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Danny Vallejo Retuta
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Singapore, SG
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Patents Grants
last 30 patents
Information
Patent Grant
Method of producing a semiconductor package
Patent number
9,281,218
Issue date
Mar 8, 2016
United Test & Assembly Center Ltd.
Danny Retuta
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Thermally enhanced semiconductor package and method of producing th...
Patent number
8,039,951
Issue date
Oct 18, 2011
United Test & Assembly Center Ltd.
Kolan Ravi Kanth
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe enhancement and method of producing a multi-row semicondu...
Patent number
7,476,569
Issue date
Jan 13, 2009
United Test & Assembly Center Ltd.
Danny Vallejo Retuta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe enhancement and method of producing a multi-row semicondu...
Patent number
7,375,416
Issue date
May 20, 2008
United Test & Assembly Center Ltd.
Danny Vallejo Retuta
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF PRODUCING A SEMICONDUCTOR PACKAGE
Publication number
20160211196
Publication date
Jul 21, 2016
United Test & Assembly Center Ltd.
Danny RETUTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR STRUCTURE
Publication number
20090236726
Publication date
Sep 24, 2009
United Test & Assembly Center Ltd.
Danny RETUTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADFRAME ENHANCEMENT AND METHOD OF PRODUCING A MULTI-ROW SEMICONDU...
Publication number
20080199985
Publication date
Aug 21, 2008
UNITED TEST AND ASSEMBLY CENTER LTD.
Danny Vallejo Retuta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Producing a Semiconductor Package
Publication number
20080061414
Publication date
Mar 13, 2008
United Test & Assembly Center Ltd.
Danny RETUTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Leadframe enhancement and method of producing a multi-row semicondu...
Publication number
20070246810
Publication date
Oct 25, 2007
UNITED TEST AND ASSEMBLY TEST CENTER LTD.
Danny Vallejo Retuta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thermally enhanced semiconductor package and method of producing th...
Publication number
20070164425
Publication date
Jul 19, 2007
UNITED TEST AND ASSEMBLY CENTER LTD.
Ravi Kanth Kolan
H01 - BASIC ELECTRIC ELEMENTS