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Darrel E. Peugh
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Kokomo, IN, US
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Patents Grants
last 30 patents
Information
Patent Grant
Fluid cooled electronic assembly
Patent number
7,551,439
Issue date
Jun 23, 2009
Delphi Technologies, Inc.
Darrel E. Peugh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor package having integral fluid cooling
Patent number
7,538,425
Issue date
May 26, 2009
Delphi Technologies, Inc.
Bruce A. Myers
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Fluid-cooled electronic system
Patent number
7,365,981
Issue date
Apr 29, 2008
Delphi Technologies, Inc.
Bruce A. Myers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated cooling system for electronic devices
Patent number
7,215,547
Issue date
May 8, 2007
Delphi Technologies, Inc.
Shih-Chia Chang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Power electronic system with passive cooling
Patent number
7,106,588
Issue date
Sep 12, 2006
Delphi Technologies, Inc.
Gary E. Oberlin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mutli-chip module
Patent number
6,833,628
Issue date
Dec 21, 2004
Delphi Technologies, Inc.
Scott D. Brandenburg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Corrosive resistant flip chip thermal management structure
Patent number
6,560,110
Issue date
May 6, 2003
Delphi Technologies, Inc.
Bruce A. Myers
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Combination circuit board and segmented conductive bus substrate
Patent number
6,535,396
Issue date
Mar 18, 2003
Delphi Technologies, Inc.
Thomas Alan Degenkolb
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flip chip on circuit board with enhanced heat dissipation and metho...
Patent number
6,156,980
Issue date
Dec 5, 2000
Delco Electronics Corp.
Darrel Eugene Peugh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of preventing solder reflow of electrical components during...
Patent number
6,045,032
Issue date
Apr 4, 2000
Delco Electronics Corp.
Stuart E Longgood
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Process for producing flip chip circuit board assembly exhibiting e...
Patent number
5,953,814
Issue date
Sep 21, 1999
Delco Electronics Corp.
Wayne Anthony Sozansky
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Transistor package with wafer level dielectric isolation
Publication number
20080290378
Publication date
Nov 27, 2008
Bruce A. Myers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fluid cooled electronic assembly
Publication number
20070230127
Publication date
Oct 4, 2007
Delphi Technologies, Inc.
Darrel E. Peugh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fluid-cooled electronic system
Publication number
20060291164
Publication date
Dec 28, 2006
Bruce A. Myers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated cooling system for electronic devices
Publication number
20060034052
Publication date
Feb 16, 2006
Shih-Chia Chang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Power semiconductor package having integral fluid cooling
Publication number
20060022334
Publication date
Feb 2, 2006
Bruce A. Myers
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multi-chip module
Publication number
20050093144
Publication date
May 5, 2005
DELPHI TECHNOLOGIES, INC.
Scott D. Brandenburg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Power electronic system with passive cooling
Publication number
20050088822
Publication date
Apr 28, 2005
Gary E. Oberlin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP MODULE AND METHOD OF FORMING
Publication number
20040113281
Publication date
Jun 17, 2004
Scott D. Brandenburg
H01 - BASIC ELECTRIC ELEMENTS