Dan Steigerwald

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Passivation for a semiconductor light emitting device
- Patent number 11,658,273
- Issue date May 23, 2023
- Lumileds LLC
- Frederic Stephane Diana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturable multi-emitter laser diode
- Patent number 11,658,456
- Issue date May 23, 2023
- KYOCERA SLD Laser, Inc.
- Dan Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturable multi-emitter laser diode
- Patent number 11,011,889
- Issue date May 18, 2021
- KYOCERA SLD Laser, Inc.
- Dan Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation for a semiconductor light emitting device
- Patent number 10,873,013
- Issue date Dec 22, 2020
- Lumileds LLC
- Frederic Stephane Diana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturable multi-emitter laser diode
- Patent number 10,566,767
- Issue date Feb 18, 2020
- Soraa Laser Diode, Inc.
- Dan Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturable laser diode
- Patent number 10,367,334
- Issue date Jul 30, 2019
- Soraa Laser Diode, Inc.
- Melvin McLaurin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
P—N separation metal fill for flip chip LEDs
- Patent number 10,170,675
- Issue date Jan 1, 2019
- Lumileds LLC
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation for a semiconductor light emitting device
- Patent number 10,134,965
- Issue date Nov 20, 2018
- Lumileds LLC
- Frederic Stephane Diana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation for a semiconductor light emitting device
- Patent number 10,134,964
- Issue date Nov 20, 2018
- Lumileds LLC
- Frederic S. Diana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a semiconductor structure
- Patent number 10,056,531
- Issue date Aug 21, 2018
- Lumileds LLC
- Jerome Chandra Bhat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED having vertical contacts redistributed for flip chip mounting
- Patent number 9,722,137
- Issue date Aug 1, 2017
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
P-n separation metal fill for flip chip LEDs
- Patent number 9,722,161
- Issue date Aug 1, 2017
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturable multi-emitter laser diode
- Patent number 9,520,697
- Issue date Dec 13, 2016
- Soraa Laser Diode, Inc.
- Dan Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturable laser diode
- Patent number 9,379,525
- Issue date Jun 28, 2016
- Soraa Laser Diode, Inc.
- Melvin McLaurin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of attaching a light emitting device to a support substrate
- Patent number 9,153,758
- Issue date Oct 6, 2015
- Koninklijke Philips N.V.
- Daniel Alexander Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation for a semiconductor light emitting device
- Patent number 8,471,282
- Issue date Jun 25, 2013
- Koninklijke Philips Electronics N.V.
- Frederic S. Diana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Series connected flip chip LEDs with growth substrate removed
- Patent number 8,450,754
- Issue date May 28, 2013
- Koninklijke Philips Electronics N.V.
- Michael R. Krames
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zener diode protection network in submount for LEDs connected in se...
- Patent number 8,400,064
- Issue date Mar 19, 2013
- Koninklijke Philips Electronics N.V.
- Yajun Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED assembly having maximum metal support for laser lift-off of gro...
- Patent number 8,384,118
- Issue date Feb 26, 2013
- Koninklijke Philips Electronics N.V.
- Stefano Schiaffino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Series connected flip chip LEDs with growth substrate removed
- Patent number 8,062,916
- Issue date Nov 22, 2011
- Koninklijke Philips Electronics N.V.
- Michael R. Krames
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED assembly having maximum metal support for laser lift-off of gro...
- Patent number 7,736,945
- Issue date Jun 15, 2010
- Philips Lumileds Lighting Company, LLC
- Stefano Schiaffino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacting scheme for large and small area semiconductor light emit...
- Patent number 7,652,304
- Issue date Jan 26, 2010
- Philips Lumileds Lighting Company, LLC
- Daniel A. Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-powered light emitting device with improved thermal properties
- Patent number 7,351,599
- Issue date Apr 1, 2008
- Philips Lumileds Lighting Company LLC
- Yu-Chen Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects for semiconductor light emitting devices
- Patent number 7,348,212
- Issue date Mar 25, 2008
- Philips Lumileds Lighting Company LLC
- Stefano Schiaffino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of Ohmic contacts in III-nitride light emitting devices
- Patent number 7,345,323
- Issue date Mar 18, 2008
- Philips Lumileds Lighting Company LLC
- Werner K. Goetz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacting scheme for large and small area semiconductor light emit...
- Patent number 7,095,061
- Issue date Aug 22, 2006
- Philips Lumileds Lighting Company, LLC
- Daniel A. Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device with enhanced optical scattering
- Patent number 7,071,494
- Issue date Jul 4, 2006
- Lumileds Lighting U.S. LLC
- Daniel A. Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Axial LED source
- Patent number 7,048,412
- Issue date May 23, 2006
- LumiLeds Lighting U.S., LLC
- Paul S. Martin
- F21 - LIGHTING
Information Patent Grant
Semiconductor light emitting device and method
- Patent number 7,015,054
- Issue date Mar 21, 2006
- LumiLeds Lighting U.S., LLC
- Daniel A. Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-powered light emitting device with improved thermal properties
- Patent number 6,977,396
- Issue date Dec 20, 2005
- LumiLeds Lighting U.S., LLC
- Yu-Chen Shen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURABLE MULTI-EMITTER LASER DIODE
- Publication number 20210344164
