Daniel P. Cram

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interfaces having a plurality of connector assemblies
- Patent number 8,749,261
- Issue date Jun 10, 2014
- Micron Technology, Inc.
- Scott Hoagland
- G01 - MEASURING TESTING
Information Patent Grant
Isolation circuit
- Patent number 8,624,615
- Issue date Jan 7, 2014
- Micron Technology, Inc.
- Hani S. Attalla
- G01 - MEASURING TESTING
Information Patent Grant
Methods of providing semiconductor components within sockets
- Patent number 8,074,353
- Issue date Dec 13, 2011
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and methods for testing microelectronic devices
- Patent number 8,063,646
- Issue date Nov 22, 2011
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Grant
Methods of providing semiconductor components within sockets
- Patent number 8,011,092
- Issue date Sep 6, 2011
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Grant
Isolation circuit
- Patent number 8,004,297
- Issue date Aug 23, 2011
- Micron Technology, Inc.
- Hani S. Attalla
- G01 - MEASURING TESTING
Information Patent Grant
Methods for placing substrates in contact with molten solder
- Patent number 7,918,383
- Issue date Apr 5, 2011
- Micron Technology, Inc.
- Kyle K. Kirby
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical testing apparatus having masked sockets and associated s...
- Patent number 7,857,646
- Issue date Dec 28, 2010
- Micron Technology, Inc.
- A. Jay Stutzman
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for testing packaged microelectronic devices
- Patent number 7,692,437
- Issue date Apr 6, 2010
- Micron Technology, Inc.
- A. Jay Stutzman
- G01 - MEASURING TESTING
Information Patent Grant
Methods of retaining semiconductor component configurations within...
- Patent number 7,586,319
- Issue date Sep 8, 2009
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Grant
Resilient contact probes
- Patent number 7,570,069
- Issue date Aug 4, 2009
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Grant
Isolation circuit
- Patent number 7,541,825
- Issue date Jun 2, 2009
- Micron Technology, Inc.
- Hani S. Attalla
- G01 - MEASURING TESTING
Information Patent Grant
Systems configured for utilizing semiconductor components
- Patent number 7,514,945
- Issue date Apr 7, 2009
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Grant
Electronic component assemblies with electrically conductive bonds
- Patent number 7,456,504
- Issue date Nov 25, 2008
- Micron Technology, Inc.
- Steven L. Hamren
- G01 - MEASURING TESTING
Information Patent Grant
Methods of providing semiconductor components within sockets
- Patent number 7,439,752
- Issue date Oct 21, 2008
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Grant
Resilient contact probe apparatus
- Patent number 7,427,869
- Issue date Sep 23, 2008
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for testing packaged microelectronic devices
- Patent number 7,425,839
- Issue date Sep 16, 2008
- Micron Technology, Inc.
- A. Jay Stutzman
- G01 - MEASURING TESTING
Information Patent Grant
Test method for electronic modules using movable test contactors
- Patent number 7,279,915
- Issue date Oct 9, 2007
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Grant
Contact system for interfacing a semiconductor wafer to an electric...
- Patent number 7,274,197
- Issue date Sep 25, 2007
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Grant
Test method for semiconductor components using anisotropic conducti...
- Patent number 7,265,563
- Issue date Sep 4, 2007
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Grant
Contact system for wafer level testing
- Patent number 7,176,702
- Issue date Feb 13, 2007
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Grant
Methods for processing semiconductor devices in a singulated form
- Patent number 7,135,345
- Issue date Nov 14, 2006
- Micron Technology, Inc.
- Steven L. Hamren
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for processing semiconductor devices in a sing...
- Patent number 7,129,721
- Issue date Oct 31, 2006
- Steven L. Hamren
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for processing semiconductor devices in a singulated form
- Patent number 7,126,228
- Issue date Oct 24, 2006
- Micron Technology, Inc.
- Steven L. Hamren
- G01 - MEASURING TESTING
Information Patent Grant
Test method for electronic modules
- Patent number 7,123,036
- Issue date Oct 17, 2006
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Grant
Pinch-style support contact, method of enabling electrical communic...
- Patent number 7,121,860
- Issue date Oct 17, 2006
- Micron Technology, Inc.
- Daniel P. Cram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing semiconductor devices in a singulated form
- Patent number 7,122,389
- Issue date Oct 17, 2006
- Micron Technology, Inc.
- Steven L. Hamren
- G01 - MEASURING TESTING
Information Patent Grant
Test socket and test system for semiconductor components with easil...
- Patent number 7,114,976
- Issue date Oct 3, 2006
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for deforming resilient contact structures on semiconduct...
- Patent number 7,093,622
- Issue date Aug 22, 2006
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Grant
System and apparatus for testing packaged devices and related methods
- Patent number 7,043,388
- Issue date May 9, 2006
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
THERMAL CONDUCTION BASED BATCH TESTING SYSTEM
- Publication number 20240194281
- Publication date Jun 13, 2024
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Application
INTERFACE
- Publication number 20120206159
