Claims
- 1. A laminated board comprising a prepreg sheet or prepreg sheets prepared by impregnating a reinforcing fiber material with the thermosetting low-dielectric resin composition comprising a component (a): siloxane-modified polyimide, component (b): a compound containing 2 methylallyl groups and having the following formula (1) or a compound containing 3 allyl groups or 3 methylallyl groups and having the following formula (1A), and component (c): a compound containing at least 2 maleimide groups.
- 2. The laminated board according to claim 1, wherein the laminated board is a metal-clad laminate formed of the laminated board and a metal foil or foils which is or are stacked on and integrated with one surface or both surfaces of the laminated board.
- 3. The laminated board according to claim 2, wherein the metal-clad laminate is formed of a sheet or sheets of a prepreg impregnated with the thermosetting low-dielectric resin composition in a semi-cured state or a cured state and a metal foil or metal foils is/are laminated on and integrated with the prepreg.
- 4. The laminated board according to claim 1, wherein the reinforcing fiber material is a fabric or a non-woven fabric formed of at least one member selected from the group consisting of an aramid fiber, an aromatic polyester fiber and a tetrafluorocarbon fiber.
- 5. The laminated board according to claim 1, wherein the metal foil is a metal foil formed of at least one member selected from the group consisting of copper, cupronickel, silver, iron, 42 alloy and stainless steel.
- 6. A circuit laminate material comprising either a peeling-off layer or a metal foil and the thermosetting low-dielectric resin composition comprising a component (a): siloxane-modified polyimide, component (b): a compound containing 2 methylallyl groups and having the following formula (1) or a compound containing 3 allyl groups or 3 methylallyl groups and having the following formula (1A), and component (c): a compound containing at least 2 maleimide groups.
- 7. The circuit laminate material according to claim 6, wherein the siloxane-modified polyimide as a component (a) contains 90 to 40 mol % of at least one of structural units of the following formula (2a) and 10 to 60 mol % of at least one of structural units of the following formula (2b) when the component (b) is the compound of the formula (1).
- 8. The circuit laminate material according to claim 6, wherein the siloxane-modified polyimide as a component (a) contains 90 to 40 mol % of at least one of structural units of the following formula (2a′) and 10 to 60 mol % of structural units of the following formula (2b′) when the component (b) has the formula (1A).
- 9. The circuit laminate material according to claim 6, wherein the siloxane-modified polyimide as a component (a) contains 90 to 40 mol % of at least one of structural units of the following formula (2a) and 10 to 60 mol % of structural units of the following formula (2b) when the component (b) has the formula (1A).
- 10. The circuit laminate material according to claim 6, wherein the metal foil has a thickness of 10 to 300 μm.
- 11. The circuit laminate material according to claim 6, wherein the adhesive layer has a peeling-off layer formed on one surface opposite to the metal foil or the film.
Priority Claims (4)
Number |
Date |
Country |
Kind |
331977/98 |
Nov 1998 |
JP |
|
331978/98 |
Nov 1998 |
JP |
|
331979/98 |
Nov 1998 |
JP |
|
331980/98 |
Nov 1998 |
JP |
|
Parent Case Info
[0001] This is a divisional of Ser. No. 09/433,821, filed Nov. 3, 1999.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09433281 |
Nov 1999 |
US |
Child |
10029991 |
Dec 2001 |
US |