Daisuke Orino

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Shizuoka-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Thermosetting low-dielectric resin composition and use thereof
- Patent number 6,713,143
- Issue date Mar 30, 2004
- Tomegawa Paper Co., Ltd.
- Takeshi Hashimoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermoplastic resin composition having low permittivity, prepreg, l...
- Patent number 6,492,030
- Issue date Dec 10, 2002
- Tomoegawa Paper Co., Ltd.
- Takeshi Hashimoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting low-dielectric resin composition and use thereof
- Patent number 6,346,598
- Issue date Feb 12, 2002
- Tomoegawa Paper Co., Ltd.
- Takeshi Hashimoto
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
Thermosetting low-dielectric resin composition and use thereof
- Publication number 20020106521
- Publication date Aug 8, 2002
- Takeshi Hashimoto
- B32 - LAYERED PRODUCTS