- Publication date Nov 4, 2021
- KYOCERA SLD Laser, Inc.
- Dan Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE
- Publication number 20210111321
- Publication date Apr 15, 2021
- Lumileds LLC
- Frederic Stephane Diana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURABLE MULTI-EMITTER LASER DIODE
- Publication number 20200274333
- Publication date Aug 27, 2020
- Soraa Laser Diode, Inc.
- Dan Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE
- Publication number 20190027664
- Publication date Jan 24, 2019
- Lumileds LLC
- Frederic Stephane Diana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED HAVING VERTICAL CONTACTS REDISTRIBUTED FOR FLIP CHIP MOUNTING
- Publication number 20180019370
- Publication date Jan 18, 2018
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
P-N SEPARATION METAL FILL FOR FLIP CHIP LEDS
- Publication number 20170373235
- Publication date Dec 28, 2017
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURABLE MULTI-EMITTER LASER DIODE
- Publication number 20170063047
- Publication date Mar 2, 2017
- Soraa Laser Diode, Inc.
- Dan Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURABLE LASER DIODE
- Publication number 20160294162
- Publication date Oct 6, 2016
- Soraa Laser Diode, Inc.
- Melvin McLaurin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE
- Publication number 20160204315
- Publication date Jul 14, 2016
- Koninklijke Philips N.V.
- Frederic Stephane Diana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
P-N SEPARATION METAL FILL FOR FLIP CHIP LEDS
- Publication number 20160126436
- Publication date May 5, 2016
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED HAVING VERTICAL CONTACTS REDISTRIBUTED FOR FLIP CHIP MOUNTING
- Publication number 20160126408
- Publication date May 5, 2016
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURABLE LASER DIODE
- Publication number 20150229107
- Publication date Aug 13, 2015
- Soraa Laser Diode, Inc.
- Melvin McLaurin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURABLE MULTI-EMITTER LASER DIODE
- Publication number 20150229108
- Publication date Aug 13, 2015
- Soraa Laser Diode, Inc.
- Dan Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ATTACHING A LIGHT EMITTING DEVICE TO A SUPPORT SUBSTRATE
- Publication number 20140220716
- Publication date Aug 7, 2014
- Koninklijke Philips N.V.
- Daniel Alexandria Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A SEMICONDUCTOR STRUCTURE
- Publication number 20140179029
- Publication date Jun 26, 2014
- Koninklijke Philips Electronics N.V.
- Jerome Chandra Bhat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE
- Publication number 20130252358
- Publication date Sep 26, 2013
- Koninklijke Philips Electronics N.V.
- Frederic S. Diana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SERIES CONNECTED FLIP CHIP LEDS WITH GROWTH SUBSTRATE REMOVED
- Publication number 20120025231
- Publication date Feb 2, 2012
- Koninklijke Philips Electronics N.V.
- Michael R. Krames
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE
- Publication number 20110297979
- Publication date Dec 8, 2011
- PHILIPS LUMILEDS LIGHTING COMPANY, LLC
- Frederic S. DIANA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REFLECTIVE CONTACT FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE
- Publication number 20110136273
- Publication date Jun 9, 2011
- PHILIPS LUMILEDS LIGHTING COMPANY, LLC
- Henry Kwong-Hin Choy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ZENER DIODE PROTECTION NETWORK IN SUBMOUNT FOR LEDS CONNECTED IN SE...
- Publication number 20110057569
- Publication date Mar 10, 2011
- Koninklijke Philips Electronics N.V.
- Yajun WEI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
LED ASSEMBLY HAVING MAXIMUM METAL SUPPORT FOR LASER LIFT-OFF OF GRO...
- Publication number 20100207157
- Publication date Aug 19, 2010
- Koninklijke Philips Electronics N.V.
- Stefano SCHIAFFINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SERIES CONNECTED FLIP CHIP LEDS WITH GROWTH SUBSTRATE REMOVED
- Publication number 20100109030
- Publication date May 6, 2010
- Koninklijke Philips Electronics N.V.
- Michael R. KRAMES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLANTED CONNECTORS IN LED SUBMOUNT FOR PEC ETCHING BIAS
- Publication number 20100006864
- Publication date Jan 14, 2010
- PHILIPS LUMILEDS LIGHTING COMPANY, LLC
- Daniel A. Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reflective Contact for a Semiconductor Light Emitting Device
- Publication number 20090250713
- Publication date Oct 8, 2009
- PHILIPS LUMILEDS LIGHTING COMPANY, LLC
- Henry Kwong-Hin Choy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnects for semiconductor light emitting devices
- Publication number 20080142833
- Publication date Jun 19, 2008
- Philips Lumileds Lighting Company LLC
- Stefano Schiaffino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED Assembly Having Maximum Metal Support for Laser Lift-Off of Gro...
- Publication number 20070096130
- Publication date May 3, 2007
- PHILIPS LUMILEDS LIGHTING COMPANY, LLC
- Stefano Schiaffino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnects for semiconductor light emitting devices
- Publication number 20070057271
- Publication date Mar 15, 2007
- Stefano Schiaffino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contacting Scheme for Large and Small Area Semiconductor Light Emit...
- Publication number 20060273339
- Publication date Dec 7, 2006
- PHILIPS LUMILEDS LIGHTING COMPANY, LLC
- Daniel A. Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-powered light emitting device with improved thermal properties
- Publication number 20060097336
- Publication date May 11, 2006
- Yu-Chen Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Illumination system with LEDs
- Publication number 20050179041
- Publication date Aug 18, 2005
- Lumileds Lighting U.S., LLC
- Gerard Harbers
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Dan Steigerwald

