Daewoong Suh

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Forming a stress compensation layer and structures formed thereby
- Patent number 9,929,080
- Issue date Mar 27, 2018
- Intel Corporation
- Daewoong Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon nanotube-solder composite structures for interconnects, proc...
- Patent number 9,214,420
- Issue date Dec 15, 2015
- Intel Corporation
- Nachiket Raravikar
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Microelectronic package with high temperature thermal interface mat...
- Patent number 9,142,480
- Issue date Sep 22, 2015
- Intel Corporation
- Sabina Houle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic package with self-heating interconnect
- Patent number 8,901,753
- Issue date Dec 2, 2014
- Intel Corporation
- Daewoong Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming carbon nanotubes architectures and composites wi...
- Patent number 8,558,218
- Issue date Oct 15, 2013
- Intel Corporation
- Nachiket Raravikar
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Solder joint reliability in microelectronic packaging
- Patent number 8,436,470
- Issue date May 7, 2013
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming a semiconductor package including a thermal interface material
- Patent number 8,409,929
- Issue date Apr 2, 2013
- Intel Corporation
- Mukul Renavikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with self-heating interconnect
- Patent number 8,378,504
- Issue date Feb 19, 2013
- Intel Corporation
- Daewoong Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon nanotube-solder composite structures for interconnects, proc...
- Patent number 8,344,483
- Issue date Jan 1, 2013
- Intel Corporation
- Nachiket Raravikar
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Methods of fabricating robust integrated heat spreader designs and...
- Patent number 8,174,113
- Issue date May 8, 2012
- Intel Corporation
- Abhishek Gupta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming carbon nanotubes architectures and composites wi...
- Patent number 8,158,968
- Issue date Apr 17, 2012
- Intel Corporation
- Nachiket Raravikar
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of forming an interconnect joint
- Patent number 8,124,517
- Issue date Feb 28, 2012
- Intel Corporation
- Lakshmi Supriya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carbon nanotubes solder composite for high performance interconnect
- Patent number 8,100,314
- Issue date Jan 24, 2012
- Intel Corporation
- Daewoong Suh
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Forming a semiconductor package including a thermal interface material
- Patent number 8,030,757
- Issue date Oct 4, 2011
- Intel Corporation
- Mukul Renavikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder joint reliability in microelectronic packaging
- Patent number 8,018,063
- Issue date Sep 13, 2011
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductor using bulk metallic glass material
- Patent number 7,986,209
- Issue date Jul 26, 2011
- Intel Corporation
- Chang-min Park
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Carbon nanotube coated capacitor electrodes
- Patent number 7,983,020
- Issue date Jul 19, 2011
- Intel Corporation
- Yongki Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatuses for providing stacked-die devices
- Patent number 7,867,818
- Issue date Jan 11, 2011
- Daewoong Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder foams, nano-porous solders, foamed-solder bumps in chip pack...
- Patent number 7,745,013
- Issue date Jun 29, 2010
- Intel Corporation
- Heeman Choe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reactive gettering in phase change solders to inhibit oxidation at...
- Patent number 7,727,815
- Issue date Jun 1, 2010
- Intel Corporation
- Chad A. Kumaus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package interconnect and method of fabrication thereof
- Patent number 7,727,814
- Issue date Jun 1, 2010
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carbon nanotube-solder composite structures for interconnects, proc...
- Patent number 7,713,858
- Issue date May 11, 2010
- Intel Corporation
- Nachiket Raravikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon nanotube coated capacitor electrodes
- Patent number 7,710,709
- Issue date May 4, 2010
- Intel Corporation
- Yongki Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bulk metallic glass solders, foamed bulk metallic glass solders, fo...
- Patent number 7,705,458
- Issue date Apr 27, 2010
- Intel Corporation
- Daewoong Suh
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Solder joint reliability in microelectronic packaging
- Patent number 7,700,476
- Issue date Apr 20, 2010
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering an electronics package to a motherboard
- Patent number 7,699,210
- Issue date Apr 20, 2010
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-die metal vias with a dispersed phase of graphitic structur...
- Patent number 7,666,768
- Issue date Feb 23, 2010
- Intel Corporation
- Nachiket R. Raravikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material for combined reflow
- Patent number 7,629,203
- Issue date Dec 8, 2009
- Intel Corporation
- Daewoong Suh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bulk metallic glass solder material
- Patent number 7,628,871
- Issue date Dec 8, 2009
- Intel Corporation
- Daewoong Suh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solders with intermetallic phases, solder bumps made thereof, packa...
- Patent number 7,578,966
- Issue date Aug 25, 2009
