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Dai Nakajima

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    ALUMINUM BONDING WIRE FOR POWER SEMICONDUCTOR
    • Publication number 20240105667
    • Publication date Mar 28, 2024
    • TANAKA DENSHI KOGYO K.K.
    • Shuichi MITOMA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Semiconductor Device and Method of Manufacturing the Same
    • Publication number 20200043824
    • Publication date Feb 6, 2020
    • Mitsubishi Electric Corporation
    • Haruna TADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THERMAL CONDUCTIVITY MEASUREMENT DEVICE AND THERMAL CONDUCTIVITY ME...
    • Publication number 20190369038
    • Publication date Dec 5, 2019
    • MITSUBISHI ELECTRIC CORPORATION
    • Haruna Tada
    • G01 - MEASURING TESTING
  • Information Patent Application

    Semiconductor Device and Method for Manufacturing the Same
    • Publication number 20190295919
    • Publication date Sep 26, 2019
    • MITSUBISHI ELECTRIC CORPORATION
    • Yasuyuki Sanda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE, POWER SEMICONDUCTOR DEVICE AND POWER MODULE MANUFACTU...
    • Publication number 20190067154
    • Publication date Feb 28, 2019
    • MITSUBISHI ELECTRIC CORPORATION
    • Hiroyuki Yoshihara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING POWER SEMIC...
    • Publication number 20190006265
    • Publication date Jan 3, 2019
    • MITSUBISHI ELECTRIC CORPORATION
    • Takayuki Yamada
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THERMAL CONDUCTIVITY MEASUREMENT APPARATUS AND THERMAL CONDUCTIVITY...
    • Publication number 20180299391
    • Publication date Oct 18, 2018
    • MITSUBISHI ELECTRIC CORPORATION
    • Yasuyuki SANDA
    • G01 - MEASURING TESTING
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20180261520
    • Publication date Sep 13, 2018
    • MITSUBISHI ELECTRIC CORPORATION
    • Kei YAMAMOTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SWAGED HEAT SINK AND HEAT SINK INTEGRATED POWER MODULE
    • Publication number 20160225691
    • Publication date Aug 4, 2016
    • MITSUBISHI ELECTRIC CORPORATION
    • Yasuyuki SANDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER SEMICONDUCTOR DEVICE
    • Publication number 20150287670
    • Publication date Oct 8, 2015
    • Mitsubishi Electric Corporation
    • Tatsuya Fukase
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRIC ROTATING MACHINE
    • Publication number 20140361648
    • Publication date Dec 11, 2014
    • MITSUBISHI ELECTRIC CORPORATION
    • Yuji Shirakata
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    ELECTRIC POWER SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
    • Publication number 20140293548
    • Publication date Oct 2, 2014
    • Mitsubishi Electric Corporation
    • Noriyuki Besshi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ROTATING ELECTRICAL MACHINE
    • Publication number 20140145526
    • Publication date May 29, 2014
    • MITSUBISHI ELECTRIC CORPORATION
    • Yuji Shirakata
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    ROTARY ELECTRIC MACHINE
    • Publication number 20140125168
    • Publication date May 8, 2014
    • MITSUBISHI ELECTRIC CORPORATION
    • Tatsuya Fukase
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    ROTATING ELECTRICAL MACHINE
    • Publication number 20140035431
    • Publication date Feb 6, 2014
    • MITSUBISHI ELECTRIC CORPORATION
    • Tatsuya Fukase
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    ELECTRIC ROTATING MACHINE
    • Publication number 20140001915
    • Publication date Jan 2, 2014
    • MITSUBISHI ELECTRIC CORPORATION
    • Tatsuya Fukase
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    POWER SEMICONDUCTOR MODULE
    • Publication number 20130221516
    • Publication date Aug 29, 2013
    • MITSUBISHI ELECTRIC CORPORATION
    • Shinsuke Asada
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ROTATING ELECTRICAL MACHINE
    • Publication number 20130221890
    • Publication date Aug 29, 2013
    • MITSUBISHI ELECTRIC CORPORATION
    • Yuji Shirakata
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    REFLOW SOLDERING DEVICE AND REFLOW SOLDERING METHOD
    • Publication number 20130200136
    • Publication date Aug 8, 2013
    • Mitsubishi Electric Corporation
    • Noriyuki Besshi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    POWER SUPPLY UNIT-INTEGRATED DYNAMOELECTRIC MACHINE
    • Publication number 20110193432
    • Publication date Aug 11, 2011
    • Mitsubishi Electric Corporation
    • Atsushi TAKECHI
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    CONTROL APPARATUS-INTEGRATED DYNAMOELECTRIC MACHINE
    • Publication number 20110175496
    • Publication date Jul 21, 2011
    • Mitsubishi Electric Corporation
    • Yuji SHIRAKATA
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20070187819
    • Publication date Aug 16, 2007
    • MITSUBISHI ELECTRIC CORPORATION
    • Dai NAKAJIMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Capacitor module and semiconductor
    • Publication number 20050041369
    • Publication date Feb 24, 2005
    • Mitsubishi Denki Kabushiki Kaisha
    • Tohru Kimura
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Electric power semiconductor device
    • Publication number 20040251528
    • Publication date Dec 16, 2004
    • Mitsubishi Denki Kabushiki Kaisha
    • Masao Kikuchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Power module
    • Publication number 20040179341
    • Publication date Sep 16, 2004
    • Mitsubishi Denki Kabushiki Kaisha
    • Nobuyoshi Kimoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RESIN-SEALED SEMICONDUCTOR DEVICE
    • Publication number 20040108602
    • Publication date Jun 10, 2004
    • Mitsubishi Denki Kabushiki Kaisha
    • Dai Nakajima
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Mold resin-sealed power semiconductor device having insulating resi...
    • Publication number 20040089928
    • Publication date May 13, 2004
    • Mitsubishi Denki Kabushiki Kaisha
    • Dai Nakajima
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Power semiconductor device
    • Publication number 20040089931
    • Publication date May 13, 2004
    • Mitsubishi Denki Kabushiki Kaisha
    • Dai Nakajima
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Power semiconductor device
    • Publication number 20030213979
    • Publication date Nov 20, 2003
    • Mitsubishi Denki Kabushiki Kaisha
    • Dai Nakajima
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor device
    • Publication number 20030197255
    • Publication date Oct 23, 2003
    • Mitsubishi Denki Kabushiki Kaisha
    • Dai Nakajima
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR