Daniel Chesire

Person

Winter Garden, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Surface acoustic wave filter with a cap layer for improved reliability
- Patent number 9,973,169
- Issue date May 15, 2018
- Qorvo US, Inc.
- Kurt G. Steiner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Methods, systems, and apparatuses for temperature compensated surfa...
- Patent number 9,331,667
- Issue date May 3, 2016
- TriQuint Semiconductor, Inc.
- Kurt Steiner
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Routing under bond pad for the replacement of an interconnect layer
- Patent number 8,319,343
- Issue date Nov 27, 2012
- Agere Systems LLC
- Vance D. Archer, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal monitoring and management of integrated circuits
- Patent number 7,973,544
- Issue date Jul 5, 2011
- Agere Systems Inc.
- Vance D. Archer, III
- G01 - MEASURING TESTING
Information Patent Grant
Structure and method for fabricating flip chip devices
- Patent number 7,777,333
- Issue date Aug 17, 2010
- Agere Systems Inc.
- Mark Adam Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective isotropic etch for titanium-based materials
- Patent number 7,476,951
- Issue date Jan 13, 2009
- Agere Systems Inc.
- Timothy S. Campbell
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit device incorporating metallurgical bond to enhan...
- Patent number 7,429,502
- Issue date Sep 30, 2008
- Agere Systems, INC
- Vance D. Archer, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor with damage detection circuitry
- Patent number 7,397,103
- Issue date Jul 8, 2008
- Agere Systems, INC
- Vance D. Archer
- G01 - MEASURING TESTING
Information Patent Grant
Structure and method for bonding to copper interconnect structures
- Patent number 7,328,830
- Issue date Feb 12, 2008
- Agere Systems Inc.
- Mark Adam Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device incorporating metallurigical bond to enha...
- Patent number 7,327,029
- Issue date Feb 5, 2008
- Agere Systems, INC
- Vance D. Archer, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced bond pad for a semiconductor device
- Patent number 7,301,231
- Issue date Nov 27, 2007
- Agere Systems, INC
- Joze E. Antol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structures for testing a semiconductor wafer prior to pe...
- Patent number 7,221,173
- Issue date May 22, 2007
- Agere Systems, INC
- Mark Adam Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced bond pad for a semiconductor device
- Patent number 7,115,985
- Issue date Oct 3, 2006
- Agere Systems, INC
- Joze E. Antol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective isotropic etch for titanium-based materials
- Patent number 7,078,337
- Issue date Jul 18, 2006
- Agere Systems Inc.
- Timothy S. Campbell
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reinforced bond pad
- Patent number 6,960,836
- Issue date Nov 1, 2005
- Agere Systems, INC
- Mark Adam Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density plasma passivation layer and method of application
- Patent number 6,153,543
- Issue date Nov 28, 2000
- Lucent Technologies Inc.
- Daniel P. Chesire
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TCSAW WITH IMPROVED RELIABILITY
- Publication number 20170099042
- Publication date Apr 6, 2017
- RF Micro Devices, Inc.
- Kurt G. Steiner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHODS, SYSTEMS, AND APPARATUSES FOR TEMPERATURE COMPENSATED SURFA...
- Publication number 20160020747
- Publication date Jan 21, 2016
- Kurt Steiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER
- Publication number 20130056868
- Publication date Mar 7, 2013
- AGERE SYSTEMS LLC
- Vance D. Archer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MONITORING AND MANAGEMENT OF INTEGRATED CIRCUITS
- Publication number 20100045326
- Publication date Feb 25, 2010
- Agere Systems Inc.
- Vance D. Archer, III
- G01 - MEASURING TESTING
Information Patent Application
Structure and Method for Fabricating Flip Chip Devices
- Publication number 20090072393
- Publication date Mar 19, 2009
- Agere Systems Inc.
- Mark Adam Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Device Incorporating Metallurgical Bond to Enhan...
- Publication number 20080026508
- Publication date Jan 31, 2008
- Agere Systems Inc.
- Vance D. Archer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor with damage detection circuitry
- Publication number 20070069365
- Publication date Mar 29, 2007
- Vance D. Archer
- G01 - MEASURING TESTING
Information Patent Application
Integrated circuit device incorporating metallurigacal bond to enha...
- Publication number 20070069368
- Publication date Mar 29, 2007
- Vance D. Archer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER
- Publication number 20070063352
- Publication date Mar 22, 2007
- Agere Systems Inc.
- Vance D. Archer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reinforced bond pad for a semiconductor device
- Publication number 20060226535
- Publication date Oct 12, 2006
- Joze E. Antol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective isotropic etch for titanium-based materials
- Publication number 20060226553
- Publication date Oct 12, 2006
- Timothy S. Campbell
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and structures for testing a semiconductor wafer prior to pe...
- Publication number 20060066327
- Publication date Mar 30, 2006
- Mark Adam Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reinforced bond pad for a semiconductor device
- Publication number 20060065969
- Publication date Mar 30, 2006
- Joze E. Antol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and system for reinforcing a bond pad
- Publication number 20050067709
- Publication date Mar 31, 2005
- Mark Adam Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective isotropic etch for titanium-based materials
- Publication number 20050068608
- Publication date Mar 31, 2005
- Timothy S. Campbell
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Structure and method for bonding to copper interconnect structures
- Publication number 20040182915
- Publication date Sep 23, 2004
- Mark Adam Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond pad support structure for a semiconductor device
- Publication number 20030218259
- Publication date Nov 27, 2003
- Daniel Patrick Chesire
- H01 - BASIC ELECTRIC ELEMENTS

Daniel Chesire

Person

Patents Grantslast 30 patents

Surface acoustic wave filter with a cap layer for improved reliability

Methods, systems, and apparatuses for temperature compensated surfa...

Routing under bond pad for the replacement of an interconnect layer

Thermal monitoring and management of integrated circuits

Structure and method for fabricating flip chip devices

Selective isotropic etch for titanium-based materials

Integrated circuit device incorporating metallurgical bond to enhan...

Semiconductor with damage detection circuitry

Structure and method for bonding to copper interconnect structures

Integrated circuit device incorporating metallurigical bond to enha...

Reinforced bond pad for a semiconductor device

Method and structures for testing a semiconductor wafer prior to pe...

Reinforced bond pad for a semiconductor device

Selective isotropic etch for titanium-based materials

Reinforced bond pad

High density plasma passivation layer and method of application

Patents Applicationslast 30 patents

TCSAW WITH IMPROVED RELIABILITY

METHODS, SYSTEMS, AND APPARATUSES FOR TEMPERATURE COMPENSATED SURFA...

ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER

THERMAL MONITORING AND MANAGEMENT OF INTEGRATED CIRCUITS

Structure and Method for Fabricating Flip Chip Devices

Integrated Circuit Device Incorporating Metallurgical Bond to Enhan...

Semiconductor with damage detection circuitry

Integrated circuit device incorporating metallurigacal bond to enha...

ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER

Reinforced bond pad for a semiconductor device

Selective isotropic etch for titanium-based materials

Method and structures for testing a semiconductor wafer prior to pe...

Reinforced bond pad for a semiconductor device

Methods and system for reinforcing a bond pad

Selective isotropic etch for titanium-based materials

Structure and method for bonding to copper interconnect structures

Bond pad support structure for a semiconductor device