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Daiji IKEDA

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  • Himeji-shi, Hyogo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Conductor material
    • Patent number 12,073,957
    • Issue date Aug 27, 2024
    • The University of Tokyo
    • Toshihiro Okamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Dopant and conductor material
    • Patent number 12,049,540
    • Issue date Jul 30, 2024
    • The University of Tokyo
    • Toshihiro Okamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Dopant, electroconductive composition and method for producing same
    • Patent number 12,046,390
    • Issue date Jul 23, 2024
    • The University of Tokyo
    • Toshihiro Okamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Conductor material
    • Patent number 12,009,115
    • Issue date Jun 11, 2024
    • The University of Tokyo
    • Toshihiro Okamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of manufacturing composite molded body
    • Patent number 11,267,171
    • Issue date Mar 8, 2022
    • Daicel Polymer Ltd.
    • Daiji Ikeda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Composite molded article
    • Patent number 10,434,741
    • Issue date Oct 8, 2019
    • Daicel Polymer Ltd.
    • Daiji Ikeda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of manufacturing composite molded body
    • Patent number 10,322,535
    • Issue date Jun 18, 2019
    • DAICEL POLYMER LTD.
    • Daiji Ikeda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents