Daniel C. Edelstein

Person

Ithaca, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor backside transistor integration with backside power d...
- Patent number 12,341,099
- Issue date Jun 24, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded metal contamination removal from BEOL wafers
- Patent number 12,272,545
- Issue date Apr 8, 2025
- International Business Machines Corporation
- Devika Sil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric fill for tight pitch MRAM pillar array
- Patent number 11,955,152
- Issue date Apr 9, 2024
- International Business Machines Corporation
- Ashim Dutta
- G11 - INFORMATION STORAGE
Information Patent Grant
High-density memory devices using oxide gap fill
- Patent number 11,937,514
- Issue date Mar 19, 2024
- International Business Machines Corporation
- Theodorus E. Standaert
Information Patent Grant
Advanced copper interconnects with hybrid microstructure
- Patent number 11,881,433
- Issue date Jan 23, 2024
- TESSERA LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming copper interconnect structure with manganese barr...
- Patent number 11,804,405
- Issue date Oct 31, 2023
- TESSERA LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode with alloy interface
- Patent number 11,557,482
- Issue date Jan 17, 2023
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding magneto-resistive random-access memory devices between me...
- Patent number 11,462,583
- Issue date Oct 4, 2022
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode-via structure
- Patent number 11,302,630
- Issue date Apr 12, 2022
- International Business Machines Corporation
- Theodorus E. Standaert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect structure with manganese barrier layer
- Patent number 11,232,983
- Issue date Jan 25, 2022
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced copper interconnects with hybrid microstructure
- Patent number 11,222,817
- Issue date Jan 11, 2022
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom electrode for semiconductor memory device
- Patent number 11,217,742
- Issue date Jan 4, 2022
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin multilayer metal alloy liner for nano Cu interconnects
- Patent number 11,177,167
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Daniel Edelstein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bottom electrode for semiconductor memory device
- Patent number 11,145,813
- Issue date Oct 12, 2021
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bevel metal removal using ion beam etch
- Patent number 11,081,643
- Issue date Aug 3, 2021
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structural enhancement of Cu nanowires
- Patent number 11,056,425
- Issue date Jul 6, 2021
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact via with pillar of alternating layers
- Patent number 11,031,542
- Issue date Jun 8, 2021
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial buffer layer for metal removal at a bevel edge of a sub...
- Patent number 10,892,404
- Issue date Jan 12, 2021
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MRAM device formation with in-situ encapsulation
- Patent number 10,833,258
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact via structures
- Patent number 10,777,735
- Issue date Sep 15, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 10,770,347
- Issue date Sep 8, 2020
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer hardmask for high performance MRAM devices
- Patent number 10,714,683
- Issue date Jul 14, 2020
- International Business Machines Corporation
- Michael Rizzolo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact via structures
- Patent number 10,686,124
- Issue date Jun 16, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer hardmask for high performance MRAM devices
- Patent number 10,680,169
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Michael Rizzolo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin multilayer metal alloy liner for nano Cu interconnects
- Patent number 10,643,890
- Issue date May 5, 2020
- International Business Machines Corporation
- Daniel Edelstein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Advanced copper interconnects with hybrid microstructure
- Patent number 10,615,074
- Issue date Apr 7, 2020
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with fully aligned vias
- Patent number 10,607,933
- Issue date Mar 31, 2020
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 10,593,591
- Issue date Mar 17, 2020
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming self-aligned contacts on pillar structures
- Patent number 10,586,920
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Anthony J. Annunziata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming self-aligned contacts on pillar structures
- Patent number 10,586,921
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Anthony J. Annunziata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELF-ALIGNED BACKSIDE CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE PO...
- Publication number 20250169145
- Publication date May 22, 2025
- International Business Machines Corporation
- Huimei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF GRAPHENE ON COBALT-CAPPED COPPER DUAL DAMAS...
- Publication number 20250096036
- Publication date Mar 20, 2025
- LAM RESEARCH CORPORATION
- Asish Parbatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLER WAFER WITH LOW OVERLAY RESIDUAL BACKSIDE PATTERNING
- Publication number 20250087527
- Publication date Mar 13, 2025
- International Business Machines Corporation
- Prabudhya Roy Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORROSION RESISTANT SINGLE DAMASCENE INTERCONNECTS
- Publication number 20240431025
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Takeshi Nogami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE CUTS TO REMOVE PREDICTED INTERCONNECT BULGING REGIONS
- Publication number 20240419882
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Xiaoming Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BACKSIDES SUBTRACTIVE M1 PATTERNING WITH BACKSIDE CONTACT REPAIR FO...
- Publication number 20240395822
- Publication date Nov 28, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED COPPER INTERCONNECTS WITH HYBRID MICROSTRUCTURE
- Publication number 20240387264
- Publication date Nov 21, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE INCLUDING RC-BASED POWER RAIL ESD CLAMPING CIRCUIT
- Publication number 20240332181
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPER VIA WITHIN BACKSIDE LEVEL
- Publication number 20240290688
- Publication date Aug 29, 2024
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANDREL-PULL-FIRST INTERCONNECT PATTERNING
- Publication number 20240162087
- Publication date May 16, 2024
- International Business Machines Corporation
- Xiaoming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR BACKSIDE TRANSISTOR INTEGRATION WITH BACKSIDE POWER D...
- Publication number 20240105605
- Publication date Mar 28, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT THAT REDUCES RISK OF CONTACT TO GATE SHORT
- Publication number 20240079446
- Publication date Mar 7, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Power Distribution Network and Signal Line Integration
- Publication number 20240063283
- Publication date Feb 22, 2024
- Intemational Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT END OF LINE PROCESSING COMPATIBLE THERMALLY STABLE BURIED POW...
- Publication number 20240006316
- Publication date Jan 4, 2024
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...
- Publication number 20240006237
- Publication date Jan 4, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED LOCAL INTERCONNECT SEMICONDUCTOR MEMORY DEVICE
- Publication number 20230189671
- Publication date Jun 15, 2023
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ELEMENT WITH A HARDMASK STACK HAVING DIFFERENT STRESS LEVELS
- Publication number 20230189655
- Publication date Jun 15, 2023
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL INTERCONNECTS HAVING DIFFERENT MATERIAL COMPOSITIONS
- Publication number 20230187349
- Publication date Jun 15, 2023
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC FILL FOR TIGHT PITCH MRAM PILLAR ARRAY
- Publication number 20230178129
- Publication date Jun 8, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTED WIDE BASE DOUBLE MAGNETIC TUNNEL JUNCTION DEVICE
- Publication number 20230165155
- Publication date May 25, 2023
- International Business Machines Corporation
- Pouya Hashemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSHEET TRANSISTORS WITH BURIED POWER RAILS
- Publication number 20230094466
- Publication date Mar 30, 2023
- International Business Machines Corporation
- Julien Frougier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY MEMORY DEVICES USING OXIDE GAP FILL
- Publication number 20220359814
- Publication date Nov 10, 2022
- International Business Machines Corporation
- Theodorus E. Standaert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL PLANARIZATION SLURRIES AND PROCESSES FOR PLATIN...
- Publication number 20220277964
- Publication date Sep 1, 2022
- International Business Machines Corporation
- Mahadevaiyer Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED COPPER INTERCONNECTS WITH HYBRID MICROSTRUCTURE
- Publication number 20220165620
- Publication date May 26, 2022
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARRIER LAYER
- Publication number 20220115269
- Publication date Apr 14, 2022
- Tessera, Inc.
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE-VIA STRUCTURE
- Publication number 20210320060
- Publication date Oct 14, 2021
- International Business Machines Corporation
- Theodorus E. Standaert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Metal Contamination Removal from BEOL Wafers
- Publication number 20210296118
- Publication date Sep 23, 2021
- International Business Machines Corporation
- Devika Sil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEVEL METAL REMOVAL USING ION BEAM ETCH
- Publication number 20210226120
- Publication date Jul 22, 2021
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus For Reducing Wafer Contamination During ION-Beam Etching...
- Publication number 20210183627
- Publication date Jun 17, 2021
- International Business Machines Corporation
- John Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDING MAGNETO-RESISTIVE RANDOM-ACCESS MEMORY DEVICES BETWEEN ME...
- Publication number 20210134883
- Publication date May 6, 2021
- International Business Machines Corporation
- Ashim DUTTA
- H01 - BASIC ELECTRIC ELEMENTS

Daniel C. Edelstein

Person

Patents Grantslast 30 patents

Semiconductor backside transistor integration with backside power d...