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FORMING A STRESS COMPENSATION LAYER AND STRUCTURES FORMED THEREBY
- Publication number 20180182697
- Publication date Jun 28, 2018
- Intel Corporation
- Daewoong SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH SELF-HEATING INTERCONNECT
- Publication number 20130134587
- Publication date May 30, 2013
- Daewoong Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING CARBON NANOTUBES ARCHITECTURES AND COMPOSITES WI...
- Publication number 20120148842
- Publication date Jun 14, 2012
- Nachiket Raravikar
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Forming A Semiconductor Package Including A Thermal Interface Material
- Publication number 20110312131
- Publication date Dec 22, 2011
- Mukul Renavikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER JOINT RELIABILITY IN MICROELECTRONIC PACKAGING
- Publication number 20110051376
- Publication date Mar 3, 2011
- INTEL, INC.
- Daewoong Suh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF FORMING AN INTERCONNECT JOINT
- Publication number 20100276474
- Publication date Nov 4, 2010
- Lakshmi Supriya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARBON NANOTUBE-SOLDER COMPOSITE STRUCTURES FOR INTERCONNECTS, PROC...
- Publication number 20100219511
- Publication date Sep 2, 2010
- Nachiket Raravikar
- B82 - NANO-TECHNOLOGY
Information Patent Application
Carbon nanotube coated capacitor electrodes
- Publication number 20100177475
- Publication date Jul 15, 2010
- Yongki Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBES SOLDER COMPOSITE FOR HIGH PERFORMANCE INTERCONNECT
- Publication number 20100126631
- Publication date May 27, 2010
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of fabricating robust integrated heat spreader designs and...
- Publication number 20100065246
- Publication date Mar 18, 2010
- Abhishek Gupta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER JOINT RELIABILITY IN MICROELECTRONIC PACKAGING
- Publication number 20100044848
- Publication date Feb 25, 2010
- Daewoong Suh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MICROELECTRONIC PACKAGE WITH HIGH TEMPERATURE THERMAL INTERFACE MAT...
- Publication number 20100039777
- Publication date Feb 18, 2010
- Sabina Houle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BULK METALLIC GLASS SOLDER MATERIAL
- Publication number 20100037990
- Publication date Feb 18, 2010
- Daewoong Suh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC PACKAGE WITH SELF-HEATING INTERCONNECT
- Publication number 20090321962
- Publication date Dec 31, 2009
- Daewoong Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL FOR COMBINED REFLOW
- Publication number 20090244850
- Publication date Oct 1, 2009
- Daewoong Suh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW STRESS, LOW-TEMPERATURE METAL-METAL COMPOSITE FLIP CHIP INTERCO...
- Publication number 20090242121
- Publication date Oct 1, 2009
- Daewoong Suh
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
INDUCTOR USING BULK METALLIC GLASS MATERIAL
- Publication number 20090128274
- Publication date May 21, 2009
- Chang-min Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic package interconnect and method of fabrication thereof
- Publication number 20090068830
- Publication date Mar 12, 2009
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IN-SITU CHIP ATTACHMENT USING SELF-ORGANIZING SOLDER
- Publication number 20090057378
- Publication date Mar 5, 2009
- Chi-Won Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKING OF INTEGRATED CIRCUITS USING GLASSY METAL BONDING
- Publication number 20090032970
- Publication date Feb 5, 2009
- Chang-Min Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PREFORM FOR FAST TRANSIENT LIQUID PHASE BONDING
- Publication number 20090004500
- Publication date Jan 1, 2009
- Daewoong Suh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Forming a semiconductor package including a thermal interface material
- Publication number 20090001557
- Publication date Jan 1, 2009
- Mukul Renavikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN INTERCONNECT JOINT
- Publication number 20080311738
- Publication date Dec 18, 2008
- Lakshmi Supriya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARBON NANOTUBE COATED CAPACITOR ELECTRODES
- Publication number 20080239620
- Publication date Oct 2, 2008
- Yongki Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A CORED METALLIC THERMAL INTERFACE MATERIAL AND...
- Publication number 20080233682
- Publication date Sep 25, 2008
- Daewoong Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING CARBON NANOTUBES ARCHITECTURES AND COMPOSITES WI...
- Publication number 20080233396
- Publication date Sep 25, 2008
- Nachiket Raravikar
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Microelectronic substrate including bumping sites with nanostructures
- Publication number 20080224327
- Publication date Sep 18, 2008
- Daewoong Suh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of making an interconnect structure
- Publication number 20080227294
- Publication date Sep 18, 2008
- Daewoong Suh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Thermal interface materials
- Publication number 20080225490
- Publication date Sep 18, 2008
- Daewoong Suh
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Nanostructure-Based Package Interconnect
- Publication number 20080185718
- Publication date Aug 7, 2008
- Daewoong Suh
- H01 - BASIC ELECTRIC ELEMENTS

Daewoong Suh

Person

Patents Grantslast 30 patents

Forming a stress compensation layer and structures formed thereby

Carbon nanotube-solder composite structures for interconnects, proc...

