Claims
- 1. An electronic package assembly, comprising:
- at least one heat spreader assembly including a first surface having a cavity therein and a second surface having a cavity therein, wherein said first and second surfaces of said heat spreader assembly are located on opposite sides of said heat spreader assembly; and
- a flexible circuit board including first and second thick portions and at least one thin flexible portion interconnecting said first and second thick portions, and including at least two electronic components thereon with at least one of said two electronic components and said second electronic component positioned on said first and second thick portions respectively, said flexible circuit board substantially wound about said at least one heat spreader assembly such that one component on said flexible circuit board is positioned within said cavity in said first surface of said heat spreader assembly in thermal connection to said heat spreader assembly and another component is positioned within said cavity in said second surface of said heat spreader assembly.
- 2. The electronic package assembly of claim 1, further comprising a third electronic component positioned on said thin flexible portion of said flexible circuit board.
- 3. The electronic package assembly of claim 2 wherein at least part of said thin flexible portion of said flexible circuit board is laminated to said heat spreader assembly with a film adhesive.
- 4. The electronic package assembly of claim 3 wherein said third electronic component is positioned over said heat spreader assembly.
Parent Case Info
This is a divisional of copending application Ser. No. 08/071,630 filed on Jun. 3, 1993.
US Referenced Citations (34)
Foreign Referenced Citations (2)
Number |
Date |
Country |
0369919 |
May 1990 |
EPX |
2480488 |
Oct 1981 |
FRX |
Non-Patent Literature Citations (5)
Entry |
IBM Tech. Disc. Bulletin vol. 25 No. 7B Dec. 82 "Integral Heatsink Printed Circuit Card". |
IBM Tech. Disc. Bulletin vol. 21 No. 9 Feb. 79 Multifunction Plug for IC Package. |
IBM Tech. Disc. Bulletin vol. 26 No. 12 May 84' Multilayer Flexible Film Module. |
IBM Tech. Disc. Bulletin vol. 30 No. 3 Aug. 87' "Concept for Forming Multilayer Structures for Electronic Packaging". |
IBM Tech. Disc. Bulletin vol. 32 No. 4A Sep. 89' "Removal of Heat from Direct Chip Attach Circuitry". |
Divisions (1)
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Number |
Date |
Country |
Parent |
071630 |
Jun 1993 |
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