Daniel Lee Revier

Person

Addison, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
3D printed semiconductor package
- Patent number 11,869,925
- Issue date Jan 9, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive process for circular printing of electronic devices
- Patent number 11,865,773
- Issue date Jan 9, 2024
- Texas Instruments Incorporated
- Daniel Lee Revier
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Thermally conductive wafer layer
- Patent number 11,854,933
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid metal MEMS switch
- Patent number 11,728,111
- Issue date Aug 15, 2023
- Texas Instruments Incorporated
- Adam Joseph Fruehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens cleaning via electrowetting
- Patent number 11,693,235
- Issue date Jul 4, 2023
- Texas Instruments Incorporated
- Daniel Lee Revier
- B08 - CLEANING
Information Patent Grant
Nanoparticle backside die adhesion layer
- Patent number 11,676,930
- Issue date Jun 13, 2023
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for electrostatic control of expelled materia...
- Patent number 11,607,704
- Issue date Mar 21, 2023
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- G02 - OPTICS
Information Patent Grant
Methods and apparatus for digital material deposition onto semicond...
- Patent number 11,487,206
- Issue date Nov 1, 2022
- Texas Instruments Incorporated
- Daniel Lee Revier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D printed semiconductor package
- Patent number 11,417,540
- Issue date Aug 16, 2022
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device substrate formed by additive process
- Patent number 11,404,270
- Issue date Aug 2, 2022
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoparticle matrix for backside heat spreading
- Patent number 11,355,414
- Issue date Jun 7, 2022
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded packaged antenna
- Patent number 11,271,296
- Issue date Mar 8, 2022
- Texas Instruments Incorporated
- Leon Stiborek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoparticle backside die adhesion layer
- Patent number 11,031,364
- Issue date Jun 8, 2021
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D printed semiconductor package
- Patent number 10,910,465
- Issue date Feb 2, 2021
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens cleaning via electrowetting
- Patent number 10,908,414
- Issue date Feb 2, 2021
- Texas Instruments Incorporated
- Daniel Lee Revier
- B08 - CLEANING
Information Patent Grant
Thermal management in integrated circuit using phononic bandgap str...
- Patent number 10,886,187
- Issue date Jan 5, 2021
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Semiconductor package with liquid metal conductors
- Patent number 10,879,151
- Issue date Dec 29, 2020
- Texas Instruments Incorporated
- Dishit Paresh Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D printed semiconductor package
- Patent number 10,861,715
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acoustic management in integrated circuit using phononic bandgap st...
- Patent number 10,833,648
- Issue date Nov 10, 2020
- Texas Instruments Incorporated
- Daniel Lee Revier
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Integrated circuit using photonic bandgap structure
- Patent number 10,788,367
- Issue date Sep 29, 2020
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- G01 - MEASURING TESTING
Information Patent Grant
Methods and apparatus for surface wetting control
- Patent number 10,780,467
- Issue date Sep 22, 2020
- Texas Instruments Incorporated
- Daniel Lee Revier
- G02 - OPTICS
Information Patent Grant
Integrated circuit package with stress directing material
- Patent number 10,622,270
- Issue date Apr 14, 2020
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spectrometry in integrated circuit using a photonic bandgap structure
- Patent number 10,557,754
- Issue date Feb 11, 2020
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- G01 - MEASURING TESTING
Information Patent Grant
Self-assembly of semiconductor die onto a leadframe using magnetic...
- Patent number 10,553,573
- Issue date Feb 4, 2020
- Texas Instruments Incorporated
- Daniel Lee Revier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic interference shield within integrated circuit encap...
- Patent number 10,497,651
- Issue date Dec 3, 2019
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Galvanic signal path isolation in an encapsulated package using a p...
- Patent number 10,444,432
- Issue date Oct 15, 2019
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- G02 - OPTICS
Information Patent Grant
Integrated circuit with dielectric waveguide connector using photon...
- Patent number 10,371,891
- Issue date Aug 6, 2019
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- G02 - OPTICS
Information Patent Grant
Methods and apparatus providing a graded package for a semiconductor
- Patent number 10,170,384
- Issue date Jan 1, 2019
- Texas Instruments Incorporated
- Daniel Lee Revier
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
THERMALLY CONDUCTIVE WAFER LAYER
- Publication number 20240153841
- Publication date May 9, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D PRINTED SEMICONDUCTOR PACKAGE
- Publication number 20240145526
- Publication date May 2, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVE PROCESS FOR CIRCULAR PRINTING
- Publication number 20240109247
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Daniel Lee Revier
- B22 - CASTING POWDER METALLURGY
Information Patent Application
LIQUID METAL MEMS SWITCH
- Publication number 20230335355
- Publication date Oct 19, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Adam Joseph Fruehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE SUBSTRATE FORMED BY ADDITIVE PROCESS
- Publication number 20220336217
- Publication date Oct 20, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE WAFER LAYER
- Publication number 20220208640
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOPARTICLE BACKSIDE DIE ADHESION LAYER
- Publication number 20210265299
- Publication date Aug 26, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR DIGITAL MATERIAL DEPOSITION ONTO SEMICOND...
- Publication number 20210200094
- Publication date Jul 1, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Daniel Lee Revier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LENS CLEANING VIA ELECTROWETTING
- Publication number 20210157130
- Publication date May 27, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Daniel Lee REVIER
- B08 - CLEANING
Information Patent Application
3D PRINTED SEMICONDUCTOR PACKAGE
- Publication number 20210151551
- Publication date May 20, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Management in Integrated Circuit Using Phononic Bandgap Str...
- Publication number 20210151357
- Publication date May 20, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVE PROCESS FOR CIRCULAR PRINTING
- Publication number 20210138727
- Publication date May 13, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Daniel Lee Revier
- B22 - CASTING POWDER METALLURGY
Information Patent Application
NANOPARTICLE MATRIX FOR BACKSIDE HEAT SPREADING
- Publication number 20210098331
- Publication date Apr 1, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D PRINTED SEMICONDUCTOR PACKAGE
- Publication number 20210090904
- Publication date Mar 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR SURFACE WETTING CONTROL
- Publication number 20200406316
- Publication date Dec 31, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Daniel Lee REVIER
- B08 - CLEANING
Information Patent Application
SEMICONDUCTOR PACKAGE WITH LIQUID METAL CONDUCTORS
- Publication number 20200211928
- Publication date Jul 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Dishit Paresh PAREKH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D PRINTED SEMICONDUCTOR PACKAGE
- Publication number 20200212166
- Publication date Jul 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D PRINTED SEMICONDUCTOR PACKAGE
- Publication number 20200211862
- Publication date Jul 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL MEMS SWITCH
- Publication number 20200211798
- Publication date Jul 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Adam Joseph Fruehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE SUBSTRATE FORMED BY ADDITIVE PROCESS
- Publication number 20200176251
- Publication date Jun 4, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT USING PHOTONIC BANDGAP STRUCTURE
- Publication number 20200141800
- Publication date May 7, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- G02 - OPTICS
Information Patent Application
NANOPARTICLE BACKSIDE DIE ADHESION LAYER
- Publication number 20190279955
- Publication date Sep 12, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVE PHOTONIC INTERCONNECTS IN MICROELECTRONIC DEVICE
- Publication number 20190204505
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- G02 - OPTICS
Information Patent Application
MOLDED PACKAGED ANTENNA
- Publication number 20190148823
- Publication date May 16, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Leon STIBOREK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electromagnetic Interference Shield within Integrated Circuit Encap...
- Publication number 20190131250
- Publication date May 2, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spectrometry in Integrated Circuit Using a Photonic Bandgap Structure
- Publication number 20190128735
- Publication date May 2, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- G02 - OPTICS
Information Patent Application
Integrated Circuit with Dielectric Waveguide Connector Using Photon...
- Publication number 20190131196
- Publication date May 2, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Galvanic Signal Path Isolation in an Encapsulated Package Using a P...
- Publication number 20190131682
- Publication date May 2, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Management in Integrated Circuit Using Phononic Bandgap Str...
- Publication number 20190122947
- Publication date Apr 25, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
Acoustic Management in Integrated Circuit Using Phononic Bandgap St...
- Publication number 20190123711
- Publication date Apr 25, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Daniel Lee Revier
- G01 - MEASURING TESTING

