Dan Towery

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Chemical mechanical planarization of low dielectric constant materials
- Patent number 6,736,992
- Issue date May 18, 2004
- Honeywell International Inc.
- Fan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reactive aqueous metal oxide sols as polishing slurries for low die...
- Patent number 6,723,143
- Issue date Apr 20, 2004
- Honeywell International Inc.
- Daniel Towery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for chemical mechanical planarization of copper, tantal...
- Patent number 6,630,433
- Issue date Oct 7, 2003
- Honeywell International Inc.
- Fan Zhang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Oxidizing polishing slurries for low dielectric constant materials
- Patent number 6,610,114
- Issue date Aug 26, 2003
- Honeywell International Inc.
- Dan Towery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reactive aqueous metal oxide sols as polishing slurries for low die...
- Patent number 6,464,740
- Issue date Oct 15, 2002
- Honeywell International Inc.
- Daniel I. Towery
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Chemical mechanical planarization of low dielectric constant materials
- Patent number 6,416,685
- Issue date Jul 9, 2002
- Honeywell International Inc.
- Fan Zhang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for integrated circuit planarization
- Patent number 6,407,006
- Issue date Jun 18, 2002
- Honeywell International, Inc.
- Joseph A Levert
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Oxidizing polishing slurries for low dielectric constant materials
- Patent number 6,270,395
- Issue date Aug 7, 2001
- AlliedSignal, Inc.
- Daniel L. Towery
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Methods for chemical mechanical polish of organic polymer dielectri...
- Patent number 6,153,525
- Issue date Nov 28, 2000
- AlliedSignal Inc.
- Neil H. Hendricks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cleaning semiconductor wafers containing dielectric films
- Patent number 6,152,148
- Issue date Nov 28, 2000
- Honeywell, Inc.
- Anna M. George
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...

Patents Applicationslast 30 patents

Information Patent Application
Oxidizing polishing slurries for low dielectric constant materials
- Publication number 20040192172
- Publication date Sep 30, 2004
- Dan Towery
- B24 - GRINDING POLISHING
Information Patent Application
Chemical mechanical planarization of low dielectric constant materials
- Publication number 20040175941
- Publication date Sep 9, 2004
- Fan Zhang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Composition for chemical mechanical planarization of copper, tantal...
- Publication number 20040046148
- Publication date Mar 11, 2004
- Fan Zhang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Compositions and processes for spin etch planarization
- Publication number 20030073311
- Publication date Apr 17, 2003
- Joseph Levert
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Reactive aqueous metal oxide sols as polishingslurries for low diel...
- Publication number 20030005647
- Publication date Jan 9, 2003
- Daniel Towery
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Chemical mechanical planarization of low dielectric constant materials
- Publication number 20020177314
- Publication date Nov 28, 2002
- Honeywell International Inc.
- Fan Zhang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Composition for chemical mechanical planarization of copper, tantal...
- Publication number 20020020833
- Publication date Feb 21, 2002
- Fan Zhang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Oxidizing polishing slurries for low dielectric constant materials
- Publication number 20020009955
- Publication date Jan 24, 2002
- Daniel L. Towery
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COMPOSITIONS AND PROCESSES FOR SPIN ETCH PLANARIZATION
- Publication number 20010054706
- Publication date Dec 27, 2001
- JOSEPH A. LEVERT
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Apparatus and methods for integrated circuit planarization
- Publication number 20010036749
- Publication date Nov 1, 2001
- Joseph A. Levert
- B82 - NANO-TECHNOLOGY

Person

Patents Grantslast 30 patents

Chemical mechanical planarization of low dielectric constant materials

Reactive aqueous metal oxide sols as polishing slurries for low die...

Composition for chemical mechanical planarization of copper, tantal...

Oxidizing polishing slurries for low dielectric constant materials

Reactive aqueous metal oxide sols as polishing slurries for low die...

Chemical mechanical planarization of low dielectric constant materials

Method for integrated circuit planarization

Oxidizing polishing slurries for low dielectric constant materials

Methods for chemical mechanical polish of organic polymer dielectri...

Method for cleaning semiconductor wafers containing dielectric films

Patents Applicationslast 30 patents

Oxidizing polishing slurries for low dielectric constant materials

Chemical mechanical planarization of low dielectric constant materials

Composition for chemical mechanical planarization of copper, tantal...

Compositions and processes for spin etch planarization

Reactive aqueous metal oxide sols as polishingslurries for low diel...

Chemical mechanical planarization of low dielectric constant materials

Composition for chemical mechanical planarization of copper, tantal...

Oxidizing polishing slurries for low dielectric constant materials

COMPOSITIONS AND PROCESSES FOR SPIN ETCH PLANARIZATION

Apparatus and methods for integrated circuit planarization