Microelectronic package with high temperature thermal interface mat...

Microelectronic package with self-heating interconnect

Methods of forming carbon nanotubes architectures and composites wi...

Solder joint reliability in microelectronic packaging

Forming a semiconductor package including a thermal interface material

Microelectronic package with self-heating interconnect

Carbon nanotube-solder composite structures for interconnects, proc...

Methods of fabricating robust integrated heat spreader designs and...

Methods of forming carbon nanotubes architectures and composites wi...

Method of forming an interconnect joint

Carbon nanotubes solder composite for high performance interconnect

Forming a semiconductor package including a thermal interface material

Solder joint reliability in microelectronic packaging

Inductor using bulk metallic glass material

Carbon nanotube coated capacitor electrodes

Methods and apparatuses for providing stacked-die devices

Solder foams, nano-porous solders, foamed-solder bumps in chip pack...

Reactive gettering in phase change solders to inhibit oxidation at...

Microelectronic package interconnect and method of fabrication thereof

Carbon nanotube-solder composite structures for interconnects, proc...

Carbon nanotube coated capacitor electrodes

Bulk metallic glass solders, foamed bulk metallic glass solders, fo...

Solder joint reliability in microelectronic packaging

Soldering an electronics package to a motherboard

Through-die metal vias with a dispersed phase of graphitic structur...

Thermal interface material for combined reflow

Bulk metallic glass solder material

Solders with intermetallic phases, solder bumps made thereof, packa...

Patents Applicationslast 30 patents

FORMING A STRESS COMPENSATION LAYER AND STRUCTURES FORMED THEREBY

MICROELECTRONIC PACKAGE WITH SELF-HEATING INTERCONNECT

METHODS OF FORMING CARBON NANOTUBES ARCHITECTURES AND COMPOSITES WI...

Forming A Semiconductor Package Including A Thermal Interface Material

SOLDER JOINT RELIABILITY IN MICROELECTRONIC PACKAGING

METHOD OF FORMING AN INTERCONNECT JOINT

CARBON NANOTUBE-SOLDER COMPOSITE STRUCTURES FOR INTERCONNECTS, PROC...

Carbon nanotube coated capacitor electrodes

CARBON NANOTUBES SOLDER COMPOSITE FOR HIGH PERFORMANCE INTERCONNECT

Methods of fabricating robust integrated heat spreader designs and...

SOLDER JOINT RELIABILITY IN MICROELECTRONIC PACKAGING

MICROELECTRONIC PACKAGE WITH HIGH TEMPERATURE THERMAL INTERFACE MAT...

BULK METALLIC GLASS SOLDER MATERIAL

MICROELECTRONIC PACKAGE WITH SELF-HEATING INTERCONNECT

THERMAL INTERFACE MATERIAL FOR COMBINED REFLOW

LOW STRESS, LOW-TEMPERATURE METAL-METAL COMPOSITE FLIP CHIP INTERCO...

INDUCTOR USING BULK METALLIC GLASS MATERIAL

Microelectronic package interconnect and method of fabrication thereof

IN-SITU CHIP ATTACHMENT USING SELF-ORGANIZING SOLDER

STACKING OF INTEGRATED CIRCUITS USING GLASSY METAL BONDING

MULTILAYER PREFORM FOR FAST TRANSIENT LIQUID PHASE BONDING

Forming a semiconductor package including a thermal interface material

METHOD OF FORMING AN INTERCONNECT JOINT

CARBON NANOTUBE COATED CAPACITOR ELECTRODES

METHODS OF FORMING A CORED METALLIC THERMAL INTERFACE MATERIAL AND...

METHODS OF FORMING CARBON NANOTUBES ARCHITECTURES AND COMPOSITES WI...

Microelectronic substrate including bumping sites with nanostructures

Method of making an interconnect structure

Thermal interface materials

Nanostructure-Based Package Interconnect