Embedded metal contamination removal from BEOL wafers

Dielectric fill for tight pitch MRAM pillar array

High-density memory devices using oxide gap fill

Advanced copper interconnects with hybrid microstructure

Method of forming copper interconnect structure with manganese barr...

Electrode with alloy interface

Embedding magneto-resistive random-access memory devices between me...

Electrode-via structure

Copper interconnect structure with manganese barrier layer

Advanced copper interconnects with hybrid microstructure

Bottom electrode for semiconductor memory device

Ultrathin multilayer metal alloy liner for nano Cu interconnects

Bottom electrode for semiconductor memory device

Bevel metal removal using ion beam etch

Structural enhancement of Cu nanowires

Contact via with pillar of alternating layers

Sacrificial buffer layer for metal removal at a bevel edge of a sub...

MRAM device formation with in-situ encapsulation

Contact via structures

Interconnect structure

Multilayer hardmask for high performance MRAM devices

Contact via structures

Multilayer hardmask for high performance MRAM devices

Ultrathin multilayer metal alloy liner for nano Cu interconnects

Advanced copper interconnects with hybrid microstructure

Interconnect structures with fully aligned vias

Interconnect structure

Forming self-aligned contacts on pillar structures

Forming self-aligned contacts on pillar structures

Patents Applicationslast 30 patents

SELF-ALIGNED BACKSIDE CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE PO...

SELECTIVE DEPOSITION OF GRAPHENE ON COBALT-CAPPED COPPER DUAL DAMAS...

HANDLER WAFER WITH LOW OVERLAY RESIDUAL BACKSIDE PATTERNING

CORROSION RESISTANT SINGLE DAMASCENE INTERCONNECTS

SELECTIVE CUTS TO REMOVE PREDICTED INTERCONNECT BULGING REGIONS

BACKSIDES SUBTRACTIVE M1 PATTERNING WITH BACKSIDE CONTACT REPAIR FO...

ADVANCED COPPER INTERCONNECTS WITH HYBRID MICROSTRUCTURE

STRUCTURE INCLUDING RC-BASED POWER RAIL ESD CLAMPING CIRCUIT

SUPER VIA WITHIN BACKSIDE LEVEL

MANDREL-PULL-FIRST INTERCONNECT PATTERNING

SEMICONDUCTOR BACKSIDE TRANSISTOR INTEGRATION WITH BACKSIDE POWER D...

BACKSIDE CONTACT THAT REDUCES RISK OF CONTACT TO GATE SHORT

Backside Power Distribution Network and Signal Line Integration

FRONT END OF LINE PROCESSING COMPATIBLE THERMALLY STABLE BURIED POW...

METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...

RECESSED LOCAL INTERCONNECT SEMICONDUCTOR MEMORY DEVICE

MEMORY ELEMENT WITH A HARDMASK STACK HAVING DIFFERENT STRESS LEVELS

LOCAL INTERCONNECTS HAVING DIFFERENT MATERIAL COMPOSITIONS

DIELECTRIC FILL FOR TIGHT PITCH MRAM PILLAR ARRAY

INVERTED WIDE BASE DOUBLE MAGNETIC TUNNEL JUNCTION DEVICE

NANOSHEET TRANSISTORS WITH BURIED POWER RAILS

HIGH-DENSITY MEMORY DEVICES USING OXIDE GAP FILL

CHEMICAL MECHANICAL PLANARIZATION SLURRIES AND PROCESSES FOR PLATIN...

ADVANCED COPPER INTERCONNECTS WITH HYBRID MICROSTRUCTURE

COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARRIER LAYER

ELECTRODE-VIA STRUCTURE

Embedded Metal Contamination Removal from BEOL Wafers

BEVEL METAL REMOVAL USING ION BEAM ETCH

Apparatus For Reducing Wafer Contamination During ION-Beam Etching...

EMBEDDING MAGNETO-RESISTIVE RANDOM-ACCESS MEMORY DEVICES BETWEEN ME...