Forester, L. et al., “Removal Rate Behavior of Spin-On Dielectrics With Chemical Mechanical Polish,” Jun. 27-29, 1995, VMIC Conference, 482-484. |
Homma, Yoshio, “Using Selective CMP With Low Permittivity Organic SOG to Achieve Low Capacitance Multilevel Interconnection,” Jun. 27-29, 1995, VMIC Conference, 457-463. |
Homma, Yoshio, “Selective CMP of Organic SOG For Low Parasitic Capacitance Quarter-Micron Multilevel Interconnections,” Feb. 22-23, 1996, CMP-MIC Conference, 67-73. |
Mueller, B. L., “CMP Of Low K Materials,” Feb. 13-14, 1997, CMP-MIC Conference, 37-43. |
Tredinnick, B., “Chemical Mechanical Polishing of SOG with Oxide Polish Stop,” Feb. 22-23, 1996, CMP-MIC Conference, 107-111. |
Yang, G. R., “Chemical-Mechanical Polishing of Parylene N and Benzocyclobutene Films,” J. Electrochem. Soc., 4:9:3249-3255 (Sep., 1997). |