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Dale A. Witte
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Wentzville, MO, US
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Patents Grants
last 30 patents
Information
Patent Grant
Systems and methods for manufacturing diamond coated wires
Patent number
9,873,159
Issue date
Jan 23, 2018
Corner Star Limited
Omid Rezvanian
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods for producing rectangular seeds for ingot growth
Patent number
9,499,920
Issue date
Nov 22, 2016
MEMC Singapore Pte. Ltd. (UEN200614794D)
Jihong John Chen
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Grant
Methods for producing rectangular seeds for ingot growth
Patent number
9,111,745
Issue date
Aug 18, 2015
MEMC Singapore Pte., Ltd. (UEN200614794D)
Jihong John Chen
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Grant
Systems and methods for producing seed bricks
Patent number
8,900,972
Issue date
Dec 2, 2014
MEMC Singapore Pte. Ltd.
Dale A. Witte
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods for in-situ passivation of silicon-on-insulator wafers
Patent number
8,859,393
Issue date
Oct 14, 2014
SunEdison Semiconductor Limited
Michael J. Ries
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for cleaving a bonded wafer pair
Patent number
8,845,859
Issue date
Sep 30, 2014
Sunedison Semiconductor Limited (UEN201334164H)
Michael John Ries
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for the preparation of a multi-layered crystalline structure
Patent number
8,367,519
Issue date
Feb 5, 2013
MEMC Electronic Materials, Inc.
Dale A. Witte
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Process for reducing waviness in semiconductor wafers
Patent number
6,200,908
Issue date
Mar 13, 2001
MEMC Electronic Materials, Inc.
Roland Vandamme
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of slicing silicon wafers for laser marking
Patent number
6,112,738
Issue date
Sep 5, 2000
MEMC Electronics Materials, Inc.
Dale A. Witte
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Grant
Method of measuring waviness in silicon wafers
Patent number
6,057,170
Issue date
May 2, 2000
MEMC Electronic Materials, Inc.
Dale Andrew Witte
G01 - MEASURING TESTING
Patents Applications
last 30 patents
Information
Patent Application
METHODS FOR PRODUCING DIAMOND GRITS FOR A WAFER SLICING SYSTEM
Publication number
20180117690
Publication date
May 3, 2018
Corner Star Limited
Omid Rezvanian
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SYSTEMS AND METHODS FOR MANUFACTURING DIAMOND COATED WIRES
Publication number
20160184909
Publication date
Jun 30, 2016
SunEdison, Inc.
Omid Rezvanian
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHODS FOR PRODUCING RECTANGULAR SEEDS FOR INGOT GROWTH
Publication number
20150308011
Publication date
Oct 29, 2015
MEMC SINGAPORE PTE. LTD. (UEN200614794D)
Jihong John Chen
C30 - CRYSTAL GROWTH
Information
Patent Application
Methods For Producing Rectangular Seeds For Ingot Growth
Publication number
20140182776
Publication date
Jul 3, 2014
MEMC SINGAPORE, PTE. LTD (UEN200614797D)
Jihong John Chen
C30 - CRYSTAL GROWTH
Information
Patent Application
Apparatus For Producing Rectangular Seeds
Publication number
20140186486
Publication date
Jul 3, 2014
MEMC SINGAPORE, PTE. LTD (UEN200614797D)
Jihong John Chen
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Application
Systems and Methods for Producing Seed Bricks
Publication number
20140137395
Publication date
May 22, 2014
MEMC SINGAPORE, PTE. LTD (UEN200614797D)
Dale A. Witte
C30 - CRYSTAL GROWTH
Information
Patent Application
Method of Preparing A Directional Solidification System Furnace
Publication number
20140137794
Publication date
May 22, 2014
MEMC SINGAPORE, PTE. LTD (UEN200614797D)
Dale A. Witte
C30 - CRYSTAL GROWTH
Information
Patent Application
METHOD FOR THE PREPARATION OF A MULTI-LAYERED CRYSTALLINE STRUCTURE
Publication number
20130137241
Publication date
May 30, 2013
MEMC Electronic Materials, Inc.
Dale A. Witte
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Systems and Methods for Cleaving A Bonded Wafer Pair
Publication number
20130062020
Publication date
Mar 14, 2013
MEMC Electronic Materials, Inc.
Michael John Ries
B32 - LAYERED PRODUCTS
Information
Patent Application
Methods For In-Situ Passivation Of Silicon-On-Insulator Wafers
Publication number
20120003814
Publication date
Jan 5, 2012
MEMC Electronic Materials, Inc.
Michael J. Ries
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR THE PREPARATION OF A MULTI-LAYERED CRYSTALLINE STRUCTURE
Publication number
20110159665
Publication date
Jun 30, 2011
MEMC Electronic Materials, Inc.
Dale A. Witte
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and apparatus for slicing semiconductor wafers
Publication number
20030170948
Publication date
Sep 11, 2003
MEMC Electronic Materials, Inc.
Milind S. Bhagavat
B28 - WORKING CEMENT, CLAY, OR STONE