- Publication date Aug 16, 2012
- Micron Technology, Inc.
- Scott Hoagland
- G01 - MEASURING TESTING
Information Patent Application
ISOLATION CIRCUIT
- Publication number 20120001680
- Publication date Jan 5, 2012
- Micron Technology, Inc.
- Hani S. Attalla
- G01 - MEASURING TESTING
Information Patent Application
ELECTRICAL TESTING APPARATUS HAVING MASKED SOCKETS AND ASSOCIATED S...
- Publication number 20090273359
- Publication date Nov 5, 2009
- Micron Technology, Inc.
- A. Jay Stutzman
- G01 - MEASURING TESTING
Information Patent Application
ISOLATION CIRCUIT
- Publication number 20090212810
- Publication date Aug 27, 2009
- Micron Technology, Inc.
- Hani S. Attalla
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR TESTING PACKAGED MICROELECTRONIC DEVICES
- Publication number 20090009199
- Publication date Jan 8, 2009
- Micron Technology, Inc.
- A. Jay Stutzman
- G01 - MEASURING TESTING
Information Patent Application
Methods of Retaining Semiconductor Component Configurations within...
- Publication number 20090009202
- Publication date Jan 8, 2009
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Application
Methods of Providing Semiconductor Components within Sockets
- Publication number 20090007423
- Publication date Jan 8, 2009
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Application
Methods of Providing Semiconductor Components within Sockets
- Publication number 20090000116
- Publication date Jan 1, 2009
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Application
Isolation circuit
- Publication number 20080191728
- Publication date Aug 14, 2008
- Micron Technology, Inc.
- Hani S. Attalla
- G01 - MEASURING TESTING
Information Patent Application
Systems Configured for Utilizing Two or More Multiple Different Sem...
- Publication number 20080088329
- Publication date Apr 17, 2008
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Application
Apparatus and methods for testing microelectronic devices
- Publication number 20080048704
- Publication date Feb 28, 2008
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Application
Systems and methods for testing packaged microelectronic devices
- Publication number 20080048694
- Publication date Feb 28, 2008
- Micron Technology, Inc.
- A. Jay Stutzman
- G01 - MEASURING TESTING
Information Patent Application
METHODS FOR PLACING SUBSTRATES IN CONTACT WITH MOLTEN SOLDER
- Publication number 20080011815
- Publication date Jan 17, 2008
- Micron Technology, Inc.
- Kyle K. Kirby
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Systems configured for utilizing two or more of multiple different...
- Publication number 20070257688
- Publication date Nov 8, 2007
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Application
Method for testing electronic modules using board with test contact...
- Publication number 20070159188
- Publication date Jul 12, 2007
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Application
Methods for processing semiconductor devices in a singulated form
- Publication number 20070155029
- Publication date Jul 5, 2007
- Steven L. Hamren
- G01 - MEASURING TESTING
Information Patent Application
Integrated circuit package testing devices and methods of making an...
- Publication number 20070126445
- Publication date Jun 7, 2007
- Micron Technology, Inc.
- Amos Jay Stutzman
- G01 - MEASURING TESTING
Information Patent Application
Contact System for Wafer Level Testing
- Publication number 20070080698
- Publication date Apr 12, 2007
- Micron Technology, Inc.
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Application
Resilient contact probe apparatus
- Publication number 20060261828
- Publication date Nov 23, 2006
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Application
Methods of making a resilient contact apparatus and resilient conta...
- Publication number 20060250151
- Publication date Nov 9, 2006
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Application
Bladder based package control/singulation
- Publication number 20060131134
- Publication date Jun 22, 2006
- Daniel P. Cram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods and apparatus for placing substrates in contact with molten...
- Publication number 20060043154
- Publication date Mar 2, 2006
- Kyle K. Kirby
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pinch-style support contact, method of enabling electrical communic...
- Publication number 20060046554
- Publication date Mar 2, 2006
- Daniel P. Cram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of making a resilient contact apparatus and resilient conta...
- Publication number 20060043988
- Publication date Mar 2, 2006
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Application
Test socket, test system and test method for semiconductor componen...
- Publication number 20060012389
- Publication date Jan 19, 2006
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Application
Test method for electronic modules using movable test contactors
- Publication number 20050280430
- Publication date Dec 22, 2005
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Application
Resilient contact probe apparatus, methods of using and making, and...
- Publication number 20050253602
- Publication date Nov 17, 2005
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Application
Test method for semiconductor components using anisotropic conducti...
- Publication number 20050253610
- Publication date Nov 17, 2005
- Daniel P. Cram
- G01 - MEASURING TESTING
Information Patent Application
Contact system for wafer level testing
- Publication number 20050225337
- Publication date Oct 13, 2005
- Daniel P. Cram
- G01 - MEASURING TESTING