Person

Patents Grantslast 30 patents

Passivation for a semiconductor light emitting device

Manufacturable multi-emitter laser diode

Manufacturable multi-emitter laser diode

Passivation for a semiconductor light emitting device

Manufacturable multi-emitter laser diode

Manufacturable laser diode

P—N separation metal fill for flip chip LEDs

Passivation for a semiconductor light emitting device

Passivation for a semiconductor light emitting device

Method of processing a semiconductor structure

LED having vertical contacts redistributed for flip chip mounting

P-n separation metal fill for flip chip LEDs

Manufacturable multi-emitter laser diode

Manufacturable laser diode

Method of attaching a light emitting device to a support substrate

Passivation for a semiconductor light emitting device

Series connected flip chip LEDs with growth substrate removed

Zener diode protection network in submount for LEDs connected in se...

LED assembly having maximum metal support for laser lift-off of gro...

Series connected flip chip LEDs with growth substrate removed

LED assembly having maximum metal support for laser lift-off of gro...

Contacting scheme for large and small area semiconductor light emit...

High-powered light emitting device with improved thermal properties

Interconnects for semiconductor light emitting devices

Formation of Ohmic contacts in III-nitride light emitting devices

Contacting scheme for large and small area semiconductor light emit...

Light emitting device with enhanced optical scattering

Axial LED source

Semiconductor light emitting device and method

High-powered light emitting device with improved thermal properties

Patents Applicationslast 30 patents

MANUFACTURABLE MULTI-EMITTER LASER DIODE

PASSIVATION FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE

MANUFACTURABLE MULTI-EMITTER LASER DIODE

PASSIVATION FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE

LED HAVING VERTICAL CONTACTS REDISTRIBUTED FOR FLIP CHIP MOUNTING

P-N SEPARATION METAL FILL FOR FLIP CHIP LEDS

MANUFACTURABLE MULTI-EMITTER LASER DIODE

MANUFACTURABLE LASER DIODE

PASSIVATION FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE

P-N SEPARATION METAL FILL FOR FLIP CHIP LEDS

LED HAVING VERTICAL CONTACTS REDISTRIBUTED FOR FLIP CHIP MOUNTING

MANUFACTURABLE LASER DIODE

MANUFACTURABLE MULTI-EMITTER LASER DIODE

METHOD OF ATTACHING A LIGHT EMITTING DEVICE TO A SUPPORT SUBSTRATE

METHOD OF PROCESSING A SEMICONDUCTOR STRUCTURE

PASSIVATION FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE

SERIES CONNECTED FLIP CHIP LEDS WITH GROWTH SUBSTRATE REMOVED

PASSIVATION FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE

REFLECTIVE CONTACT FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE

ZENER DIODE PROTECTION NETWORK IN SUBMOUNT FOR LEDS CONNECTED IN SE...

LED ASSEMBLY HAVING MAXIMUM METAL SUPPORT FOR LASER LIFT-OFF OF GRO...

SERIES CONNECTED FLIP CHIP LEDS WITH GROWTH SUBSTRATE REMOVED

IMPLANTED CONNECTORS IN LED SUBMOUNT FOR PEC ETCHING BIAS

Reflective Contact for a Semiconductor Light Emitting Device

Interconnects for semiconductor light emitting devices

LED Assembly Having Maximum Metal Support for Laser Lift-Off of Gro...

Interconnects for semiconductor light emitting devices

Contacting Scheme for Large and Small Area Semiconductor Light Emit...

High-powered light emitting device with improved thermal properties

Illumination system with LEDs