Damien SAINT-PATRICE

Person

Chabeuil, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Electromechanical microsystem
- Patent number 11,999,613
- Issue date Jun 4, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Laurent Mollard
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
RF/DC decoupling system for RF switches based on phase change material
- Patent number 10,644,067
- Issue date May 5, 2020
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Bruno Reig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure of a microelectronic device having a hermeticit...
- Patent number 10,532,924
- Issue date Jan 14, 2020
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Damien Saint-Patrice
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Switch including a phase change materials based structure where onl...
- Patent number 10,529,515
- Issue date Jan 7, 2020
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Gabriele Navarro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a closed cavity comprising a flap protecting the c...
- Patent number 10,414,648
- Issue date Sep 17, 2019
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Bruno Reig
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Commutator structure comprising several channels of phase change ma...
- Patent number 9,934,922
- Issue date Apr 3, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Bruno Reig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging a microelectronic device in a hermetically sea...
- Patent number 9,908,773
- Issue date Mar 6, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Damien Saint-Patrice
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of hermetically sealing a hole with a fuse material
- Patent number 9,199,839
- Issue date Dec 1, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean-Louis Pornin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for metalizing blind vias
- Patent number 9,003,654
- Issue date Apr 14, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Fabrice Jacquet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a connection component with hollow inserts
- Patent number 8,898,896
- Issue date Dec 2, 2014
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Francois Marion
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structure with cavity having one or several contact ri...
- Patent number 8,674,489
- Issue date Mar 18, 2014
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Sebastien Bolis
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Interconnect structure comprising blind vias intended to be metalized
- Patent number 8,482,130
- Issue date Jul 9, 2013
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Damien Saint-Patrice
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a cavity in the thickness of a substrate which ma...
- Patent number 8,470,184
- Issue date Jun 25, 2013
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Damien Saint-Patrice
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
ELECTROMECHANICAL MICROSYSTEM
- Publication number 20240034616
- Publication date Feb 1, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Laurent MOLLARD
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTROMECHANICAL MICROSYSTEM
- Publication number 20220380205
- Publication date Dec 1, 2022
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Laurent MOLLARD
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTROMECHANICAL MICROSYSTEM
- Publication number 20220380207
- Publication date Dec 1, 2022
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Laurent MOLLARD
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTROMECHANICAL MICROSYSTEM
- Publication number 20220380206
- Publication date Dec 1, 2022
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Laurent MOLLARD
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTROMECHANICAL MICROSYSTEM
- Publication number 20220197014
- Publication date Jun 23, 2022
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Laurent MOLLARD
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTROMECHANICAL MICROSYSTEM
- Publication number 20220197013
- Publication date Jun 23, 2022
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Laurent MOLLARD
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
RF/DC DECOUPLING SYSTEM FOR RF SWITCHES BASED ON PHASE CHANGE MATERIAL
- Publication number 20190088721
- Publication date Mar 21, 2019
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Bruno REIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCH INCLUDING A PHASE CHANGE MATERIALS BASED STRUCTURE WHERE ONL...
- Publication number 20180005786
- Publication date Jan 4, 2018
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Gabriele NAVARRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMUTATOR STRUCTURE COMPRISING SEVERAL CHANNELS OF PHASE CHANGE MA...
- Publication number 20170256377
- Publication date Sep 7, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Bruno REIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A CLOSED CAVITY COMPRISING A FLAP PROTECTING THE C...
- Publication number 20170183224
- Publication date Jun 29, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Bruno REIG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURING A MICROELECTRON...
- Publication number 20170144883
- Publication date May 25, 2017
- EPCOS AG
- Gudrun HENN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING STRUCTURE OF A MICROELECTRONIC DEVICE HAVING A HERMETICIT...
- Publication number 20170057809
- Publication date Mar 2, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Damien SAINT-PATRICE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF HERMETICALLY SEALING A HOLE WITH A FUSE MATERIAL
- Publication number 20150158725
- Publication date Jun 11, 2015
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.
- Jean-Louis PORNIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MAKING A CAVITY IN THE THICKNESS OF A SUBSTRATE WHICH MA...
- Publication number 20120031874
- Publication date Feb 9, 2012
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.
- Damien Saint-Patrice
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTERCONNECT STRUCTURE COMPRISING BLIND VIAS INTENDED TO BE METALIZED
- Publication number 20110221068
- Publication date Sep 15, 2011
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.
- Damien SAINT-PATRICE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR METALIZING BLIND VIAS
- Publication number 20110219612
- Publication date Sep 15, 2011
- Comm. á I'éner. atom. et aux énergies alter.
- Fabrice JACQUET
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH CAVITY HAVING ONE OR SEVERAL CONTACT RI...
- Publication number 20110097909
- Publication date Apr 28, 2011
- COMM. A L'ENER. ATOM. ET AUX ENERGIES ALT.
- Sébastien BOLIS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONNECTION COMPONENT WITH HOLLOW INSERTS AND METHOD FOR MAKING SAME
- Publication number 20110094789
- Publication date Apr 28, 2011
- COMMISSARIAT AL'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Francois Marion
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CONNECTION COMPONENT PROVIDED WITH INSERTS COMPRISING COMPENSATING...
- Publication number 20110041332
- Publication date Feb 24, 2011
- Commissariat A L'Energie Atomique Et Aux Energies Alternatives
- Damien Saint-Patrice
- H01 - BASIC ELECTRIC ELEMENTS

