Damyon L. Corbin

Person

Jericho, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package assembly for thin wafer shipping and method of use
- Patent number 10,784,137
- Issue date Sep 22, 2020
- ELPIS TECHNOLOGIES INC.
- Damyon L. Corbin
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Package assembly for thin wafer shipping and method of use
- Patent number 10,622,235
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Damyon L. Corbin
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Package assembly for thin wafer shipping and method of use
- Patent number 10,468,280
- Issue date Nov 5, 2019
- International Business Machines Corporation
- Damyon L. Corbin
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Controlling of etch depth in deep via etching processes and resulta...
- Patent number 10,192,748
- Issue date Jan 29, 2019
- GLOBALFOUNDRIES Inc.
- Timothy C. Krywanczyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly for thin wafer shipping and method of use
- Patent number 10,090,180
- Issue date Oct 2, 2018
- International Business Machines Corporation
- Damyon L. Corbin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly for thin wafer shipping and method of use
- Patent number 9,543,175
- Issue date Jan 10, 2017
- International Business Machines Corporation
- Damyon L. Corbin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal ground plane with improved metal adhesion and design...
- Patent number 8,912,091
- Issue date Dec 16, 2014
- International Business Machines Corporation
- Jay S. Burnham
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE
- Publication number 20200027766
- Publication date Jan 23, 2020
- International Business Machines Corporation
- Damyon L. Corbin
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE
- Publication number 20180308734
- Publication date Oct 25, 2018
- International Business Machines Corporation
- Damyon L. Corbin
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
CONTROLLING OF ETCH DEPTH IN DEEP VIA ETCHING PROCESSES AND RESULTA...
- Publication number 20180108535
- Publication date Apr 19, 2018
- GLOBALFOUNDRIES Inc.
- Timothy C. Krywanczyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE
- Publication number 20170032993
- Publication date Feb 2, 2017
- International Business Machines Corporation
- Damyon L. Corbin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE
- Publication number 20170025295
- Publication date Jan 26, 2017
- International Business Machines Corporation
- Damyon L. Corbin
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE
- Publication number 20150083638
- Publication date Mar 26, 2015
- International Business Machines Corporation
- Damyon L. Corbin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING
- Publication number 20150076029
- Publication date Mar 19, 2015
- International Business Machines Corporation
- Damyon L. Corbin
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
BACKSIDE METAL GROUND PLANE WITH IMPROVED METAL ADHESION AND DESIGN...
- Publication number 20140191408
- Publication date Jul 10, 2014
- International Business Machines Corporation
- Jay S. BURNHAM
- G06 - COMPUTING CALCULATING COUNTING

Damyon L. Corbin

Person

Patents Grantslast 30 patents

Package assembly for thin wafer shipping and method of use

Package assembly for thin wafer shipping and method of use

Package assembly for thin wafer shipping and method of use

Controlling of etch depth in deep via etching processes and resulta...

Package assembly for thin wafer shipping and method of use

Package assembly for thin wafer shipping and method of use

Backside metal ground plane with improved metal adhesion and design...

Patents Applicationslast 30 patents

PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE

PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE

CONTROLLING OF ETCH DEPTH IN DEEP VIA ETCHING PROCESSES AND RESULTA...

PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE

PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE

PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE

PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING

BACKSIDE METAL GROUND PLANE WITH IMPROVED METAL ADHESION AND DESIGN...