Dae Keun Park

Person

Irvine, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating an electronic module via compression molding
- Patent number 11,189,542
- Issue date Nov 30, 2021
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-nitride rectifier package
- Patent number 9,142,503
- Issue date Sep 22, 2015
- International Rectifier Corporation
- Chuan Cheah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High voltage cascoded III-nitride rectifier package with stamped le...
- Patent number 8,853,706
- Issue date Oct 7, 2014
- International Rectifier Corporation
- Chuan Cheah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High voltage cascoded III-nitride rectifier package with etched lea...
- Patent number 8,853,707
- Issue date Oct 7, 2014
- International Rectifier Corporation
- Chuan Cheah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High voltage cascoded III-nitride rectifier package
- Patent number 8,790,965
- Issue date Jul 29, 2014
- International Rectifier Corporation
- Chuan Cheah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High voltage cascoded III-nitride rectifier package utilizing clips...
- Patent number 8,546,849
- Issue date Oct 1, 2013
- International Rectifier Corporation
- Chuan Cheah
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC PACKAGE
- Publication number 20240297130
- Publication date Sep 5, 2024
- Skyworks Solutions, Inc.
- Suresh Babu Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240297134
- Publication date Sep 5, 2024
- Skyworks Solutions, Inc.
- Suresh Babu Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Module with Improved Heat Dissipation and Fabrication Th...
- Publication number 20200266121
- Publication date Aug 20, 2020
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insertable Power Unit with Mounting Contacts for Plugging into a Mo...
- Publication number 20160105983
- Publication date Apr 14, 2016
- International Rectifier Corporation
- Eung San Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Unit with Conductive Slats
- Publication number 20160105984
- Publication date Apr 14, 2016
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
III-Nitride Rectifier Package
- Publication number 20140327014
- Publication date Nov 6, 2014
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Voltage Cascoded III-Nitride Rectifier Package
- Publication number 20140030854
- Publication date Jan 30, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Voltage Cascoded III-Nitride Rectifier Package with Stamped Le...
- Publication number 20120280245
- Publication date Nov 8, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Chuan Cheah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
High Voltage Cascoded III-Nitride Rectifier Package with Etched Lea...
- Publication number 20120280246
- Publication date Nov 8, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Chuan Cheah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
High Voltage Cascoded III-Nitride Rectifier Package Utilizing Clips...
- Publication number 20120280247
- Publication date Nov 8, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Chuan Cheah
- H03 - BASIC ELECTRONIC CIRCUITRY

Dae Keun Park

Person

Patents Grantslast 30 patents

Method for fabricating an electronic module via compression molding

III-nitride rectifier package

High voltage cascoded III-nitride rectifier package with stamped le...

High voltage cascoded III-nitride rectifier package with etched lea...

High voltage cascoded III-nitride rectifier package

High voltage cascoded III-nitride rectifier package utilizing clips...

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING AN ELECTRONIC PACKAGE

ELECTRONIC PACKAGE

Electronic Module with Improved Heat Dissipation and Fabrication Th...

Insertable Power Unit with Mounting Contacts for Plugging into a Mo...

Power Unit with Conductive Slats

III-Nitride Rectifier Package

High Voltage Cascoded III-Nitride Rectifier Package

High Voltage Cascoded III-Nitride Rectifier Package with Stamped Le...

High Voltage Cascoded III-Nitride Rectifier Package with Etched Lea...

High Voltage Cascoded III-Nitride Rectifier Package Utilizing Clips...