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Daniel Daeik Kim
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Del Mar, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Package comprising an integrated passive device configured as a cap...
Patent number
12,016,247
Issue date
Jun 18, 2024
QUALCOMM Incorporated
Changhan Hobie Yun
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Metal-insulator-metal (MIM) capacitor structure for layer count red...
Patent number
12,009,292
Issue date
Jun 11, 2024
QUALCOMM Incorporated
Nosun Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded vertical inductor in laminate stacked substrates
Patent number
11,817,239
Issue date
Nov 14, 2023
QUALCOMM Incorporated
Daniel Daeik Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Tunable circuit including integrated filter circuit coupled to vari...
Patent number
11,770,115
Issue date
Sep 26, 2023
QUALCOMM Incorporated
Changhan Hobie Yun
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Chip modules employing conductive pillars to couple a passive compo...
Patent number
11,728,293
Issue date
Aug 15, 2023
QUALCOMM Incorporated
Changhan Hobie Yun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device, package and/or substrate comprising curved antenna
Patent number
11,658,403
Issue date
May 23, 2023
QUALCOMM Incorporated
Changhan Hobie Yun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Capacitance fine tuning by fin capacitor design
Patent number
11,515,247
Issue date
Nov 29, 2022
QUALCOMM Incorporated
Nosun Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate comprising capacitor configured for power amplifier outpu...
Patent number
11,502,652
Issue date
Nov 15, 2022
QUALCOMM Incorporated
Daniel Daeik Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
RF damping structure in inductive device
Patent number
11,380,471
Issue date
Jul 5, 2022
QUALCOMM Incorporated
Daniel Daeik Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bond inductor structures for flip chip dies
Patent number
11,239,158
Issue date
Feb 1, 2022
QUALCOMM Incorporated
Paragkumar Ajaybhai Thadesar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Perpendicular inductors integrated in a substrate
Patent number
11,011,461
Issue date
May 18, 2021
QUALCOMM Incorporated
Shu Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuits (ICs) on a glass substrate
Patent number
10,903,240
Issue date
Jan 26, 2021
QUALCOMM Incorporated
Shiqun Gu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conformal shielding for solder ball array
Patent number
10,879,191
Issue date
Dec 29, 2020
QUALCOMM Incorporated
Daniel Daeik Kim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor assembly and method of making same
Patent number
10,319,694
Issue date
Jun 11, 2019
QUALCOMM Incorporated
Daniel Daeik Kim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DIE EDGE PROTECTION TO ELIMINATE DIE CHIPPING
Publication number
20230352423
Publication date
Nov 2, 2023
QUALCOMM Incorporated
Sameer Sunil VADHAVKAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE FOR PASSIVE AND D...
Publication number
20230230910
Publication date
Jul 20, 2023
QUALCOMM Incorporated
Changhan Hobie YUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL-INSULATOR-METAL (MIM) CAPACITOR STRUCTURE FOR LAYER COUNT RED...
Publication number
20230187340
Publication date
Jun 15, 2023
QUALCOMM Incorporated
Nosun PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED PASSIVE DEVICES
Publication number
20230082743
Publication date
Mar 16, 2023
RF360 Europe GmbH
Changhan Hobie YUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP MODULES EMPLOYING CONDUCTIVE PILLARS TO COUPLE A PASSIVE COMPO...
Publication number
20220246552
Publication date
Aug 4, 2022
QUALCOMM Incorporated
Changhan Hobie YUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM IN PACKAGE (SIP) SOCKET CONNECTOR INTERFACE
Publication number
20220248541
Publication date
Aug 4, 2022
QUALCOMM Incorporated
Daniel Daeik KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAPACITANCE FINE TUNING BY FIN CAPACITOR DESIGN
Publication number
20220223516
Publication date
Jul 14, 2022
QUALCOMM Incorporated
Nosun PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TUNABLE CIRCUIT INCLUDING INTEGRATED FILTER CIRCUIT COUPLED TO VARI...
Publication number
20220123735
Publication date
Apr 21, 2022
QUALCOMM Incorporated
Changhan Hobie Yun
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
PACKAGE COMPRISING AN INTEGRATED PASSIVE DEVICE CONFIGURED AS A CAP...
Publication number
20220069193
Publication date
Mar 3, 2022
QUALCOMM Incorporated
Changhan Hobie YUN
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
DEVICE, PACKAGE AND/OR SUBSTRATE COMPRISING CURVED ANTENNA
Publication number
20220069453
Publication date
Mar 3, 2022
QUALCOMM Incorporated
Changhan Hobie YUN
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
PARTIAL COMPONENT EMBEDDING IN A SUBSTRATE
Publication number
20210375732
Publication date
Dec 2, 2021
QUALCOMM Incorporated
Paragkumar Ajaybhai THADESAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE COMPRISING CAPACITOR CONFIGURED FOR POWER AMPLIFIER OUTPU...
Publication number
20210351750
Publication date
Nov 11, 2021
QUALCOMM Incorporated
Daniel Daeik KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SHIELDING FOR A LAMINATE INDUCTOR COIL
Publication number
20210249177
Publication date
Aug 12, 2021
QUALCOMM Incorporated
Chunhu ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONFORMAL SHIELDING FOR SOLDER BALL ARRAY
Publication number
20200219822
Publication date
Jul 9, 2020
QUALCOMM Incorporated
Daniel Daeik KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RF DAMPING STRUCTURE IN INDUCTIVE DEVICE
Publication number
20200020474
Publication date
Jan 16, 2020
QUALCOMM Incorporated
Daniel Daeik Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUITS (ICS) ON A GLASS SUBSTRATE
Publication number
20190259780
Publication date
Aug 22, 2019
Qualcomm Incorporated
Shiqun GU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PERPENDICULAR INDUCTORS INTEGRATED IN A SUBSTRATE
Publication number
20190252316
Publication date
Aug 15, 2019
QUALCOMM Incorporated
Shu ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED VERTICAL INDUCTOR IN LAMINATE STACKED SUBSTRATES
Publication number
20190189327
Publication date
Jun 20, 2019
QUALCOMM Incorporated
Daniel Daeik Kim
H04 - ELECTRIC COMMUNICATION TECHNIQUE