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Printed wiring board assemblies
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Patent number 5,966,804
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Issue date Oct 19, 1999
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National Center for Manufacturing Sciences
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Daniel Anthony Scola
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Electropolymerization method and product
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Patent number 5,466,357
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Issue date Nov 14, 1995
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The University of Connecticut
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James P. Bell
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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High temperature 3f-polyimides
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Patent number 5,298,601
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Issue date Mar 29, 1994
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United Technologies Corporation
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Daniel A. Scola
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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Fluorinated condensation copolyimides
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Patent number 5,298,600
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Issue date Mar 29, 1994
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United Technologies Corporation
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Daniel A. Scola
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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High temperature fluorinated polymer
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Patent number 4,801,682
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Issue date Jan 31, 1989
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United Technologies Corporation
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Daniel A. Scola
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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High temperature fluorinated polyimides
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Patent number 4,742,152
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Issue date May 3, 1988
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United Technologies Corporation
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Daniel A. Scola
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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Aliphatic diene bis-imide polymers
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Patent number 4,354,012
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Issue date Oct 12, 1982
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United Technologies Corporation
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Daniel A. Scola
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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High damping epoxy resin composite
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Patent number 4,304,694
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Issue date Dec 8, 1981
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United Technologies Corporation
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Daniel A. Scola
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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