Damien SAINT-PATRICE

Person

Patents Grantslast 30 patents

Electromechanical microsystem

RF/DC decoupling system for RF switches based on phase change material

Packaging structure of a microelectronic device having a hermeticit...

Switch including a phase change materials based structure where onl...

Method of making a closed cavity comprising a flap protecting the c...

Commutator structure comprising several channels of phase change ma...

Method for packaging a microelectronic device in a hermetically sea...

Method of hermetically sealing a hole with a fuse material

Method for metalizing blind vias

Method of making a connection component with hollow inserts

Interconnect structure with cavity having one or several contact ri...

Interconnect structure comprising blind vias intended to be metalized

Method for making a cavity in the thickness of a substrate which ma...

Patents Applicationslast 30 patents

ELECTROMECHANICAL MICROSYSTEM

ELECTROMECHANICAL MICROSYSTEM

ELECTROMECHANICAL MICROSYSTEM

ELECTROMECHANICAL MICROSYSTEM

ELECTROMECHANICAL MICROSYSTEM

ELECTROMECHANICAL MICROSYSTEM

RF/DC DECOUPLING SYSTEM FOR RF SWITCHES BASED ON PHASE CHANGE MATERIAL

SWITCH INCLUDING A PHASE CHANGE MATERIALS BASED STRUCTURE WHERE ONL...

COMMUTATOR STRUCTURE COMPRISING SEVERAL CHANNELS OF PHASE CHANGE MA...

METHOD OF MAKING A CLOSED CAVITY COMPRISING A FLAP PROTECTING THE C...

MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURING A MICROELECTRON...

PACKAGING STRUCTURE OF A MICROELECTRONIC DEVICE HAVING A HERMETICIT...

METHOD OF HERMETICALLY SEALING A HOLE WITH A FUSE MATERIAL

METHOD FOR MAKING A CAVITY IN THE THICKNESS OF A SUBSTRATE WHICH MA...

INTERCONNECT STRUCTURE COMPRISING BLIND VIAS INTENDED TO BE METALIZED

METHOD FOR METALIZING BLIND VIAS

INTERCONNECT STRUCTURE WITH CAVITY HAVING ONE OR SEVERAL CONTACT RI...

CONNECTION COMPONENT WITH HOLLOW INSERTS AND METHOD FOR MAKING SAME

CONNECTION COMPONENT PROVIDED WITH INSERTS COMPRISING COMPENSATING...