Daoqiang Lu

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Photo-curable liquid optically clear adhesive composition and the u...
- Patent number 11,566,151
- Issue date Jan 31, 2023
- Henkel AG & Co. KGaA
- Hongyu Wang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Photo-curable adhesive composition, preparation and use thereof
- Patent number 10,717,907
- Issue date Jul 21, 2020
- Henkel AG & Co. KGaA
- Hongyu Wang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for binding substrates with a liquid optically clear photo-...
- Patent number 10,093,837
- Issue date Oct 9, 2018
- Henkel AG & Co. KGaA
- Daoqiang Lu
- G02 - OPTICS
Information Patent Grant
Optical transparent dual cure adhesives composition
- Patent number 9,708,518
- Issue date Jul 18, 2017
- Henkel AG & Co. KGaA
- Rui Zhang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Photocurable adhesive composition and use of the same
- Patent number 9,663,685
- Issue date May 30, 2017
- Henkel IP & Holding GmbH
- James Wang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Microelectronic package having direct contact heat spreader and met...
- Patent number 9,508,675
- Issue date Nov 29, 2016
- Intel Corporation
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates using a UV radiation curing-redox cur...
- Patent number 9,039,852
- Issue date May 26, 2015
- Henkel IP & Holding GmbH
- Shabbir Attarwala
- B32 - LAYERED PRODUCTS
Information Patent Grant
Heat spreader as mechanical reinforcement for ultra-thin die
- Patent number 8,642,386
- Issue date Feb 4, 2014
- Intel Corporation
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package having direct contact heat spreader and met...
- Patent number 8,541,876
- Issue date Sep 24, 2013
- Intel Corporation
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting an optical device
- Patent number 8,230,589
- Issue date Jul 31, 2012
- Intel Corporation
- Daoqiang Lu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor wafer coat layers and methods therefor
- Patent number 8,193,072
- Issue date Jun 5, 2012
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip assembly with optically coupled die
- Patent number 8,189,361
- Issue date May 29, 2012
- Intel Corporation
- Qing A. Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming compliant contact pads for semiconductor packages
- Patent number 8,148,805
- Issue date Apr 3, 2012
- Intel Corporation
- Qing Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat spreader as mechanical reinforcement for ultra-thin die
- Patent number 8,063,482
- Issue date Nov 22, 2011
- Intel Corporation
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated micro-channels for 3D through silicon architectures
- Patent number 8,012,808
- Issue date Sep 6, 2011
- Intel Corporation
- Wei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with raised edge pads
- Patent number 7,980,865
- Issue date Jul 19, 2011
- Intel Corporation
- Wei Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically pluggable optical interconnect
- Patent number 7,945,127
- Issue date May 17, 2011
- Intel Corporation
- Daoqiang Lu
- G02 - OPTICS
Information Patent Grant
Forming compliant contact pads for semiconductor packages
- Patent number 7,939,922
- Issue date May 10, 2011
- Intel Corporation
- Qing Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wafer coat layers and methods therefor
- Patent number 7,897,486
- Issue date Mar 1, 2011
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip assembly with optically coupled die
- Patent number 7,851,809
- Issue date Dec 14, 2010
- Intel Corporation
- Qing A. Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-volume on-wafer heterogeneous packaging of optical interconnects
- Patent number 7,767,486
- Issue date Aug 3, 2010
- Intel Corporation
- Mohammed Edris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual heat spreader panel assembly method for bumpless die-attach pa...
- Patent number 7,723,164
- Issue date May 25, 2010
- Intel Corporation
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer based optical interconnect
- Patent number 7,720,337
- Issue date May 18, 2010
- Intel Corporation
- Daoqiang Lu
- G02 - OPTICS
Information Patent Grant
Diamond substrate formation for electronic assemblies
- Patent number 7,713,839
- Issue date May 11, 2010
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with lossy material insert
- Patent number 7,714,430
- Issue date May 11, 2010
- Intel Corporation
- Xiang Yin Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip mountable optical connector for chip-to-chip optical inte...
- Patent number 7,703,991
- Issue date Apr 27, 2010
- Intel Corporation
- Daoqiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assemblies having a low processing temperature
- Patent number 7,682,876
- Issue date Mar 23, 2010
- Intel Corporation
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus to mount a waveguide to a substrate
- Patent number 7,684,660
- Issue date Mar 23, 2010
- Intel Corporation
- Henning Braunisch
- G02 - OPTICS
Information Patent Grant
Die warpage control
- Patent number 7,675,182
- Issue date Mar 9, 2010
- Intel Corporation
- Hai Xiao Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die molded substrate integrated circuit device
- Patent number 7,670,866
- Issue date Mar 2, 2010
- Intel Corporation
- Haixiao Sun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PHOTO-CURABLE ADHESIVE COMPOSITION, PREPARATION AND USE THEREOF
- Publication number 20170253780
- Publication date Sep 7, 2017
- Henkel AG & Co. KGaA
- Hongyu Wang
- B32 - LAYERED PRODUCTS
Information Patent Application
PHOTO-CURABLE LIQUID OPTICALLY CLEAR ADHESIVE COMPOSITION AND THE U...
- Publication number 20170121562
- Publication date May 4, 2017
- Henkel AG & Co. KGaA
- Hongyu Wang
- B32 - LAYERED PRODUCTS
Information Patent Application
Optical Transparent Dual Cure Adhesives Composition
- Publication number 20160024357
- Publication date Jan 28, 2016
- Henkel (China) Company Limited
- Rui Zhang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LIQUID OPTICALLY CLEAR PHOTO-CURABLE ADHESIVE FOR DISPLAY APPLICATION
- Publication number 20150166860
- Publication date Jun 18, 2015
- Henkel (China) Co. Ltd.
- Yinxiao Yuan
- B32 - LAYERED PRODUCTS
Information Patent Application
OPTICAL TRANSPARENT DUAL CURE ADHESIVES COMPOSITION
- Publication number 20150159059
- Publication date Jun 11, 2015
- Henkel (China) Company Limited
- Rui Zhang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
OPTICAL TRANSPARENT DUAL CORE ADHESIVES COMPOSITION
- Publication number 20140163130
- Publication date Jun 12, 2014
- Rui Zhang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION
- Publication number 20140142210
- Publication date May 22, 2014
- Raymond Zhang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR BONDING SUBSTRATES USING A UV RADIATION CURING-REDOX CUR...
- Publication number 20140138013
- Publication date May 22, 2014
- Shabbir Attarawala
- B32 - LAYERED PRODUCTS
Information Patent Application
PHOTOCURABLE ADHESIVE COMPOSITION AND USE OF THE SAME
- Publication number 20140131306
- Publication date May 15, 2014
- James Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MICROELECTRONIC PACKAGE HAVING DIRECT CONTACT HEAT SPREADER AND MET...
- Publication number 20130344659
- Publication date Dec 26, 2013
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER AS MECHANICAL REINFORCEMENT FOR ULTRA-THIN DIE
- Publication number 20110294264
- Publication date Dec 1, 2011
- Intel Corporation
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate With Raised Edge Pads
- Publication number 20110239454
- Publication date Oct 6, 2011
- Wei Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Forming Compliant Contact Pads for Semiconductor Packages
- Publication number 20110175230
- Publication date Jul 21, 2011
- Qing Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR WAFER COAT LAYERS AND METHODS THEREFOR
- Publication number 20110059596
- Publication date Mar 10, 2011
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP ASSEMBLY WITH OPTICALLY COUPLED DIE
- Publication number 20110058419
- Publication date Mar 10, 2011
- Qing A. Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, APPARATUS, AND SYSTEM FOR THIN DIE THIN THERMAL INTERFACE M...
- Publication number 20100246138
- Publication date Sep 30, 2010
- Wei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip assembly with optically coupled die
- Publication number 20090250707
- Publication date Oct 8, 2009
- Qing A. Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE
- Publication number 20090244873
- Publication date Oct 1, 2009
- Intel Corporation
- Daoqiang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Compliant Contact Pads For Semiconductor Packages
- Publication number 20090200681
- Publication date Aug 13, 2009
- Qing Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED MICRO-CHANNELS FOR 3D THROUGH SILICON ARCHITECTURES
- Publication number 20090201643
- Publication date Aug 13, 2009
- Wei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer based optical interconnect
- Publication number 20090162005
- Publication date Jun 25, 2009
- Daoqiang Lu
- G02 - OPTICS
Information Patent Application
HIGH-VOLUME ON-WAFER HETEROGENEOUS PACKAGING OF OPTICAL INTERCONNECTS
- Publication number 20090129422
- Publication date May 21, 2009
- Mohammed Edris
- G02 - OPTICS
Information Patent Application
Method of Making a Microelectronic Package Using an IHS Stiffener
- Publication number 20090087949
- Publication date Apr 2, 2009
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE WARPAGE CONTROL
- Publication number 20090085228
- Publication date Apr 2, 2009
- Haixiao Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A THIN TIM CORELESS HIGH DENSITY BUMP-LESS PACKA...
- Publication number 20090079064
- Publication date Mar 26, 2009
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically pluggable optical interconnect
- Publication number 20090074350
- Publication date Mar 19, 2009
- Daoqiang Lu
- G02 - OPTICS
Information Patent Application
WAFER-LEVEL ASSEMBLY OF HEAT SPREADERS FOR DUAL IHS PACKAGES
- Publication number 20090034206
- Publication date Feb 5, 2009
- Intel Corporation
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE THERMAL INTERFACE MATERIALS
- Publication number 20090001556
- Publication date Jan 1, 2009
- Haixiao Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing input capacitance for high speed integrated circuits
- Publication number 20080316662
- Publication date Dec 25, 2008
- Xiang Yin Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE MOLDED SUBSTRATE INTEGRATED CIRCUIT DEVICE
- Publication number 20080277781
- Publication date Nov 13, 2008
- Haixiao SUN
- H01 - BASIC ELECTRIC ELEMENTS

Daoqiang Lu

Person

Patents Grantslast 30 patents

Photo-curable liquid optically clear adhesive composition and the u...

Photo-curable adhesive composition, preparation and use thereof

Process for binding substrates with a liquid optically clear photo-...

Optical transparent dual cure adhesives composition

Photocurable adhesive composition and use of the same

Microelectronic package having direct contact heat spreader and met...

Method for bonding substrates using a UV radiation curing-redox cur...

Heat spreader as mechanical reinforcement for ultra-thin die

Microelectronic package having direct contact heat spreader and met...

Method of mounting an optical device

Semiconductor wafer coat layers and methods therefor

Multi-chip assembly with optically coupled die

Forming compliant contact pads for semiconductor packages

Heat spreader as mechanical reinforcement for ultra-thin die

Integrated micro-channels for 3D through silicon architectures

Substrate with raised edge pads

Electrically pluggable optical interconnect

Forming compliant contact pads for semiconductor packages

Semiconductor wafer coat layers and methods therefor

Multi-chip assembly with optically coupled die

High-volume on-wafer heterogeneous packaging of optical interconnects

Dual heat spreader panel assembly method for bumpless die-attach pa...

Wafer based optical interconnect

Diamond substrate formation for electronic assemblies

Substrate with lossy material insert

Flip-chip mountable optical connector for chip-to-chip optical inte...

Electronic assemblies having a low processing temperature

Methods and apparatus to mount a waveguide to a substrate

Die warpage control

Multi-die molded substrate integrated circuit device

Patents Applicationslast 30 patents

PHOTO-CURABLE ADHESIVE COMPOSITION, PREPARATION AND USE THEREOF

PHOTO-CURABLE LIQUID OPTICALLY CLEAR ADHESIVE COMPOSITION AND THE U...

Optical Transparent Dual Cure Adhesives Composition

LIQUID OPTICALLY CLEAR PHOTO-CURABLE ADHESIVE FOR DISPLAY APPLICATION

OPTICAL TRANSPARENT DUAL CURE ADHESIVES COMPOSITION

OPTICAL TRANSPARENT DUAL CORE ADHESIVES COMPOSITION

ADHESIVE COMPOSITION

METHOD FOR BONDING SUBSTRATES USING A UV RADIATION CURING-REDOX CUR...

PHOTOCURABLE ADHESIVE COMPOSITION AND USE OF THE SAME

MICROELECTRONIC PACKAGE HAVING DIRECT CONTACT HEAT SPREADER AND MET...

HEAT SPREADER AS MECHANICAL REINFORCEMENT FOR ULTRA-THIN DIE

Substrate With Raised Edge Pads

Forming Compliant Contact Pads for Semiconductor Packages

SEMICONDUCTOR WAFER COAT LAYERS AND METHODS THEREFOR

MULTI-CHIP ASSEMBLY WITH OPTICALLY COUPLED DIE

METHOD, APPARATUS, AND SYSTEM FOR THIN DIE THIN THERMAL INTERFACE M...

Multi-chip assembly with optically coupled die

OPTICAL PACKAGE

Forming Compliant Contact Pads For Semiconductor Packages

INTEGRATED MICRO-CHANNELS FOR 3D THROUGH SILICON ARCHITECTURES

Wafer based optical interconnect

HIGH-VOLUME ON-WAFER HETEROGENEOUS PACKAGING OF OPTICAL INTERCONNECTS

Method of Making a Microelectronic Package Using an IHS Stiffener

DIE WARPAGE CONTROL

METHODS OF FORMING A THIN TIM CORELESS HIGH DENSITY BUMP-LESS PACKA...

Electrically pluggable optical interconnect

WAFER-LEVEL ASSEMBLY OF HEAT SPREADERS FOR DUAL IHS PACKAGES

LOW TEMPERATURE THERMAL INTERFACE MATERIALS

Reducing input capacitance for high speed integrated circuits

MULTI-DIE MOLDED SUBSTRATE INTEGRATED CIRCUIT DEVICE