Daniel P. Cram

Person

Patents Grantslast 30 patents

Interfaces having a plurality of connector assemblies

Isolation circuit

Methods of providing semiconductor components within sockets

Apparatus and methods for testing microelectronic devices

Methods of providing semiconductor components within sockets

Isolation circuit

Methods for placing substrates in contact with molten solder

Electrical testing apparatus having masked sockets and associated s...

Systems and methods for testing packaged microelectronic devices

Methods of retaining semiconductor component configurations within...

Resilient contact probes

Isolation circuit

Systems configured for utilizing semiconductor components

Electronic component assemblies with electrically conductive bonds

Methods of providing semiconductor components within sockets

Resilient contact probe apparatus

Systems and methods for testing packaged microelectronic devices

Test method for electronic modules using movable test contactors

Contact system for interfacing a semiconductor wafer to an electric...

Test method for semiconductor components using anisotropic conducti...

Contact system for wafer level testing

Methods for processing semiconductor devices in a singulated form

Method and apparatus for processing semiconductor devices in a sing...

Apparatus for processing semiconductor devices in a singulated form

Test method for electronic modules

Pinch-style support contact, method of enabling electrical communic...

Method for processing semiconductor devices in a singulated form

Test socket and test system for semiconductor components with easil...

Apparatus for deforming resilient contact structures on semiconduct...

System and apparatus for testing packaged devices and related methods

Patents Applicationslast 30 patents

THERMAL CONDUCTION BASED BATCH TESTING SYSTEM

INTERFACE

ISOLATION CIRCUIT

ELECTRICAL TESTING APPARATUS HAVING MASKED SOCKETS AND ASSOCIATED S...

ISOLATION CIRCUIT

SYSTEMS AND METHODS FOR TESTING PACKAGED MICROELECTRONIC DEVICES

Methods of Retaining Semiconductor Component Configurations within...

Methods of Providing Semiconductor Components within Sockets

Methods of Providing Semiconductor Components within Sockets

Isolation circuit

Systems Configured for Utilizing Two or More Multiple Different Sem...

Apparatus and methods for testing microelectronic devices

Systems and methods for testing packaged microelectronic devices

METHODS FOR PLACING SUBSTRATES IN CONTACT WITH MOLTEN SOLDER

Systems configured for utilizing two or more of multiple different...

Method for testing electronic modules using board with test contact...

Methods for processing semiconductor devices in a singulated form

Integrated circuit package testing devices and methods of making an...

Contact System for Wafer Level Testing

Resilient contact probe apparatus

Methods of making a resilient contact apparatus and resilient conta...

Bladder based package control/singulation

Methods and apparatus for placing substrates in contact with molten...

Pinch-style support contact, method of enabling electrical communic...

Methods of making a resilient contact apparatus and resilient conta...

Test socket, test system and test method for semiconductor componen...

Test method for electronic modules using movable test contactors

Resilient contact probe apparatus, methods of using and making, and...

Test method for semiconductor components using anisotropic conducti...

Contact system for wafer level testing