Dae-Jung Byun

Person

Saha-gu, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board
- Patent number 12,219,692
- Issue date Feb 4, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dae Jung Byun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,864,307
- Issue date Jan 2, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dae Jung Byun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board and electronic device including the...
- Patent number 11,758,650
- Issue date Sep 12, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dae Jung Byun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board and substrate including electronic component...
- Patent number 11,744,012
- Issue date Aug 29, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dae Jung Byun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component embedded substrate
- Patent number 11,640,952
- Issue date May 2, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Mi Sun Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate embedded electronic component package
- Patent number 11,631,643
- Issue date Apr 18, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dae Jung Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate having electronic component embedded therein
- Patent number 11,587,878
- Issue date Feb 21, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dae Jung Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cable substrate
- Patent number 11,576,254
- Issue date Feb 7, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jung Soo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate having electronic component embedded therein
- Patent number 11,251,133
- Issue date Feb 15, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dae Jung Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate having electronic component embedded therein
- Patent number 11,183,462
- Issue date Nov 23, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Mi Sun Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate having electronic component embedded therein
- Patent number 11,075,156
- Issue date Jul 27, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dae Jung Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,818,621
- Issue date Oct 27, 2020
- Samsung Electronics Co., Ltd.
- Doo Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,515,916
- Issue date Dec 24, 2019
- Samsung Electronics Co., Ltd.
- Dae Jung Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,276,467
- Issue date Apr 30, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Eun Sil Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,157,868
- Issue date Dec 18, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Dae Jung Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 9,859,222
- Issue date Jan 2, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Jung Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an embedded printed circuit board
- Patent number 8,418,356
- Issue date Apr 16, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Soo Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, method of manufacturing the same, and appara...
- Patent number 8,037,584
- Issue date Oct 18, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Kwang-Soo Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 7,665,206
- Issue date Feb 23, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Kwang-Soo Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240090121
- Publication date Mar 14, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Dae Jung BYUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND SUBSTRATE INCLUDING ELECTRONIC COMPONENT...
- Publication number 20230354513
- Publication date Nov 2, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Dae Jung BYUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CABLE SUBSTRATE
- Publication number 20220174812
- Publication date Jun 2, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Jung Soo KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE...
- Publication number 20220167496
- Publication date May 26, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Dae Jung Byun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN
- Publication number 20220130766
- Publication date Apr 28, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Dae Jung BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220095458
- Publication date Mar 24, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Jung Soo KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220095449
- Publication date Mar 24, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Dae Jung BYUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND SUBSTRATE INCLUDING ELECTRONIC COMPONENT...
- Publication number 20220078905
- Publication date Mar 10, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Dae Jung BYUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE
- Publication number 20210193609
- Publication date Jun 24, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Mi Sun HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN
- Publication number 20210193563
- Publication date Jun 24, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Dae Jung Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN
- Publication number 20210193580
- Publication date Jun 24, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Dae Jung BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE EMBEDDED ELECTRONIC COMPONENT PACKAGE
- Publication number 20210183774
- Publication date Jun 17, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Dae Jung BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN
- Publication number 20210183784
- Publication date Jun 17, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Mi Sun HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20180308815
- Publication date Oct 25, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Dae Jung BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20180061795
- Publication date Mar 1, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Dae Jung BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20170358534
- Publication date Dec 14, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Jung Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20170278766
- Publication date Sep 28, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Eun Sil KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20170278812
- Publication date Sep 28, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Doo Hwan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO DEVICE EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING MET...
- Publication number 20110216515
- Publication date Sep 8, 2011
- Samsung Electro-Mechanics CO., LTD.
- Jin-Won LEE
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRO DEVICE EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURNG METH...
- Publication number 20110214913
- Publication date Sep 8, 2011
- Samsung Electro-Machanics Co., Ltd.
- Jin-Won Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF M...
- Publication number 20110141711
- Publication date Jun 16, 2011
- Samsung Electro-Mechanics CO., LTD.
- Seung-Hyun SOHN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedded printed circuit board and manufacturing method thereof
- Publication number 20090242251
- Publication date Oct 1, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Soo Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and manufacturing method thereof
- Publication number 20080264687
- Publication date Oct 30, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Kwang-Soo Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board, method of manufacturing the same, and appara...
- Publication number 20080257593
- Publication date Oct 23, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Kwang-Soo Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Dae-Jung Byun

Person

Patents Grantslast 30 patents

Printed circuit board

Printed circuit board

Flexible printed circuit board and electronic device including the...

Printed circuit board and substrate including electronic component...

Electronic component embedded substrate

Substrate embedded electronic component package

Substrate having electronic component embedded therein

Cable substrate

Substrate having electronic component embedded therein

Substrate having electronic component embedded therein

Substrate having electronic component embedded therein

Fan-out semiconductor package

Fan-out semiconductor package

Fan-out semiconductor package

Fan-out semiconductor package

Fan-out semiconductor package

Method of manufacturing an embedded printed circuit board

Printed circuit board, method of manufacturing the same, and appara...

Printed circuit board and manufacturing method thereof

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND SUBSTRATE INCLUDING ELECTRONIC COMPONENT...

CABLE SUBSTRATE

FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE...

SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND SUBSTRATE INCLUDING ELECTRONIC COMPONENT...

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE

SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN

SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN

SUBSTRATE EMBEDDED ELECTRONIC COMPONENT PACKAGE

SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN

FAN-OUT SEMICONDUCTOR PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGE

ELECTRO DEVICE EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING MET...

ELECTRO DEVICE EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURNG METH...

ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF M...

Embedded printed circuit board and manufacturing method thereof

Printed circuit board and manufacturing method thereof

Printed circuit board, method of manufacturing the same, and appara...