Daniel Lee Revier

Person

Patents Grantslast 30 patents

3D printed semiconductor package

Additive process for circular printing of electronic devices

Thermally conductive wafer layer

Liquid metal MEMS switch

Lens cleaning via electrowetting

Nanoparticle backside die adhesion layer

Methods and apparatus for electrostatic control of expelled materia...

Methods and apparatus for digital material deposition onto semicond...

3D printed semiconductor package

Microelectronic device substrate formed by additive process

Nanoparticle matrix for backside heat spreading

Molded packaged antenna

Nanoparticle backside die adhesion layer

3D printed semiconductor package

Lens cleaning via electrowetting

Thermal management in integrated circuit using phononic bandgap str...

Semiconductor package with liquid metal conductors

3D printed semiconductor package

Acoustic management in integrated circuit using phononic bandgap st...

Integrated circuit using photonic bandgap structure

Methods and apparatus for surface wetting control

Integrated circuit package with stress directing material

Spectrometry in integrated circuit using a photonic bandgap structure

Self-assembly of semiconductor die onto a leadframe using magnetic...

Electromagnetic interference shield within integrated circuit encap...

Galvanic signal path isolation in an encapsulated package using a p...

Integrated circuit with dielectric waveguide connector using photon...

Methods and apparatus providing a graded package for a semiconductor

Patents Applicationslast 30 patents

THERMALLY CONDUCTIVE WAFER LAYER

3D PRINTED SEMICONDUCTOR PACKAGE

ADDITIVE PROCESS FOR CIRCULAR PRINTING

LIQUID METAL MEMS SWITCH

MICROELECTRONIC DEVICE SUBSTRATE FORMED BY ADDITIVE PROCESS

THERMALLY CONDUCTIVE WAFER LAYER

NANOPARTICLE BACKSIDE DIE ADHESION LAYER

METHODS AND APPARATUS FOR DIGITAL MATERIAL DEPOSITION ONTO SEMICOND...

LENS CLEANING VIA ELECTROWETTING

3D PRINTED SEMICONDUCTOR PACKAGE

Thermal Management in Integrated Circuit Using Phononic Bandgap Str...

ADDITIVE PROCESS FOR CIRCULAR PRINTING

NANOPARTICLE MATRIX FOR BACKSIDE HEAT SPREADING

3D PRINTED SEMICONDUCTOR PACKAGE

METHODS AND APPARATUS FOR SURFACE WETTING CONTROL

SEMICONDUCTOR PACKAGE WITH LIQUID METAL CONDUCTORS

3D PRINTED SEMICONDUCTOR PACKAGE

3D PRINTED SEMICONDUCTOR PACKAGE

LIQUID METAL MEMS SWITCH

MICROELECTRONIC DEVICE SUBSTRATE FORMED BY ADDITIVE PROCESS

INTEGRATED CIRCUIT USING PHOTONIC BANDGAP STRUCTURE

NANOPARTICLE BACKSIDE DIE ADHESION LAYER

ADDITIVE PHOTONIC INTERCONNECTS IN MICROELECTRONIC DEVICE

MOLDED PACKAGED ANTENNA

Electromagnetic Interference Shield within Integrated Circuit Encap...

Spectrometry in Integrated Circuit Using a Photonic Bandgap Structure

Integrated Circuit with Dielectric Waveguide Connector Using Photon...

Galvanic Signal Path Isolation in an Encapsulated Package Using a P...

Thermal Management in Integrated Circuit Using Phononic Bandgap Str...

Acoustic Management in Integrated Circuit Using Phononic Bandgap St...