Daisuke Iwai

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Ceramic electronic component and circuit board
- Patent number 11,996,245
- Issue date May 28, 2024
- Taiyo Yuden Co., Ltd.
- Eriko Numata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component and circuit board includin...
- Patent number 11,967,467
- Issue date Apr 23, 2024
- Taiyo Yuden Co., Ltd.
- Fumi Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor using molybdenum (Mo) ground layer and...
- Patent number 11,011,312
- Issue date May 18, 2021
- Taiyo Yuden Co., Ltd.
- Daisuke Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor, circuit substrate and manufacturing m...
- Patent number 11,004,605
- Issue date May 11, 2021
- Taiyo Yuden Co., Ltd.
- Michio Oshima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER CERAMIC ELECTRONIC DEVICE, MANUFACTURING METHOD OF THE S...
- Publication number 20240412924
- Publication date Dec 12, 2024
- Taiyo Yuden Co., Ltd.
- Daisuke IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC ELECTRONIC COMPONENT AND CIRCUIT BOARD
- Publication number 20240274367
- Publication date Aug 15, 2024
- Taiyo Yuden Co., Ltd.
- Eriko NUMATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC ELECTRONIC COMPONENT AND CIRCUIT BOARD
- Publication number 20230104406
- Publication date Apr 6, 2023
- Taiyo Yuden Co., Ltd.
- Eriko NUMATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND CIRCUIT BOARD INCLUDIN...
- Publication number 20230086815
- Publication date Mar 23, 2023
- Taiyo Yuden Co., Ltd.
- Fumi MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220020534
- Publication date Jan 20, 2022
- Taiyo Yuden Co., Ltd.
- Shunya FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND MANUFACTURING METHOD OF THE SAME
- Publication number 20190378655
- Publication date Dec 12, 2019
- Taiyo Yuden Co., Ltd.
- Daisuke IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR, CIRCUIT SUBSTRATE AND MANUFACTURING M...
- Publication number 20190244758
- Publication date Aug 8, 2019
- Taiyo Yuden Co., Ltd.
- Michio OSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CERAMIC CAPACITOR
- Publication number 20180151295
- Publication date May 31, 2018
- Taiyo Yuden Co., Ltd.
- Daisuke Iwai
- H01 - BASIC ELECTRIC ELEMENTS

Daisuke Iwai

Person

Patents Grantslast 30 patents

Ceramic electronic component and circuit board

Multi-layer ceramic electronic component and circuit board includin...

Multilayer ceramic capacitor using molybdenum (Mo) ground layer and...

Multilayer ceramic capacitor, circuit substrate and manufacturing m...

Patents Applicationslast 30 patents

MULTILAYER CERAMIC ELECTRONIC DEVICE, MANUFACTURING METHOD OF THE S...

CERAMIC ELECTRONIC COMPONENT AND CIRCUIT BOARD

CERAMIC ELECTRONIC COMPONENT AND CIRCUIT BOARD

MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND CIRCUIT BOARD INCLUDIN...

CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

MULTILAYER CERAMIC CAPACITOR AND MANUFACTURING METHOD OF THE SAME

MULTILAYER CERAMIC CAPACITOR, CIRCUIT SUBSTRATE AND MANUFACTURING M...

MULTI-LAYER CERAMIC CAPACITOR