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Daniel Giesecke
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West Chicago, IL, US
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Patents Grants
last 30 patents
Information
Patent Grant
Embedded circuit in a MEMS device
Patent number
9,485,560
Issue date
Nov 1, 2016
Knowles Electronics, LLC
Sandra F. Vos
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Microphone assembly with barrier to prevent contaminant infiltration
Patent number
9,479,854
Issue date
Oct 25, 2016
Knowles Electronics, LLC
Peter V. Loeppert
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Microphone assembly with barrier to prevent contaminant infiltration
Patent number
9,078,063
Issue date
Jul 7, 2015
Knowles Electronics, LLC
Peter V. Loeppert
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Embedded circuit in a MEMS device
Patent number
8,995,694
Issue date
Mar 31, 2015
Knowles Electronics, LLC
Sandra F. Vos
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
Information
Patent Application
ACOUSTIC ASSEMBLY HAVING AN ACOUSTICALLY PERMEABLE MEMBRANE
Publication number
20190335262
Publication date
Oct 31, 2019
KNOWLES ELECTRONICS, LLC
John Szczech
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Microphone Assembly With Barrier To Prevent Contaminant Infiltration
Publication number
20150304753
Publication date
Oct 22, 2015
KNOWLES ELECTRONICS, LLC
Peter V. Loeppert
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
Embedded Circuit In A MEMS Device
Publication number
20150251898
Publication date
Sep 10, 2015
KNOWLES ELECTRONICS, LLC
Sandra F. Vos
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Microphone Assembly With Barrier To Prevent Contaminant Infiltration
Publication number
20140044297
Publication date
Feb 13, 2014
KNOWLES ELECTRONICS, LLC
Peter V. Loeppert
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
EMBEDDED CIRCUIT IN A MEMS DEVICE
Publication number
20130193533
Publication date
Aug 1, 2013
KNOWLES ELECTRONICS, LLC
Sandra F. Vos
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Package With A CMOS Die Positioned Underneath A MEMS Die
Publication number
20120161259
Publication date
Jun 28, 2012
Peter V. Loeppert
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
PACKAGE WITH A CMOS DIE POSITIONED UNDERNEATH A MEMS DIE
Publication number
20120161258
Publication date
Jun 28, 2012
Peter V. Loeppert
H04 - ELECTRIC COMMUNICATION TECHNIQUE