Jimarez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Encapsulation of solder bumps and solder connections
- Patent number 6,100,114
- Issue date Aug 8, 2000
- International Business Machines Corporation
- Cynthia S. Milkovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package assembly
- Patent number 5,969,945
- Issue date Oct 19, 1999
- International Business Machines Corporation
- Lawrence R. Cutting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board and common heat spreader assembly
- Patent number 5,831,828
- Issue date Nov 3, 1998
- International Business Machines Corporation
- Lawrence R. Cutting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing flexible circuit board assemblies and printer for scr...
- Patent number 5,759,269
- Issue date Jun 2, 1998
- International Business Machines Corporation
- Lawrence R. Cutting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for attaching a flip chip on flexible circuit carrier using...
- Patent number 5,729,896
- Issue date Mar 24, 1998
- International Business Machines Corporation
- Hormazdyar M. Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing flexible circuit board assemblies with common heat sp...
- Patent number 5,638,597
- Issue date Jun 17, 1997
- International Business Machines Corporation
- Lawrence R. Cutting
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of making an electronic package
- Publication number 20070278654
- Publication date Dec 6, 2007
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making an electronic package
- Publication number 20050250249
- Publication date Nov 10, 2005
- Lisa J. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip chip C4 extension structure and process
- Publication number 20040094842
- Publication date May 20, 2004
- Miguel A. Jimarez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Compliant layer for encapsulated columns
- Publication number 20030020150
- Publication date Jan 30, 2003
- International Business Machines Corporation
- Lisa J. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compliant layer for encapsulated cloumns
- Publication number 20020092676
- Publication date Jul 18, 2002
- Lisa J. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making a CTE compensated chip interposer
- Publication number 20020088116
- Publication date Jul 11, 2002
- International Business Machines Corporation
- Cynthia Susan Milkovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip C4 extension structure and process
- Publication number 20010018230
- Publication date Aug 30, 2001
- International Business Machines Corporation
- Miguel A. Jimarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ATTACH ON FLEXIBLE CIRCUIT CARRIER USING CHIP WITH METALL...
- Publication number 20010013423
- Publication date Aug 16, 2001
- HORMAZDYAR M. DALAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip C4 extension structure and process
- Publication number 20010005047
- Publication date Jun 28, 2001
- Miguel Angel Jimarez
- H01 - BASIC ELECTRIC ELEMENTS

Cynthia Susan Milkovich

Person

Patents Grantslast 30 patents

Method of making an electronic package

Method of making an electronic package

Flip chip C4 extension structure and process

Flip chip C4 extension structure and process

Flip chip C4 extension structure and process

Method of making a CTE compensated chip interposer

Compliant layer for encapsulated columns

CTE compensated chip interposer

Flip chip C4 extension structure and process

Encapsulation of solder bumps and solder connections

Electronic package assembly

Flexible circuit board and common heat spreader assembly

Manufacturing flexible circuit board assemblies and printer for scr...

Method for attaching a flip chip on flexible circuit carrier using...

Manufacturing flexible circuit board assemblies with common heat sp...

Patents Applicationslast 30 patents

Method of making an electronic package

Method of making an electronic package

Flip chip C4 extension structure and process

Compliant layer for encapsulated columns

Compliant layer for encapsulated cloumns

Method of making a CTE compensated chip interposer

Flip chip C4 extension structure and process

FLIP CHIP ATTACH ON FLEXIBLE CIRCUIT CARRIER USING CHIP WITH METALL...

Flip chip C4 extension structure and process